Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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01/14/2004 | EP1381083A2 Method and apparatus for removing heat from a circuit |
01/14/2004 | EP1381082A2 Semiconductor package lid with internal heat pipe |
01/14/2004 | EP1381081A1 Radiation type bga package and production method therefor |
01/14/2004 | EP1381080A2 Component-embedded board fabrication method and apparatus |
01/14/2004 | EP1380985A2 Semiconductor device having a built-in contact-type sensor and manufacturing method of such a semiconductor device |
01/14/2004 | EP1380880A1 Method for manufacturing liquid crystal display |
01/14/2004 | EP1380610A1 Curable compositions and electric/electronic parts |
01/14/2004 | EP1380105A2 On-chip multilayer metal shielded transmission line |
01/14/2004 | EP1380066A1 Microwave circuit |
01/14/2004 | EP1380056A2 Optoelectronic component array and method for the production of an optoelectronic component array |
01/14/2004 | EP1380052A2 Non-optical signal isolator |
01/14/2004 | EP1380051A1 Contact structure for an integrated semiconductor device |
01/14/2004 | EP1379978A2 Extraction method of defect density and size distributions |
01/14/2004 | EP1379825A2 Orientation-independent thermosyphon heat spreader |
01/14/2004 | EP0963600B1 Thin titanium film as self-regulating filter for silicon migration into aluminum metal lines |
01/14/2004 | EP0866649B1 Highly heat-conductive composite magnetic material |
01/14/2004 | CN2599902Y 防护型陶瓷基板 Protective ceramic substrate |
01/14/2004 | CN2599760Y Luminous diode support with radiating column |
01/14/2004 | CN2599756Y Radiator |
01/14/2004 | CN2599755Y Radiation device combination |
01/14/2004 | CN2599754Y Plug-in groove type fan fixed support |
01/14/2004 | CN2599753Y Radiator fins |
01/14/2004 | CN2599752Y Radiator fins |
01/14/2004 | CN2599751Y Radiating fin connection structure |
01/14/2004 | CN2599750Y Central flow-guiding radiator |
01/14/2004 | CN2599749Y Radiator assembly |
01/14/2004 | CN2599748Y Radiator fastener |
01/14/2004 | CN2599644Y CPU heat sink |
01/14/2004 | CN2599643Y Back panel structure for central processor radiating and fixing |
01/14/2004 | CN1468467A Thick film millimeter wave transceiver module |
01/14/2004 | CN1468448A Electronic package having embedded capacitors and method of fabrication therefor |
01/14/2004 | CN1468048A Enhancement of current-carrying capacity of a multilayer circuit board |
01/14/2004 | CN1468046A Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment |
01/14/2004 | CN1467840A Semiconductor device and method of manufacturing the same |
01/14/2004 | CN1467839A 半导体集成电路 The semiconductor integrated circuit |
01/14/2004 | CN1467838A Semiconductor device having multilevel copper wiring layers and its manufacture method |
01/14/2004 | CN1467837A Semiconductor device and method for manufacturing the same |
01/14/2004 | CN1467836A Semiconductor device, semiconductor package, and method for testing semiconductor device |
01/14/2004 | CN1467835A Lead frame adapting to integrate circuit miniaturization trend |
01/14/2004 | CN1467834A Electronic device |
01/14/2004 | CN1467833A Heat-conducting sheet material and manufacturing method thereof |
01/14/2004 | CN1467831A Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
01/14/2004 | CN1467830A Semiconductor device and method of manufacturing the same |
01/14/2004 | CN1467828A Semiconductor unit |
01/14/2004 | CN1467825A Semiconductor device and method of fabricating the same |
01/14/2004 | CN1467818A Method of manufacturing semiconductor device having multilevel wiring |
01/14/2004 | CN1467816A Method for making copper damascene structure in porous dielectric |
01/14/2004 | CN1467815A Method of forming a fuse |
01/14/2004 | CN1467803A Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another |
01/14/2004 | CN1467541A Liquid crystal display device and method for manufacturing liquid crystal display device |
01/14/2004 | CN1467167A 高热膨胀玻璃和带子组合物 Thermal expansion glass and tape compositions |
01/14/2004 | CN1134844C Planar dielectric integrated circuit |
01/14/2004 | CN1134843C Planar dielectric integrated circuit |
01/14/2004 | CN1134841C 集成电路 IC |
01/14/2004 | CN1134840C Semiconductor device and method for fabricating the same |
01/14/2004 | CN1134839C Lead frame and method for plating lead frame |
01/14/2004 | CN1134837C Improved multi-layer conductive structure and method for forming thereof |
01/14/2004 | CN1134835C Semiconductor device and making method thereof |
01/14/2004 | CN1134834C Check pattern structure for via-hole opening verification |
01/14/2004 | CN1134833C Semiconductor device, method of manufacture thereof, circuit baseboard and electronic equipment |
01/14/2004 | CN1134832C Lead bracket |
01/14/2004 | CN1134825C Secure semiconductor device |
01/14/2004 | CN1134667C Microelectronic spring contact element |
01/14/2004 | CN1134628C Method and apparatus for cooling power electronic device of frequency conversion driving equipment |
01/13/2004 | USRE38382 Heat sink and electronic device employing the same |
01/13/2004 | US6678168 System including power conditioning modules |
01/13/2004 | US6678167 High performance multi-chip IC package |
01/13/2004 | US6678163 Housing for semiconductor chips |
01/13/2004 | US6678158 Heat sink assembly with fixing device |
01/13/2004 | US6678145 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board |
01/13/2004 | US6678144 Capacitor, circuit board with built-in capacitor and method for producing the same |
01/13/2004 | US6678082 Electro-optical component including a fluorinated poly(phenylene ether ketone) protective coating and related methods |
01/13/2004 | US6677781 Semiconductor integrated circuit device |
01/13/2004 | US6677766 Measuring the change in resistance of a polysilicon structure as the step height changes |
01/13/2004 | US6677682 Multilayer interconnection structure including an alignment mark |
01/13/2004 | US6677680 Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials |
01/13/2004 | US6677677 Semiconductor device |
01/13/2004 | US6677676 Semiconductor device having steady substrate potential |
01/13/2004 | US6677675 Microelectronic devices and microelectronic die packages |
01/13/2004 | US6677674 Semiconductor package having two chips internally connected together with bump electrodes and both chips externally connected to a lead frame with bond wires |
01/13/2004 | US6677673 Clamping assembly for high-voltage solid state devices |
01/13/2004 | US6677672 Structure and method of forming a multiple leadframe semiconductor device |
01/13/2004 | US6677670 Semiconductor device |
01/13/2004 | US6677669 Semiconductor package including two semiconductor die disposed within a common clip |
01/13/2004 | US6677668 Configuration for testing a substrate mounted with a most performance-demanding integrated circuit |
01/13/2004 | US6677667 Leadless leadframe package design that provides a greater structural integrity |
01/13/2004 | US6677666 Lead frame for fabricating surface mount type semiconductor devices with high reliability |
01/13/2004 | US6677665 Dual-die integrated circuit package |
01/13/2004 | US6677663 End grid array semiconductor package |
01/13/2004 | US6677662 Clamp and heat block assembly for wire bonding a semiconductor package assembly |
01/13/2004 | US6677659 Method for fabricating 3-dimensional solenoid and device fabricated |
01/13/2004 | US6677636 Structure for reducing contact aspect ratios |
01/13/2004 | US6677623 Bed structure underlying electrode pad of semiconductor device and method for manufacturing same |
01/13/2004 | US6677608 Semiconductor device for detecting gate defects |
01/13/2004 | US6677580 Photo-interrupter and semiconductor device using it |
01/13/2004 | US6677557 Ceramic heater |
01/13/2004 | US6677555 Optical device module using integral heat transfer module |
01/13/2004 | US6677552 System and method for laser micro-machining |
01/13/2004 | US6677522 Package for electronic component |
01/13/2004 | US6677248 Coaxial type signal line and manufacturing method thereof |