| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/20/2004 | US6679317 Cooling device boiling and cooling refrigerant, with main wick and auxiliary wick |
| 01/20/2004 | US6679316 Passive thermal spreader and method |
| 01/20/2004 | US6679315 Small scale chip cooler assembly |
| 01/20/2004 | US6679081 Pumped liquid cooling system using a phase change refrigerant |
| 01/20/2004 | US6678951 Method of forming electrical interconnects having electromigration-inhibiting plugs |
| 01/20/2004 | US6678950 For an integrated circuit. |
| 01/20/2004 | US6678949 Process for forming a multi-level thin-film electronic packaging structure |
| 01/15/2004 | WO2004006640A1 Heat exchanger |
| 01/15/2004 | WO2004006637A1 Wiring pattern structure and method for forming bump |
| 01/15/2004 | WO2004006628A1 Hygroscopic molding |
| 01/15/2004 | WO2004006382A1 Electrical system, especially a microelectronic or microelectromechanical high frequency system |
| 01/15/2004 | WO2004006332A1 Modular board device and high frequency module and method for producing them |
| 01/15/2004 | WO2004006331A1 Multilayer wiring circuit module and method for fabricating the same |
| 01/15/2004 | WO2004006330A1 Method and apparatus using nanotubes for cooling and grounding die |
| 01/15/2004 | WO2004006329A1 Thin-film substrate having post via |
| 01/15/2004 | WO2004006328A1 Semiconductor device and method for manufacturing same |
| 01/15/2004 | WO2004006325A1 Flexible wiring base material and process for producing the same |
| 01/15/2004 | WO2004006323A1 Thin-film electronic device, in particular power device, and method for making same |
| 01/15/2004 | WO2004006290A2 Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors |
| 01/15/2004 | WO2004005566A2 Method for making a composite product and in particular a heat sink |
| 01/15/2004 | WO2004005424A1 Oxygen-scavenging packaging |
| 01/15/2004 | WO2004005190A1 Anomalous expansion materials |
| 01/15/2004 | WO2003092045A3 Method for producing an electrical circuit |
| 01/15/2004 | WO2003090283A3 Semiconductor component comprising an integrated capacitor structure that has a plurality of metallization planes |
| 01/15/2004 | WO2003066248A3 Device and method for disabling electronic devices |
| 01/15/2004 | WO2002095801A8 Improved connection assembly for integrated circuit sensors |
| 01/15/2004 | WO2002047139A3 Methode of forming a copper film on a substrate |
| 01/15/2004 | US20040010717 Apparatus and method for preventing digital media piracy |
| 01/15/2004 | US20040009686 Socket having foam metal contacts |
| 01/15/2004 | US20040009683 Method for connecting electronic device |
| 01/15/2004 | US20040009664 Method to encapsulate copper plug for interconnect metallization |
| 01/15/2004 | US20040009661 Semiconductor device and method of manufacturing the same |
| 01/15/2004 | US20040009658 Preparation process for semiconductor device |
| 01/15/2004 | US20040009657 Structures to mechanically stabilize isolated top-level metal lines |
| 01/15/2004 | US20040009654 Method of forming metal wiring |
| 01/15/2004 | US20040009649 Wafer bonding of thinned electronic materials and circuits to high performance substrates |
| 01/15/2004 | US20040009647 Method of manufacturing semiconductor device |
| 01/15/2004 | US20040009638 Semiconductor device |
| 01/15/2004 | US20040009631 Semiconductor package with circuit side polymer layer and wafer level fabrication method |
| 01/15/2004 | US20040009630 Semiconductor device and method for manufacturing the same |
| 01/15/2004 | US20040009629 Electrode forming method in circuit device and chip package and multilayer board using the same |
| 01/15/2004 | US20040009628 Fabrication method of substrate on chip CA ball grid array package |
| 01/15/2004 | US20040009615 Method of fabricating a contact structure having a composite barrier layer between a platinum layer and a polysilicon plug |
| 01/15/2004 | US20040009353 PCM/aligned fiber composite thermal interface |
| 01/15/2004 | US20040009307 Vapor depositing a metal oxide layer on a substrate, by oxidation with a generated plasma of metal compounds and oxygen; plasma enhanced chemical vapor deposition |
| 01/15/2004 | US20040009292 Including one or more water soluble gold compounds, gold complexing agents, organic stabilizer compounds, and carboxylic acid uniformity enhancers; for printed wiring board substrates, integrated circuits, lead frames, pads |
| 01/15/2004 | US20040008812 Ball grid array x-ray orientation mark |
| 01/15/2004 | US20040008491 Heat dissipation apparatus |
| 01/15/2004 | US20040008488 Fan holder for heat sink |
| 01/15/2004 | US20040008487 Cooling device for electronic element producing concentrated heat and electronic device |
| 01/15/2004 | US20040008485 Electronic apparatus |
| 01/15/2004 | US20040008475 Electronic apparatus |
| 01/15/2004 | US20040008466 Multi-functional energy conditioner |
| 01/15/2004 | US20040007918 Shared on-chip decoupling capacitor and heat-sink devices |
| 01/15/2004 | US20040007784 Self-healing polymer compositions |
| 01/15/2004 | US20040007783 Semiconductor device with terminals, and method of manufacturing the same |
| 01/15/2004 | US20040007782 Connecting circuit devices and assemblies thereof |
| 01/15/2004 | US20040007780 Particle-filled semiconductor attachment material |
| 01/15/2004 | US20040007779 Wafer-level method for fine-pitch, high aspect ratio chip interconnect |
| 01/15/2004 | US20040007778 Semiconductor integrated circuit device |
| 01/15/2004 | US20040007777 Semiconductor integrated circuit |
| 01/15/2004 | US20040007776 Multi-substrate layer semiconductor packages and method for making same |
| 01/15/2004 | US20040007775 Semiconductor package and fabrication method of the same |
| 01/15/2004 | US20040007774 Compatible with surface-mount technology (SMT); reduced size; length of signal paths reduced to reduce noise and decrease power requirements; electroconductive contacts are arranged in rows and columns on the insulative substrate |
| 01/15/2004 | US20040007772 Power semiconductor device |
| 01/15/2004 | US20040007771 Semiconductor package and method for fabricating the smae |
| 01/15/2004 | US20040007770 Semiconductor-mounting substrate used to manufacture electronic packages, and production process for producing such semiconductor-mounting substrate |
| 01/15/2004 | US20040007769 Solvent-free thermosetting resin composition, process for producing the same, and product therefrom |
| 01/15/2004 | US20040007765 Semiconductor device and method of fabricating the same |
| 01/15/2004 | US20040007763 Method and resulting structure for manufacturing semiconductor substrates |
| 01/15/2004 | US20040007759 Selectable capacitance apparatus and methods |
| 01/15/2004 | US20040007745 Semiconductor device haivng silicide film formed in a part of source-drain diffusion layers and method of manufacturing the same |
| 01/15/2004 | US20040007742 Pure silcide ESD protection device |
| 01/15/2004 | US20040007727 Semiconductor memory device and fabrication method thereof using damascene bitline process |
| 01/15/2004 | US20040007661 Photoconductive switch module and manufacturing method thereof |
| 01/15/2004 | US20040007611 Asymmetric plating |
| 01/15/2004 | US20040007384 Electronic device |
| 01/15/2004 | US20040007383 Package for mounting semiconductor device |
| 01/15/2004 | US20040006869 Method of manufacturing sheet material and method of manufacturing circuit device using the same |
| 01/15/2004 | DE4415375B4 Filmträger und Verfahren zu dessen Herstellung Film support and process for its preparation |
| 01/15/2004 | DE20317408U1 Mounting system for fan type heat energy transfer device that is fixed to a heat sink in an electronic system has a spring clamping arrangement |
| 01/15/2004 | DE20213057U1 Valve pump, e.g. for electronic component cooling system, has arrangement for generating reversible magnetic field along displacement axis alternately driven to produce field in one or other direction |
| 01/15/2004 | DE19609202B4 Photomaske zur Strukturierung einer Supraleiterschicht, Supraleiterschicht und Verfahren zur Bestimmung des Ausmaßes einer Unterätzung bei der Strukturierung einer Supraleiterschicht Photomask for patterning a superconducting layer, superconductor layer, and method for determining the extent of under-etching during the patterning of the superconductor layer |
| 01/15/2004 | DE10328183A1 Elektrisches Bauelement, insbesondere mikroelektronisches oder mikroelektromechanisches Hochfrequenzbauelement und Verfahren zu dessen Herstellung Electrical component, in particular microelectronic, or microelectromechanical high-frequency component and process for its preparation |
| 01/15/2004 | DE10327945A1 Halbleiterspeichervorrichtungen und Verfahren zur Herstellung derselben unter Verwendung von Seitenwandabstandshaltern Semiconductor memory devices and methods of making the same using sidewall spacers |
| 01/15/2004 | DE10229711A1 Halbleitermodul Semiconductor module |
| 01/15/2004 | DE10229532A1 Kühlvorrichtung für Halbleiterbauelemente o. dgl. Einrichtungen Cooling device for semiconductor devices o. The like. Facilities |
| 01/15/2004 | DE10229463A1 Halbleiteranordnung Semiconductor device |
| 01/15/2004 | DE10228593A1 Elektronisches Bauteil mit einer Gehäusepackung Electronic device having a housing package |
| 01/15/2004 | DE10228344A1 Verfahren zur Herstellung von Mikrostrukturen sowie Anordnung von Mikrostrukturen A process for the fabrication of microstructures, and arrangement of microstructures |
| 01/15/2004 | DE10227663A1 Verfahren zum Versiegeln poröser Materialien bei der Chipherstellung und Verbindungen hierfür A method for sealing porous materials in chip manufacture and for this compounds |
| 01/15/2004 | DE10227658A1 Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat A metal-ceramic substrate for electrical circuits -or- modules, method of making such a substrate and module substrate having such a |
| 01/15/2004 | DE10227615A1 Schicht-Anordnung und Verfahren zum Herstellen einer Schicht-Anordnung Layer arrangement and method for producing a layer arrangement |
| 01/15/2004 | DE10227342A1 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
| 01/15/2004 | DE10227106A1 Halbleitermodul Semiconductor module |
| 01/15/2004 | DE10227059A1 Verpackung für Halbleiter-Bauelemente und Verfahren zum Herstellen derselben Packaging for semiconductor devices and methods for manufacturing the same |
| 01/15/2004 | DE10227008A1 Kühlvorrichtung für Halbleitermodule Cooling device for semiconductor modules |
| 01/15/2004 | CA2491915A1 Anomalous expansion materials |
| 01/14/2004 | EP1381258A1 High-frequency module |
| 01/14/2004 | EP1381084A1 Semiconductor device and method of its fabrication |