| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/04/2014 | US8642462 Interconnection designs and materials having improved strength and fatigue life |
| 02/04/2014 | US8642408 Semiconductor device |
| 02/04/2014 | US8642393 Package on package devices and methods of forming same |
| 02/04/2014 | US8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section |
| 02/04/2014 | US8642387 Method of fabricating stacked packages using laser direct structuring |
| 02/04/2014 | US8642385 Wafer level package structure and the fabrication method thereof |
| 02/04/2014 | US8642384 Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability |
| 02/04/2014 | US8642382 Integrated circuit packaging system with support structure and method of manufacture thereof |
| 02/04/2014 | US8641619 Analyte monitoring device and methods of use |
| 02/04/2014 | US8640962 Radiofrequency identification device and method for producing said device |
| 02/04/2014 | US8640943 Fabrication method of semiconductor integrated circuit device |
| 01/30/2014 | WO2014018824A1 Heat exchanging apparatus and method for transferring heat |
| 01/30/2014 | WO2014018538A1 Methods and arrangements relating to semiconductor packages including multi-memory dies |
| 01/30/2014 | WO2014017889A1 Hardening composition |
| 01/30/2014 | WO2014017888A1 Hardening composition |
| 01/30/2014 | WO2014017887A1 Curable composition |
| 01/30/2014 | WO2014017886A1 Hardening composition |
| 01/30/2014 | WO2014017885A1 Curable composition |
| 01/30/2014 | WO2014017884A1 Hardening composition |
| 01/30/2014 | WO2014017883A1 Hardening composition |
| 01/30/2014 | WO2014017661A1 Flow path member, and heat exchanger and semiconductor manufacturing device using same |
| 01/30/2014 | WO2014017473A1 Protective film-forming layer, sheet for forming protective film, and method for manufacturing semiconductor device |
| 01/30/2014 | WO2014017300A1 Method for producing metal-liquid crystal polymer complex and electronic component |
| 01/30/2014 | WO2014017299A1 Metal material having surface for bonding to liquid crystal polymer, metal-liquid crystal polymer composite, method for producing same, and electronic component |
| 01/30/2014 | WO2014017273A1 Package for housing semiconductor element, and semiconductor device |
| 01/30/2014 | WO2014017228A1 Module |
| 01/30/2014 | WO2014017160A1 Module, and device having module mounted thereon |
| 01/30/2014 | WO2014017159A1 Module, and production method therefor |
| 01/30/2014 | WO2014017110A1 Wiring board and package, and electronic device |
| 01/30/2014 | WO2014016085A2 Cooling device and method for producing a cooling device and circuit assembly having a cooling device |
| 01/30/2014 | WO2014015820A1 Method for forming mos device passivation layer and mos device |
| 01/30/2014 | WO2014015636A1 Array substrate, method for manufacturing same, and display device |
| 01/30/2014 | WO2014015603A1 Sensor and method for manufacturing same |
| 01/30/2014 | WO2013156568A3 Circuit arrangement for thermally conductive chip assembly and production method |
| 01/30/2014 | WO2013016133A3 A one-component, dual-cure adhesive for use on electronics |
| 01/30/2014 | US20140031510 Curable composition |
| 01/30/2014 | US20140030851 Method for Fabricating Array-Molded Package-on-Package |
| 01/30/2014 | US20140030849 Pick-and-Place Tool for Packaging Process |
| 01/30/2014 | US20140030848 Interlayer filler composition for three-dimensional integrated circuit, coating fluid and process for producing three-dimensional integrated circuit |
| 01/30/2014 | US20140029227 Electronic circuit and semiconductor component |
| 01/30/2014 | US20140029222 Chip component-embedded resin multilayer substrate and manufacturing method thereof |
| 01/30/2014 | US20140029202 Motor controller |
| 01/30/2014 | US20140029181 Interlayer interconnects and associated techniques and configurations |
| 01/30/2014 | US20140027933 Device and method for alignment of vertically stacked wafers and die |
| 01/30/2014 | US20140027932 Manufacturing an underfill in a semiconductor chip package |
| 01/30/2014 | US20140027930 Semiconductor device including semiconductor package |
| 01/30/2014 | US20140027929 Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP |
| 01/30/2014 | US20140027928 Semiconductor device having crack-resisting ring structure and manufacturing method thereof |
| 01/30/2014 | US20140027927 Method for manufacturing a component having an electrical through-connection |
| 01/30/2014 | US20140027926 Semiconductor package and method of fabricating the same |
| 01/30/2014 | US20140027925 Through-holed interposer, packaging substrate, and methods of fabricating the same |
| 01/30/2014 | US20140027924 Semiconductor devices including spacers on sidewalls of conductive lines and methods of manufacturing the same |
| 01/30/2014 | US20140027923 Non-lithographic hole pattern formation |
| 01/30/2014 | US20140027922 Via in substrate with deposited layer |
| 01/30/2014 | US20140027921 Connection Carrier for Semiconductor Chips and Semiconductor Component |
| 01/30/2014 | US20140027920 Semiconductor device and method for manufacturing the same |
| 01/30/2014 | US20140027919 Semiconductor device and method of manufacturing the same |
| 01/30/2014 | US20140027918 Cross-coupling based design using diffusion contact structures |
| 01/30/2014 | US20140027917 Non-lithographic line pattern formation |
| 01/30/2014 | US20140027916 Semiconductor device having vertical channel |
| 01/30/2014 | US20140027915 Production of adhesion structures in dielectric layers using photoprocess technology and devices incorporating adhesion structures |
| 01/30/2014 | US20140027914 Protection of under-layer conductive pathway |
| 01/30/2014 | US20140027913 Semiconductor structures comprising conductive material lining openings in an insulative material |
| 01/30/2014 | US20140027912 Sidewalls of electroplated copper interconnects |
| 01/30/2014 | US20140027911 Sidewalls of electroplated copper interconnects |
| 01/30/2014 | US20140027910 Method for reducing wettability of interconnect material at corner interface and device incorporating same |
| 01/30/2014 | US20140027909 Metallization of fluorocarbon-based dielectric for interconnects |
| 01/30/2014 | US20140027908 Integrated Circuit Interconnects and Methods of Making Same |
| 01/30/2014 | US20140027907 Semiconductor device with embedded interconnect pad |
| 01/30/2014 | US20140027906 Semiconductor device, a mobile communication device, and a method for manufacturing a semiconductor device |
| 01/30/2014 | US20140027905 Semiconductor package structure and method for making the same |
| 01/30/2014 | US20140027904 Semiconductor device |
| 01/30/2014 | US20140027903 Semiconductor Package Including an Integrated Waveguide |
| 01/30/2014 | US20140027902 Repairing anomalous stiff pillar bumps |
| 01/30/2014 | US20140027901 Package-on-package structures having buffer dams and methods for forming the same |
| 01/30/2014 | US20140027900 Bump Structure for Yield Improvement |
| 01/30/2014 | US20140027899 Controlling thermal interface material bleed out |
| 01/30/2014 | US20140027898 Multichip electronic packages and methods of manufacture |
| 01/30/2014 | US20140027897 Semiconductor memory device and method of fabricating the same |
| 01/30/2014 | US20140027896 Semiconductor device package with cap element |
| 01/30/2014 | US20140027895 Three-dimensional mounting semiconductor device and method of manufacturing three-dimensional mounting semiconductor device |
| 01/30/2014 | US20140027894 Resin molded semiconductor device and manufacturing method thereof |
| 01/30/2014 | US20140027893 Circuit substrate for mounting chip, method for manufacturing same and chip package having same |
| 01/30/2014 | US20140027892 Electric Device Package Comprising a Laminate and Method of Making an Electric Device Package Comprising a Laminate |
| 01/30/2014 | US20140027891 Semiconductor device and method for manufacturing semiconductor device |
| 01/30/2014 | US20140027890 Low Stress Package For an Integrated Circuit |
| 01/30/2014 | US20140027889 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability |
| 01/30/2014 | US20140027888 System and method to manufacture an implantable electrode |
| 01/30/2014 | US20140027887 Wafer backside doping for thermal neutron shielding |
| 01/30/2014 | US20140027885 Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate |
| 01/30/2014 | US20140027884 System and method for gas-phase sulfur passivation of a semiconductor surface |
| 01/30/2014 | US20140027867 Packages and methods for 3d integration |
| 01/30/2014 | US20140027866 Noise shielding techniques for ultra low current measurements in biochemical applications |
| 01/30/2014 | US20140027862 Rf cmos transistor design |
| 01/30/2014 | US20140027861 Integrated circuit and display device including the same |
| 01/30/2014 | US20140027836 Nonvolatile semiconductor memory device and method for manufacturing same |
| 01/30/2014 | US20140027822 Copper Contact Plugs with Barrier Layers |
| 01/30/2014 | US20140027771 Device identification assignment and total device number detection |
| 01/30/2014 | US20140027435 Heating apparatus for heating electronic components on a printed circuit board in low temperature environment |
| 01/30/2014 | US20140026961 Gas barrier film |