| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/02/2004 | EP1374296A1 Method for encapsulating a chip having a sensitive surface |
| 01/02/2004 | EP1374295A2 Method for realizing wiring options in an integrated circuit and a corresponding integrated circuit |
| 01/02/2004 | EP1374266A1 Support for an electrical circuit in particular an electrical breaker |
| 01/02/2004 | EP1374191A2 Extraction of a private datum to authenticate an integrated circuit |
| 01/02/2004 | EP1374161A1 Portable electronic device |
| 01/02/2004 | EP1374020A2 Cooling device for a computer |
| 01/02/2004 | EP0710432B1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products |
| 01/01/2004 | US20040003359 Semiconductor-device design method, semiconductor-device design program and semiconductor-device design apparatus |
| 01/01/2004 | US20040002236 Flexible connecting device for interfacing with a wafer |
| 01/01/2004 | US20040002208 Method of manufacturing semiconductor device having multilevel wiring |
| 01/01/2004 | US20040002206 Wiring layout of auxiliary wiring package and printed circuit wiring board |
| 01/01/2004 | US20040002198 Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities |
| 01/01/2004 | US20040002184 Three-dimensional memory |
| 01/01/2004 | US20040002181 Microelectronic assembly with die support and method |
| 01/01/2004 | US20040002180 Thin film transistor array panel |
| 01/01/2004 | US20040002172 Methods and apparatus for aligning a wafer in which multiple light beams are used to scan alignment marks |
| 01/01/2004 | US20040002011 Photolithography; measuring adjustment mask; forming grid pattern; calibration |
| 01/01/2004 | US20040001326 Power grid and bump pattern with reduced inductance and resistance |
| 01/01/2004 | US20040001324 Module board having embedded chips and components and method of forming the same |
| 01/01/2004 | US20040001318 Retaining assembly for heat sink |
| 01/01/2004 | US20040001317 Heat sink made from longer and shorter graphite sheets |
| 01/01/2004 | US20040001316 Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit |
| 01/01/2004 | US20040001315 Heat dissipation assembly |
| 01/01/2004 | US20040001312 Electronic device, liquid cooling system and tank |
| 01/01/2004 | US20040001299 EMI shield including a lossy medium |
| 01/01/2004 | US20040001140 Semiconductor chip mounting apparatus and mounting method |
| 01/01/2004 | US20040001136 Optical scanning device, image forming apparatus, and optical scanning method |
| 01/01/2004 | US20040000966 High efficiency four port circuit |
| 01/01/2004 | US20040000744 Methods for labeling semiconductor device components |
| 01/01/2004 | US20040000729 Alignment marks of semiconductor device |
| 01/01/2004 | US20040000728 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
| 01/01/2004 | US20040000726 Pad arrangement method for reducing bonding failures and signal skew |
| 01/01/2004 | US20040000725 IC substrate with over voltage protection function and method for manufacturing the same |
| 01/01/2004 | US20040000724 Common connection method for flip-chip assembled devices |
| 01/01/2004 | US20040000723 Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding |
| 01/01/2004 | US20040000722 Semiconductor structure |
| 01/01/2004 | US20040000720 Method of protecting a seed layer for electroplating |
| 01/01/2004 | US20040000719 Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same |
| 01/01/2004 | US20040000718 Porous, film, wiring structure, and method of forming the same |
| 01/01/2004 | US20040000717 Integrated circuit conductive contact structures including grooves and fabrication methods thereof |
| 01/01/2004 | US20040000716 Semiconductor device and method of manufacturing the same |
| 01/01/2004 | US20040000713 Semiconductor device for sensor system |
| 01/01/2004 | US20040000712 Interface adhesive |
| 01/01/2004 | US20040000711 Insitu-cooled electrical assemblage |
| 01/01/2004 | US20040000710 Printed circuit board and fabrication method thereof |
| 01/01/2004 | US20040000709 Internal package interconnect with electrically parallel vias |
| 01/01/2004 | US20040000708 Memory expansion and chip scale stacking system and method |
| 01/01/2004 | US20040000707 Modularized die stacking system and method |
| 01/01/2004 | US20040000706 Semiconductor device, semiconductor package, and method for testing semiconductor device |
| 01/01/2004 | US20040000703 Semiconductor package body having a lead frame with enhanced heat dissipation |
| 01/01/2004 | US20040000702 Integrated circuit and laminated leadframe package |
| 01/01/2004 | US20040000693 Methods of forming contact plugs including polysilicon doped with an impurity having a lesser diffusion coefficient than phosphorus and related structures |
| 01/01/2004 | US20040000684 Semiconductor memory devices and methods for manufacturing the same using sidewall spacers |
| 01/01/2004 | US20040000676 Semiconductor device |
| 01/01/2004 | US20040000669 Solid-state imaging device, solid-state imaging apparatus and methods for manufacturing the same |
| 01/01/2004 | US20040000579 Forming contact arrays on substrates |
| 01/01/2004 | US20040000429 Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus |
| 01/01/2004 | US20040000428 Socketless package to circuit board assemblies and methods of using same |
| 01/01/2004 | US20040000415 Magnetic shielding for electronic circuits which include magnetic materials |
| 01/01/2004 | US20040000398 Heat dissipation assembly with fan mounting device |
| 01/01/2004 | US20040000395 Cpu cooling structure |
| 01/01/2004 | US20040000394 Heat-dissipating device |
| 01/01/2004 | US20040000393 High performance fan tail heat exchanger |
| 01/01/2004 | US20040000392 Radiator device |
| 01/01/2004 | US20040000391 Composite heat sink with metal base and graphite fins |
| 01/01/2004 | US20040000333 Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits |
| 01/01/2004 | US20040000157 Cooling device, method for manufacturing the same and portable equipment |
| 12/31/2003 | WO2004002204A1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |
| 12/31/2003 | WO2004002003A1 Packaging of a microchip device |
| 12/31/2003 | WO2004001963A1 Electronic component comprising a multilayer substrate and corresponding method of production |
| 12/31/2003 | WO2004001904A2 Stabilized wire bonded electrical connections and method of making same |
| 12/31/2003 | WO2004001850A1 Integrated circuit structure for mixed-signal rf applications and circuits |
| 12/31/2003 | WO2004001848A1 Electronics circuit manufacture |
| 12/31/2003 | WO2004001847A1 Improved integrated circuit package and method of manufacturing the integrated circuit package |
| 12/31/2003 | WO2004001846A2 Method and structures for reduced parasitic capacitance in integrated circuit metallizations |
| 12/31/2003 | WO2004001845A1 Rotary heat sink |
| 12/31/2003 | WO2004001844A2 Thermal interface materials and methods for their preparation and use |
| 12/31/2003 | WO2004001843A1 An electronic and optoelectronic component packaging technique |
| 12/31/2003 | WO2004001842A2 Layer assembly and method for producing a layer assembly |
| 12/31/2003 | WO2004001839A1 Semiconductor device and its producing method |
| 12/31/2003 | WO2004001838A1 Packaging of a microchip device-i |
| 12/31/2003 | WO2004001837A2 Methods of forming electronic structures including conductive shunt layers and related structures |
| 12/31/2003 | WO2004001823A1 Semiconductor device manufacturing method |
| 12/31/2003 | WO2004001815A1 An ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| 12/31/2003 | WO2004001814A2 Method of forming a raised contact for a substrate |
| 12/31/2003 | WO2004001800A2 Chip package sealing method |
| 12/31/2003 | WO2004000972A1 An etchant for a wiring, a method for manufacturing the wiring using the etchant, a thin film transistor array panel including the wiring, and a method for manufacturing the same |
| 12/31/2003 | WO2004000966A1 Heat curable adhesive composition, article, semiconductor apparatus and method |
| 12/31/2003 | WO2004000965A1 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 12/31/2003 | WO2004000960A1 Method for sealing porous materials during chip production and compounds therefor |
| 12/31/2003 | WO2004000718A2 Bridges for microelectromechanical structures |
| 12/31/2003 | WO2003088347A3 Method for connecting substrates and composite element |
| 12/31/2003 | WO2003075322A3 Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough |
| 12/31/2003 | WO2003073187A3 Method for automatic thermal calibration of a cooling system |
| 12/31/2003 | WO2003036711A3 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 12/31/2003 | WO2003019591A3 Housing for electrical components, in particular for capacitors |
| 12/31/2003 | WO2002093648A3 Semiconductor device interconnect |
| 12/31/2003 | WO2002089208A8 Arrangement comprising at least two different electronic semiconductor circuits |
| 12/31/2003 | WO2002063682A3 Lithographic type microelectronic spring structures with improved contours |
| 12/31/2003 | CN2596719Y Holder |