| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/21/2004 | EP1381650A1 Addition-curable silicone gel composition |
| 01/21/2004 | CN2600920Y Vacuum liquid filling device for miniature heat pipe |
| 01/21/2004 | CN2600919Y One-way airflow hollow cavity energy tranfering device |
| 01/21/2004 | CN2600918Y Closed loop heat pipe heat-exchange cooling device |
| 01/21/2004 | CN2600917Y Direct heat-conducting insulating wafer type commutation device water cooling device |
| 01/21/2004 | CN2600824Y Testing device connector |
| 01/21/2004 | CN1470071A Semiconductor arrangement and method for production thereof |
| 01/21/2004 | CN1470070A Electronic assembly comprising interposer with embedded capacitors and methods of manufacture |
| 01/21/2004 | CN1470069A Electronic assembly comprisnig substrate with embedded capacitors and methods of manufacture |
| 01/21/2004 | CN1470068A Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchip bonding |
| 01/21/2004 | CN1470067A 倒装片衬底设计 Flip-chip substrate design |
| 01/21/2004 | CN1470013A Active cooling system for CPU and semiconductors also enabling thermal acceleration |
| 01/21/2004 | CN1469890A Die-attaching paste and semiconductor device |
| 01/21/2004 | CN1469702A Cooling apparatus, producing method and portable equipment thereof |
| 01/21/2004 | CN1469701A Cooling apparatus for electronic machine |
| 01/21/2004 | CN1469700A Heat-dissipating module with heat accumulator |
| 01/21/2004 | CN1469696A Distributing base board, displaying device and method for producing distributing base board |
| 01/21/2004 | CN1469476A Semiconductor integrated circuit apparatus |
| 01/21/2004 | CN1469475A Semiconductor |
| 01/21/2004 | CN1469472A Optical interconnecting integrated circuit, method for producing optical interconnecting integrated circuit, photoelectrical apparatus and electronic instrument |
| 01/21/2004 | CN1469469A Power semiconductor device |
| 01/21/2004 | CN1469468A 保护电路 Protection circuit |
| 01/21/2004 | CN1469467A Semiconductor device and producing method thereof |
| 01/21/2004 | CN1469466A Semiconductor structure with copper fuse wire and its forming process |
| 01/21/2004 | CN1469464A 半导体器件 Semiconductor devices |
| 01/21/2004 | CN1469463A Method of forming molten through hole structure |
| 01/21/2004 | CN1469462A Heat-dissipating gain-type conductor holder |
| 01/21/2004 | CN1469461A Semiconductor device and methods for producing semiconductor device |
| 01/21/2004 | CN1469460A Thin film bearing belt for assembling electronic parts |
| 01/21/2004 | CN1469454A Method for producing contact plug of semiconductor device |
| 01/21/2004 | CN1469453A Electronic device and its producing method |
| 01/21/2004 | CN1469447A Method for producing semiconductor |
| 01/21/2004 | CN1469446A Semiconductor device and producing method thereof |
| 01/21/2004 | CN1469445A Method for producing semiconductor and heat-resisting pressure-sensitive adhesive tape |
| 01/21/2004 | CN1469444A Band composition and suppressing sintering method of low-temperature cobaking ceramic |
| 01/21/2004 | CN1469429A Method for producing thin film semiconductor and method for forming resist pattern thereof |
| 01/21/2004 | CN1469290A Product management method, program for executing products management and recorded program medium |
| 01/21/2004 | CN1469220A Electronic apparatus |
| 01/21/2004 | CN1469219A Heat conductor and its complex machining process |
| 01/21/2004 | CN1468839A Dielectric substance with block effect preventing copper diffusion |
| 01/21/2004 | CN1135912C Ceramic circuit base plate |
| 01/21/2004 | CN1135893C Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode |
| 01/21/2004 | CN1135621C Method of linear arrangement of metallic fuse section used on chip |
| 01/21/2004 | CN1135618C Semiconductor device and producing method thereof |
| 01/21/2004 | CN1135617C Lead wire frame |
| 01/21/2004 | CN1135616C 芯片罩盖 Chip cover |
| 01/21/2004 | CN1135612C Hand-held connecting/disconnecting machine |
| 01/21/2004 | CN1135610C Anisotropic conductive film and packaging method of semiconductor chip and semiconductor device |
| 01/21/2004 | CN1135609C Semiconductor device and method of fabricating the same |
| 01/21/2004 | CN1135607C Producing method of semiconductor device |
| 01/21/2004 | CN1135574C Composite magnetic material and its producing method and application |
| 01/20/2004 | US6680859 Semiconductor integrated circuit, transistor, gate oxide, cell plate of polysilicon and metal conductor with dieletric between |
| 01/20/2004 | US6680857 Unit-architecture with implemented limited bank-column-select repairability |
| 01/20/2004 | US6680848 Device and method for mounting integrated circuits on a printed circuit card |
| 01/20/2004 | US6680833 Input-output protection device for semiconductor integrated circuit |
| 01/20/2004 | US6680659 Integrated circuit interconnect system |
| 01/20/2004 | US6680646 Power integrated circuit with distributed gate driver |
| 01/20/2004 | US6680545 Semiconductor devices |
| 01/20/2004 | US6680544 Flip-chip bump arrangement for decreasing impedance |
| 01/20/2004 | US6680543 Semiconductor integrated circuit and system |
| 01/20/2004 | US6680542 Damascene structure having a metal-oxide-metal capacitor associated therewith |
| 01/20/2004 | US6680541 Having intermetal insulating film of organic siloxane type with low dielectric constant, high selectivity against resist etching, and causing no problem of delamination without using silicon oxide protective film |
| 01/20/2004 | US6680540 Multiple layers of copper wires in insulation film covered by protective film and surrounded by barrier film, in which at least one film is cobalt-boron alloy containing chromium, molybdenum, tungsten, rhenium, thallium and/or phosphorus |
| 01/20/2004 | US6680539 Semiconductor device, semiconductor device pattern designing method, and semiconductor device pattern designing apparatus |
| 01/20/2004 | US6680538 Semiconductor device for suppressing detachment of conductive layer |
| 01/20/2004 | US6680535 Semiconductor device, manufacturing method for semiconductor device and mounting method for the same |
| 01/20/2004 | US6680533 Semiconductor device with suppressed RF interference |
| 01/20/2004 | US6680532 Multi chip module |
| 01/20/2004 | US6680531 Multi-chip semiconductor package |
| 01/20/2004 | US6680530 Multi-step transmission line for multilayer packaging |
| 01/20/2004 | US6680529 Semiconductor build-up package |
| 01/20/2004 | US6680528 Electronic component and electronic equipment using the same |
| 01/20/2004 | US6680526 Socket with low inductance side contacts for a microelectronic device package |
| 01/20/2004 | US6680525 Stacked structure of an image sensor |
| 01/20/2004 | US6680524 Semiconductor device and method for fabricating the same |
| 01/20/2004 | US6680523 Semiconductor wafer with process control modules |
| 01/20/2004 | US6680520 Method and structure for forming precision MIM fusible circuit elements using fuses and antifuses |
| 01/20/2004 | US6680519 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry |
| 01/20/2004 | US6680518 Silicon substrate supporting field effect transistor and two inductors, one connected to gate of transistor configured to sample output of first inductor and other connected to source configured to drive second inductor, increasing inductance |
| 01/20/2004 | US6680512 Semiconductor device having an integral protection circuit |
| 01/20/2004 | US6680511 Integrated circuit devices providing improved short prevention |
| 01/20/2004 | US6680491 Disposing optical component between protruded portions of pair of second side walls, and fixing with adhesive filled in recessed portions of second side walls |
| 01/20/2004 | US6680484 Space efficient interconnect test multi-structure |
| 01/20/2004 | US6680474 Semiconductor calibration wafer with no charge effect |
| 01/20/2004 | US6680458 Laser marking techniques for bare semiconductor die |
| 01/20/2004 | US6680435 Electronic device and method of fabricating the same |
| 01/20/2004 | US6680249 Si-rich surface layer capped diffusion barriers |
| 01/20/2004 | US6680247 Manufacturing method of a semiconductor device |
| 01/20/2004 | US6680241 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices |
| 01/20/2004 | US6680220 Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package |
| 01/20/2004 | US6680219 Method and apparatus for die stacking |
| 01/20/2004 | US6680218 Fabrication method for vertical electronic circuit package and system |
| 01/20/2004 | US6680217 Apparatus for providing mechanical support to a column grid array package |
| 01/20/2004 | US6680213 Method and system for fabricating contacts on semiconductor components |
| 01/20/2004 | US6680123 Embedding resin |
| 01/20/2004 | US6680015 Method of manufacturing a heat sink assembly with overmolded carbon matrix |
| 01/20/2004 | US6679964 Method for integrating image sensors with optical components |
| 01/20/2004 | US6679937 Copper powders methods for producing powders and devices fabricated from same |
| 01/20/2004 | US6679712 Fixture for an electrical device |
| 01/20/2004 | US6679707 Land grid array connector and method for forming the same |