Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2003
12/31/2003CN2596552Y Heat exchanger
12/31/2003CN2596551Y New plate type perfoated radiating fin
12/31/2003CN2596550Y Radiator combination
12/31/2003CN2596549Y Radiator combination
12/31/2003CN2596548Y Fastener
12/31/2003CN2596547Y Semiconductor packaging structure with radiating fin
12/31/2003CN1465214A Circuit module
12/31/2003CN1465122A Optical semiconductor module and method of producing the same
12/31/2003CN1465102A 集成电路 IC
12/31/2003CN1465099A Power module and air conditioner
12/31/2003CN1465098A Semiconductor device and its manufacturing method
12/31/2003CN1465097A Integrated core microelectronic package
12/31/2003CN1465096A Heat sink and its manufacturing method
12/31/2003CN1465076A Method for producing nanocomposite magnet using atomizing method
12/31/2003CN1465075A Production method for conductive paste and production method for printed circuit board
12/31/2003CN1464554A Chip integrated circuit latch up protective circuit
12/31/2003CN1464553A Metal inner linking cable arrangement with local slot and process for making it
12/31/2003CN1464552A Semiconductor chips immission radiator fins clamping apparatus and radiator fins storage rack
12/31/2003CN1464551A Multi-chip packaging
12/31/2003CN1464357A A portable low-temperature coolant circulating machine
12/31/2003CN1464356A Refrigeration sheet heat dissipation assembly
12/31/2003CN1133240C 非圆形微通道 Non-circular microchannel
12/31/2003CN1133212C Semiconductor packed body for high frequency
12/31/2003CN1133209C Stacked via in copper/polyimide BEOL
12/31/2003CN1133207C Circuit board for screening detection and mfg. method of known qualified tube core
12/31/2003CN1133179C Method for providing low-resistance electric interface to current-limiting polymer through plasma treatment
12/30/2003US6671868 Method of creating MCM pinouts
12/30/2003US6671865 High density input output
12/30/2003US6671300 Optical devices
12/30/2003US6671205 Low voltage non-volatile memory cell
12/30/2003US6671177 Graphics card apparatus with improved heat dissipation
12/30/2003US6671176 Method of cooling heat-generating electrical components
12/30/2003US6671172 Electronic assemblies with high capacity curved fin heat sinks
12/30/2003US6671152 Power MOS transistor with overtemperature protection circuit
12/30/2003US6671147 Double-triggered electrostatic discharge protection circuit
12/30/2003US6670824 Integrated polysilicon fuse and diode
12/30/2003US6670719 Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture
12/30/2003US6670718 Wiring board utilizing a conductive member having a reduced thickness
12/30/2003US6670717 Structure and method for charge sensitive electrical devices
12/30/2003US6670715 Nitrogen-doped bottom of minimum thickness and oxygen-doped top layers; high performance and reliability
12/30/2003US6670714 Semiconductor integrated circuit device having multilevel interconnection
12/30/2003US6670712 Semiconductor device
12/30/2003US6670711 Semiconductor device including low dielectric constant insulating film formed on upper and side surfaces of the gate electrode
12/30/2003US6670710 Semiconductor device having multi-layered wiring
12/30/2003US6670709 Semiconductor device and method of manufacturing the same
12/30/2003US6670707 Integrated circuit chip
12/30/2003US6670706 Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same
12/30/2003US6670705 Protective layer for a semiconductor device
12/30/2003US6670704 Device for electronic packaging, pin jig fixture
12/30/2003US6670703 Buried ground plane for high performance system modules
12/30/2003US6670702 Stackable ball grid array package
12/30/2003US6670701 Semiconductor module and electronic component
12/30/2003US6670700 Interconnect substrate and semiconductor device electronic instrument
12/30/2003US6670699 Semiconductor device packaging structure
12/30/2003US6670698 Integrated circuit package mounting
12/30/2003US6670696 Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof
12/30/2003US6670693 Laser synthesized wide-bandgap semiconductor electronic devices and circuits
12/30/2003US6670692 Semiconductor chip with partially embedded decoupling capacitors
12/30/2003US6670687 Semiconductor device having silicon carbide layer of predetermined conductivity type and module device having the same
12/30/2003US6670686 Integrated sound transmitter and receiver, and corresponding method for making same
12/30/2003US6670684 Semiconductor device having line-and-space pattern group
12/30/2003US6670679 Semiconductor device having an ESD protective circuit
12/30/2003US6670678 Semiconductor device having ESD protective transistor
12/30/2003US6670677 SOI substrate having an etch stop layer and an SOI integrated circuit fabricated thereon
12/30/2003US6670676 Hot socket soft pull for ESD devices
12/30/2003US6670639 Copper interconnection
12/30/2003US6670634 Silicon carbide interconnect for semiconductor components
12/30/2003US6670551 Image sensing component package and manufacture method thereof
12/30/2003US6670550 Underfill coating for LOC package
12/30/2003US6670430 Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes
12/30/2003US6670285 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials
12/30/2003US6670284 Method of decontaminating process chambers, methods of reducing defects in anti-reflective coatings, and resulting semiconductor structures
12/30/2003US6670267 Formation of tungstein-based interconnect using thin physically vapor deposited titanium nitride layer
12/30/2003US6670238 Method and structure for reducing contact aspect ratios
12/30/2003US6670237 Method for an advanced MIM capacitor
12/30/2003US6670223 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
12/30/2003US6670222 Texturing of a die pad surface for enhancing bonding strength in the surface attachment
12/30/2003US6670221 Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
12/30/2003US6670220 Semiconductor device and manufacture method of that
12/30/2003US6670219 Method of fabricating a CDBGA package
12/30/2003US6670217 Methods for forming a die package
12/30/2003US6670216 Method for manufacturing a power semiconductor device and direct bonded substrate thereof
12/30/2003US6670215 Semiconductor device and manufacturing method thereof
12/30/2003US6670214 Insulated bonding wire for microelectronic packaging
12/30/2003US6670207 Radiation emitter device having an integral micro-groove lens
12/30/2003US6670022 Nanoporous dielectric films with graded density and process for making such films
12/30/2003US6669995 Directly exposing exposed antireflective coating to dosage of ultraviolet radiation sufficient to result in direct removal of at least portion of exposed coating
12/30/2003US6669858 Integrated low k dielectrics and etch stops
12/30/2003US6669738 Low profile semiconductor package
12/30/2003US6669498 ZIF socket
12/30/2003US6669489 Interposer, socket and assembly for socketing an electronic component and method of making and using same
12/30/2003US6669079 Conductive paste and semiconductor component having conductive bumps made from the conductive paste
12/30/2003US6669077 High-strength solder joint
12/30/2003US6668912 Heat exchanger cast in metal matrix composite and method of making the same
12/30/2003US6668911 Pump system for use in a heat exchange application
12/30/2003US6668910 Heat sink with multiple surface enhancements
12/30/2003US6668550 Method and apparatus for converting dissipated heat to work energy
12/30/2003US6668449 Method of making a semiconductor device having an opening in a solder mask
12/30/2003US6668448 Method of aligning features in a multi-layer electrical connective device
12/30/2003US6668431 Easily removed heatsink clip
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