| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/13/2004 | US6677245 Contact structure production method |
| 01/13/2004 | US6677237 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them |
| 01/13/2004 | US6677236 Semiconductor device fabrication method for interconnects that suppresses loss of interconnect metal |
| 01/13/2004 | US6677234 Method of selectively forming silicide |
| 01/13/2004 | US6677233 Material deposition from a liquefied gas solution |
| 01/13/2004 | US6677230 Method of manufacturing semiconductor device |
| 01/13/2004 | US6677228 Reinforced aluminum copper bonding pad |
| 01/13/2004 | US6677226 Method for forming an integrated circuit having a bonding pad and a fuse |
| 01/13/2004 | US6677220 Antifuse structure and method of making |
| 01/13/2004 | US6677219 Method of forming a ball grid array package |
| 01/13/2004 | US6677195 Semiconductor integrated circuit device and method of producing the same |
| 01/13/2004 | US6677193 Method of producing semiconductor device and its structure |
| 01/13/2004 | US6677188 Methods for forming a fuse in a semiconductor device |
| 01/13/2004 | US6677187 Process for encapsulating an electrical or electronic component in a sealed manner |
| 01/13/2004 | US6677185 Method of affixing a heat sink to a substrate and package thereof |
| 01/13/2004 | US6677181 Method for fabricating stacked chip package device |
| 01/13/2004 | US6677056 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film |
| 01/13/2004 | US6677055 Preventing the formation of whiskers and recess cavities on lead surfaces |
| 01/13/2004 | US6676796 Transferrable compliant fibrous thermal interface |
| 01/13/2004 | US6676784 Process for the manufacture of multilayer ceramic substrates |
| 01/13/2004 | US6676431 PGA socket and contact |
| 01/13/2004 | US6675885 Heat-dissipating device for electronic components |
| 01/13/2004 | US6675875 Multi-layered micro-channel heat sink, devices and systems incorporating same |
| 01/13/2004 | US6675600 Minimizing stress induced by temperature changes; flexible comb-like pattern |
| 01/13/2004 | US6675473 Method of positioning a conductive element in a laminated electrical device |
| 01/13/2004 | US6675472 Preventing burrs wherein the copper plating is performed prior to making the routing of one or more slots by a thin plating; improved castellation via process |
| 01/13/2004 | CA2322468C Integrated circuit connection using an electrically conductive adhesive |
| 01/08/2004 | WO2004004435A1 Magnetic shielding for electronic circuits which include magnetic materials |
| 01/08/2004 | WO2004004431A1 Socketless package to circuit board assemblies and methods of using same |
| 01/08/2004 | WO2004004009A1 Semiconductor integrated circuit |
| 01/08/2004 | WO2004004006A1 Electronic component comprising a multilayer wiring frame and method for producing the same |
| 01/08/2004 | WO2004004005A1 Semiconductor device and its manufacturing method |
| 01/08/2004 | WO2004004004A2 Forming contact arrays on substrates |
| 01/08/2004 | WO2004004003A1 Multilayer substrate metallization for ic interconnection |
| 01/08/2004 | WO2004004002A1 Semiconductor structure integrated under a pad |
| 01/08/2004 | WO2004004001A1 Microstructural component, especially microstructured high-frequency component |
| 01/08/2004 | WO2004004000A1 Structure for connecting power supply to semiconductor device |
| 01/08/2004 | WO2004003999A1 Wearable silicon chip |
| 01/08/2004 | WO2004003992A1 Cof film carrier tape and its manufacturing method |
| 01/08/2004 | WO2004003991A2 Electronic component with a housing packaging |
| 01/08/2004 | WO2004003975A2 Heat sink made from longer and shorter graphite sheets |
| 01/08/2004 | WO2004003974A2 Composite heat sink with metal base and graphite fins |
| 01/08/2004 | WO2004003965A2 Mems capping method and apparatus |
| 01/08/2004 | WO2004003713A2 Cooling unit for cooling heat generating component |
| 01/08/2004 | WO2004003259A1 Method of forming polyimide coating containing dielectric filler on surface of metallic material, process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process |
| 01/08/2004 | WO2004003086A1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 01/08/2004 | WO2004003066A1 Improved interface adhesive |
| 01/08/2004 | WO2004003059A1 Organic silicate polymer and insulation film comprising the same |
| 01/08/2004 | WO2004003023A1 Crosslinked vinyl resin foams and process for production thereof |
| 01/08/2004 | WO2003094203A3 Direct-connect signaling system |
| 01/08/2004 | WO2003077315A3 Multi-row leadframe |
| 01/08/2004 | WO2003063225A3 Dielectric films for narrow gap-fill applications |
| 01/08/2004 | WO2003041169A3 Thermally balanced power transistor |
| 01/08/2004 | WO2003030225B1 Semiconductor chip with multiple rows of bond pads |
| 01/08/2004 | WO2002086969B1 Non-optical signal isolator |
| 01/08/2004 | WO2002056342A3 Copper vias in low-k technology |
| 01/08/2004 | WO2002052630A3 Structural reinforcement of highly porous low k dielectric films by ild posts |
| 01/08/2004 | WO2002041397A3 Low profile integrated module interconnects |
| 01/08/2004 | US20040006755 System and method to improve IC fabrication through selective fusing |
| 01/08/2004 | US20040006150 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 01/08/2004 | US20040005808 Electrical connector assembly having retention module |
| 01/08/2004 | US20040005789 Method for fabricating semiconductor device |
| 01/08/2004 | US20040005780 Method of boosting wafer cleaning efficiency and increasing process yield |
| 01/08/2004 | US20040005776 Methods for forming a fuse in a semiconductor device |
| 01/08/2004 | US20040005774 Method of manufacturing semiconductor device and semiconductor device |
| 01/08/2004 | US20040005773 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect |
| 01/08/2004 | US20040005770 Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
| 01/08/2004 | US20040005754 Method for attaching an integrated circuit on a silicon chip to a smart label |
| 01/08/2004 | US20040005737 Method for manufacturing encapsulated electronic components, particularly integrated circuits |
| 01/08/2004 | US20040005736 Method and apparatus using nanotubes for cooling and grounding die |
| 01/08/2004 | US20040005733 Method of manufacturing semiconductor device |
| 01/08/2004 | US20040005732 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages |
| 01/08/2004 | US20040005729 Solid state image pickup device and method of producing solid state image pickup device |
| 01/08/2004 | US20040005506 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 01/08/2004 | US20040005459 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure |
| 01/08/2004 | US20040005181 Inking apparatus with multi-positioning capability |
| 01/08/2004 | US20040005090 Non-lot based method for assembling integrated circuit devices |
| 01/08/2004 | US20040005052 Semiconductor device, terminal device and communication method |
| 01/08/2004 | US20040004879 Semiconductor integrated circuit device |
| 01/08/2004 | US20040004823 COF flexible printed wiring board and method of producing the wiring board |
| 01/08/2004 | US20040004820 Electronic module |
| 01/08/2004 | US20040004819 Heat sink apparatus that provides electrical isolation for integrally shielded circuit |
| 01/08/2004 | US20040004817 Cooling system for electronic devices |
| 01/08/2004 | US20040004815 Heat dissipation apparatus |
| 01/08/2004 | US20040004814 Air guide |
| 01/08/2004 | US20040004435 Immersion cooling type light emitting diode and its packaging method |
| 01/08/2004 | US20040004297 Semiconductor device and manufacturing method thereof, and registration accuracy measurement enhancement method |
| 01/08/2004 | US20040004296 Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same |
| 01/08/2004 | US20040004294 Underfilled, encapsulated semiconductor die assemblies and methods of fabrication |
| 01/08/2004 | US20040004293 Semiconductor package |
| 01/08/2004 | US20040004290 Semiconductor with contact contacting diffusion adjacent gate electrode |
| 01/08/2004 | US20040004289 Semiconductor device and manufacturing method thereof |
| 01/08/2004 | US20040004288 Semiconductor device and manufacturing method of the same |
| 01/08/2004 | US20040004287 Semiconductor device using metal nitride as insulating film and its manufacture method |
| 01/08/2004 | US20040004285 BGA substrate via structure |
| 01/08/2004 | US20040004284 Staircase shaped portion of the redistribution layer includes at least two steps, each including a riser and a tread. |
| 01/08/2004 | US20040004283 Direct attachment of semiconductor chip to organic substrate |
| 01/08/2004 | US20040004282 Thermally enhanced semiconductor chip having integrated bonds over active circuits |
| 01/08/2004 | US20040004281 Semiconductor package with heat sink |
| 01/08/2004 | US20040004280 Semiconductor device and system having semiconductor device mounted thereon |