| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/06/2004 | US6674176 Wire bond package with core ring formed over I/O cells |
| 01/06/2004 | US6674175 Ball grid array chip packages having improved testing and stacking characteristics |
| 01/06/2004 | US6674174 Controlled impedance transmission lines in a redistribution layer |
| 01/06/2004 | US6674173 Stacked paired die package and method of making the same |
| 01/06/2004 | US6674172 Flip-chip package with underfill having low density filler |
| 01/06/2004 | US6674171 Semiconductor device with a low resistance wiring |
| 01/06/2004 | US6674170 Barrier metal oxide interconnect cap in integrated circuits |
| 01/06/2004 | US6674168 Reworking beol (back end of a processing line) metallization levels of damascene metallurgy |
| 01/06/2004 | US6674167 Multilevel copper interconnect with double passivation |
| 01/06/2004 | US6674166 Flip-chip integrated circuit routing to I/O devices |
| 01/06/2004 | US6674165 Mold for a semiconductor chip |
| 01/06/2004 | US6674164 System for uniformly interconnecting and cooling |
| 01/06/2004 | US6674163 Package structure for a semiconductor device |
| 01/06/2004 | US6674162 Semiconductor device and manufacturing method thereof |
| 01/06/2004 | US6674160 Multi-chip semiconductor device |
| 01/06/2004 | US6674159 Bi-level microelectronic device package with an integral window |
| 01/06/2004 | US6674158 Photocurable polymer resin (e.g., phenol-formaldehyde epoxy novolac resin) and a photoactive compound, such as cd1011 (triarylsulfonium hexafluorophosphate or ?sartomer?) |
| 01/06/2004 | US6674157 Semiconductor package comprising vertical power transistor |
| 01/06/2004 | US6674156 Multiple row fine pitch leadless leadframe package with use of half-etch process |
| 01/06/2004 | US6674155 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film |
| 01/06/2004 | US6674154 Lead frame with multiple rows of external terminals |
| 01/06/2004 | US6674153 Semiconductor device utilizing pad to pad wire interconnection for improving detection of failed region on the device |
| 01/06/2004 | US6674146 Composite dielectric layers |
| 01/06/2004 | US6674143 Hermetically sealing package for optical semiconductor and optical semiconductor module |
| 01/06/2004 | US6674108 Gate length control for semiconductor chip design |
| 01/06/2004 | US6674092 Thin film CMOS calibration standard having protective cover layer |
| 01/06/2004 | US6674036 Method for marking packaged integrated circuits |
| 01/06/2004 | US6674016 Electronic component |
| 01/06/2004 | US6674008 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 01/06/2004 | US6674002 Interior of the housing filled with a casting material; reliably sealed polyamide-based hot melt adhesive |
| 01/06/2004 | US6673725 Film forming by plasma enhanced vapor deposition using gas of nitrous oxide, water, carbon dioxide, ammonia, an alkylsiloxane and a methylsilane; coating a copper wiring |
| 01/06/2004 | US6673718 Methods for forming aluminum metal wirings |
| 01/06/2004 | US6673710 Method of connecting a conductive trace and an insulative base to a semiconductor chip |
| 01/06/2004 | US6673708 Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill |
| 01/06/2004 | US6673707 Method of forming semiconductor device utilizing die active surfaces for laterally extending die internal and external connections |
| 01/06/2004 | US6673698 Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers |
| 01/06/2004 | US6673692 Method and apparatus for marking microelectronic dies and microelectronic devices |
| 01/06/2004 | US6673656 Semiconductor chip package and manufacturing method thereof |
| 01/06/2004 | US6673655 Method of making semiconductor device having improved heat radiation plate arrangement |
| 01/06/2004 | US6673653 Wafer-interposer using a ceramic substrate |
| 01/06/2004 | US6673652 Underfilling method for a flip-chip packaging process |
| 01/06/2004 | US6673651 Method of manufacturing semiconductor device including semiconductor elements mounted on base plate |
| 01/06/2004 | US6673650 Multi chip semiconductor package and method of construction |
| 01/06/2004 | US6673649 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages |
| 01/06/2004 | US6673640 Method of manufacturing semiconductor device for evaluation capable of evaluating crystal defect using in-line test by avoiding using preferential etching process |
| 01/06/2004 | US6673635 Method for alignment mark formation for a shallow trench isolation process |
| 01/06/2004 | US6673484 IC device, circuit board and IC assembly |
| 01/06/2004 | US6673441 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/06/2004 | US6673436 Moisture absorbing formed article |
| 01/06/2004 | US6673434 Crosslinking |
| 01/06/2004 | US6673400 Hydrogen gettering system |
| 01/06/2004 | US6673200 Method of reducing process plasma damage using optical spectroscopy |
| 01/06/2004 | US6673180 Multilayered ceramic substrate production method |
| 01/06/2004 | US6672882 Socket structure for grid array (GA) packages |
| 01/06/2004 | US6672875 Spring interconnect structures |
| 01/06/2004 | US6672381 Multi-load thermal regulating system with multiple serial evaporators |
| 01/06/2004 | US6672379 Positioning and buckling structure for use in a radiator |
| 01/06/2004 | US6672378 Thermal interface wafer and method of making and using the same |
| 01/06/2004 | US6672374 Heat sink coupling device |
| 01/06/2004 | US6672370 Apparatus and method for passive phase change thermal management |
| 01/06/2004 | US6671957 Method of the manufacture of cooling devices |
| 01/06/2004 | US6671950 Forming high frequence stable, high via density device |
| 01/06/2004 | US6671948 Interconnection method using an etch stop |
| 01/06/2004 | US6671947 Method of making an interposer |
| 01/02/2004 | EP1377144A2 Method of mounting a leadless package and structure therefor |
| 01/02/2004 | EP1377141A2 Printed circuit board, method for producing same and semiconductor device |
| 01/02/2004 | EP1376742A1 High efficiency four port circuit |
| 01/02/2004 | EP1376705A2 Solid-state imaging device and method of manufacturing the same |
| 01/02/2004 | EP1376696A1 Semiconductor device |
| 01/02/2004 | EP1376694A2 Semiconductor switching circuit device |
| 01/02/2004 | EP1376693A2 Flip-chip semiconductor device having I/O modules in an internal circuit area |
| 01/02/2004 | EP1376692A2 Power grid and bump pattern with reduced inductance and resistance |
| 01/02/2004 | EP1376691A2 Method of making a carrier from a metallic leadframe and leadframe with a support for electronic components |
| 01/02/2004 | EP1376690A2 Pressure-contact type semiconductor device |
| 01/02/2004 | EP1376689A1 Radiating structural body of electronic part and radiating sheet used for the radiating structural body |
| 01/02/2004 | EP1376688A2 Heat dissipator for electronic device |
| 01/02/2004 | EP1376684A2 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
| 01/02/2004 | EP1376678A2 Manufacturing method of semiconductor device |
| 01/02/2004 | EP1376677A2 Finned heat sinks |
| 01/02/2004 | EP1376672A1 Deposition method, deposition apparatus, insulating film and semiconductor integrated circuit |
| 01/02/2004 | EP1376452A1 Semiconductor device and its manufacturing method |
| 01/02/2004 | EP1375688A1 Heat dissipation member for electronic apparatus and method for producing the same |
| 01/02/2004 | EP1375623A1 Extrudable bridged grease-like heat radiating material, container sealingly filled with the material, method of manufacturing the container, and method of radiating heat by the use thereof |
| 01/02/2004 | EP1375559A1 Dielectrics with copper diffusion barrier |
| 01/02/2004 | EP1375553A1 Curable resin, curable resin material, curable film, and insulator |
| 01/02/2004 | EP1375417A2 Bridges for microelectromechanical structures |
| 01/02/2004 | EP1374658A1 A substrate for mounting a semiconductor |
| 01/02/2004 | EP1374654A1 Heat sink |
| 01/02/2004 | EP1374652A2 Shunt power connection for an integrated circuit package |
| 01/02/2004 | EP1374651A1 Encapsulation arrangement |
| 01/02/2004 | EP1374310A2 Nanofabrication |
| 01/02/2004 | EP1374309A1 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| 01/02/2004 | EP1374307A1 Integrated inductance |
| 01/02/2004 | EP1374306A2 Alternate bump metallurgy bars for power and ground routing |
| 01/02/2004 | EP1374305A2 Enhanced die-down ball grid array and method for making the same |
| 01/02/2004 | EP1374304A1 High frequency integrated circuit (hfic) microsystems assembly and method for fabricating the same |
| 01/02/2004 | EP1374303A2 Power transistor package with integrated flange for surface mount heat removal |
| 01/02/2004 | EP1374302A2 Interconnection for accomodating thermal expansion for low elastic modulus dielectrics |
| 01/02/2004 | EP1374299A2 Structure and method for determining edges of regions in a semiconductor wafer |
| 01/02/2004 | EP1374298A1 Chip module with bond-wire connections with small loop height |