| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/08/2004 | US20040004278 Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same |
| 01/08/2004 | US20040004277 Semiconductor package with reinforced substrate and fabrication method of the substrate |
| 01/08/2004 | US20040004275 Lead-frame-based semiconductor package and fabrication method thereof |
| 01/08/2004 | US20040004274 Semiconductor die with attached heat sink and transfer mold |
| 01/08/2004 | US20040004273 Semiconductor device and method for making the same |
| 01/08/2004 | US20040004272 Reduces the package electrical resistance, inductance and thermal resistance to enable the device be more efficient and dissipate more power. |
| 01/08/2004 | US20040004269 High impedance antifuse |
| 01/08/2004 | US20040004268 E-Fuse and anti-E-Fuse device structures and methods |
| 01/08/2004 | US20040004266 Semiconductor integrated circuit and method of manufacturing the same |
| 01/08/2004 | US20040004232 Low cost programmable CPU package/substrate |
| 01/08/2004 | US20040004216 Test assembly including a test die for testing a semiconductor product die |
| 01/08/2004 | US20040004058 Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings |
| 01/08/2004 | US20040004054 Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits |
| 01/08/2004 | US20040003999 Such as cationic tetrabromobisphenol a-diethylene glycol-diethanolamine resin and curing agent; flame resistance protective layer; circuit board fabrication |
| 01/08/2004 | US20040003941 Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device |
| 01/08/2004 | US20040003494 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| 01/08/2004 | DE20314732U1 Multiple piece holder system for heat conductive tubes for cooling a processor mounted on a base plate whereby the heat conducting plate is pressed against the processor surface |
| 01/08/2004 | DE20314731U1 One piece holder system for heat conductive tubes for cooling a processor mounted on a base plate whereby the heat conducting plate is pressed against the processor surface |
| 01/08/2004 | DE20306916U1 Wärme-ableitende Schicht Heat-dissipating layer |
| 01/08/2004 | DE10325332A1 Material für eine Wärmeleitfähige Zwischenlage Material for a heat conductive liner |
| 01/08/2004 | DE10252818A1 Halbleitervorrichtung mit Kondensator A semiconductor device having capacitor |
| 01/08/2004 | DE10247528A1 Integrierte Schaltung und Verfahren zum Herstellen derselben Integrated circuit and method for manufacturing the same |
| 01/08/2004 | DE10243961A1 Metallfüllverfahren und Gegenstand aufweisend metallgefüllte Löcher Metallfüllverfahren and article comprising metal-filled holes |
| 01/08/2004 | DE10226964A1 Verfahren zur Herstellung einer NROM-Speicherzellenanordnung Process for the preparation of an NROM memory cell array |
| 01/08/2004 | DE10225602A1 Halbleiterbauelement mit integrierter Schaltung, Kühlkörper und Temperatursensor A semiconductor device comprising an integrated circuit and heat sink temperature sensor |
| 01/08/2004 | DE10225431A1 Verfahren zur Anschlußkontaktierung von elektronischen Bauelementen auf einem isolierenden Substrat und nach dem Verfahren hergestelltes Bauelement-Modul A process for Contact connection of electronic components on an insulating substrate and component produced by the process module |
| 01/08/2004 | DE10225042A1 Integrierter Schaltkreis und Verfahren zur Herstellung desselben Integrated circuit and method of manufacturing the same |
| 01/08/2004 | DE10224957A1 Ermüdungsresistente Metallstruktur und Herstellungsverfahren derselben Fatigue resistant metal structure and manufacturing method thereof |
| 01/08/2004 | DE10124592B4 Kühlkörper Heat Sink |
| 01/07/2004 | EP1378941A2 Semiconductor module and power conversion device |
| 01/07/2004 | EP1378940A2 Heat sink for semiconductor elements or similar devices |
| 01/07/2004 | EP1378939A2 Manufacturing method for an electronic circuit, and corresponding electronic circuit |
| 01/07/2004 | EP1378938A2 Semiconductor module and power conversion device |
| 01/07/2004 | EP1378937A2 Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics |
| 01/07/2004 | EP1378935A2 A method to form both high and low-K materials in one plane on a substrate, and their application in mixed mode circuits |
| 01/07/2004 | EP1378932A2 Semiconductor chip mounting apparatus and mounting method |
| 01/07/2004 | EP1378154A2 Electronic module including a cooling substrate with fluid dissociation electrodes and related methods |
| 01/07/2004 | EP1378153A1 Electronic module including a cooling substrate and related methods |
| 01/07/2004 | EP1378008A2 Power module |
| 01/07/2004 | EP1378007A1 Plastic semiconductor package |
| 01/07/2004 | EP1378002A2 Metal-insulator-metal capacitor in copper |
| 01/07/2004 | EP1377989A2 Thick film paste systems for circuits on diamonds substrates |
| 01/07/2004 | EP1097478B9 Semiconductor component in a chip format and method for the production thereof |
| 01/07/2004 | CN2598143Y Plug-in electronic element |
| 01/07/2004 | CN2598142Y Multi-section radiating device |
| 01/07/2004 | CN2598141Y Gravity heat tube radaitor for high power solid relay |
| 01/07/2004 | CN2598140Y Improvement of radiator structure |
| 01/07/2004 | CN2598139Y Multi-bearing liquid storage tank heat conducting device |
| 01/07/2004 | CN2598138Y Radiator for computer CPU or wafer |
| 01/07/2004 | CN2598137Y Chip encapsulating structure |
| 01/07/2004 | CN2598136Y Wafer stacking structure |
| 01/07/2004 | CN2598134Y Polymer composite nano-particle molecular film |
| 01/07/2004 | CN2598042Y Fastener with two elastic arms |
| 01/07/2004 | CN2598040Y Fastening assembly for radiator of treater |
| 01/07/2004 | CN1466863A Cooling system |
| 01/07/2004 | CN1466777A Semiconductor element and method of manufacturing and multi-layer printed circuit board and mfg. method |
| 01/07/2004 | CN1466774A Resin packaged semiconductor device and die bonding material and packaging material thereof |
| 01/07/2004 | CN1466610A Epoxy resin molding material for sealing |
| 01/07/2004 | CN1466268A Substrate charge circuit for input/output electrostatic discharge protection and protection method thereof |
| 01/07/2004 | CN1466222A Semiconductor device with capacitor |
| 01/07/2004 | CN1466212A Multichip semiconductor package with chip carrier having down stretched pin |
| 01/07/2004 | CN1466211A Semiconductor package and mfg. method thereof |
| 01/07/2004 | CN1466210A Electrostatic discharge protection system for flip chip packaged IC and chip having said system |
| 01/07/2004 | CN1466209A Electrostatic discharge protector |
| 01/07/2004 | CN1466207A Metal pad and junction pad area structure |
| 01/07/2004 | CN1466206A Ball grid array (BGA) semiconductor package |
| 01/07/2004 | CN1466205A Flip Chip type semiconductor package using leadframe as chip carrier |
| 01/07/2004 | CN1466204A Leadframe for preventing pin from short circuit and method for making semiconductor package having same |
| 01/07/2004 | CN1466203A Shrinkage controllable leadframe and flip chip type semiconductor package having same |
| 01/07/2004 | CN1466202A Aluminium-copper combined heat sink and mfg. method thereof |
| 01/07/2004 | CN1466201A Semiconductor package whose chip carrier has receessed portion |
| 01/07/2004 | CN1466200A Semiconductor chip carrier, semiconductor package component and semiconductor package method |
| 01/07/2004 | CN1466199A Chip carrier holed semiconductor package element and mfg. method thereof |
| 01/07/2004 | CN1466198A Semiconductor device for shortening length of wire bonding |
| 01/07/2004 | CN1466197A Sequare shape pin-free planar semiconductor package structure and mfg. method |
| 01/07/2004 | CN1466179A Opened leadframe type semiconductor package structure and mfg process |
| 01/07/2004 | CN1466026A Three-phase change heat conduction device |
| 01/07/2004 | CN1134144C Electronic device |
| 01/07/2004 | CN1134105C Surface acoustic wave device suitable for installing flip-chip |
| 01/07/2004 | CN1134073C 半导体器件 Semiconductor devices |
| 01/07/2004 | CN1134065C Circuit and method for providing interconnections among individual integrated circuit chips in multi-chip module |
| 01/07/2004 | CN1134064C Carrier element for semiconductor chip |
| 01/07/2004 | CN1134063C Assembly consisting of substrate for power components and cooling element and method for production thereof |
| 01/07/2004 | CN1134062C Resin package, semiconductor device and method for producing resin package |
| 01/07/2004 | CN1134060C Ultra thin, single phase, diffusion barrier for metal conductors |
| 01/07/2004 | CN1134059C Method for manufacturing semiconductor integrated circuit |
| 01/07/2004 | CN1134052C Electric structure and making method |
| 01/07/2004 | CN1134049C Plasma treatment for improving adhesiveness between inorganic material and copper |
| 01/07/2004 | CN1134048C Method for forming self-alignment contact |
| 01/07/2004 | CN1133571C Pallet for semiconductor integrated circuit device |
| 01/06/2004 | US6675367 Semiconductor integrated circuits and method for designing the same |
| 01/06/2004 | US6675053 Layout for measurement of overlay error |
| 01/06/2004 | US6674647 Low or no-force bump flattening structure and method |
| 01/06/2004 | US6674646 Voltage regulation for semiconductor dies and related structure |
| 01/06/2004 | US6674643 Thermal connector for transferring heat between removable printed circuit boards |
| 01/06/2004 | US6674623 Microcomputer equipped with built-in temperature sensor |
| 01/06/2004 | US6674502 Thin film transistors; a surface treated with an oxygen plasma and a nitrogen plasma-treated layer formed over said surface; molybdenum nitride |
| 01/06/2004 | US6674347 Multi-layer substrate suppressing an unwanted transmission mode |
| 01/06/2004 | US6674178 Semiconductor device having dispersed filler between electrodes |
| 01/06/2004 | US6674177 Apparatus for implementing selected functionality on an integrated circuit device |