| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/22/2004 | WO2002065545A3 Overlay alignment metrology using diffraction gratings |
| 01/22/2004 | US20040015313 Method for testing a device and a test configuration including a device with a test memory |
| 01/22/2004 | US20040014889 Alkenyl-containing fluoropolymer comprising -(CF(CF3)-CF2-O)-units, an alkenyl-free, non-functional fluoropolymer comprising -((CF2)kO)- units wherein k is 1 to 6, an organohydrogensiloxane and a catalyst, in the cured state, |
| 01/22/2004 | US20040014843 Liquid epoxy resin, a curing agent, and an inorganic filler is useful for semiconductor encapsulation when the curing agent contains 5- 100% by weight of a specific aromatic amine compound of at least 99% pure, the epoxy resin and the curing |
| 01/22/2004 | US20040014842 Die-attaching paste and semiconductor device |
| 01/22/2004 | US20040014331 Semiconductor device with capacitor and process for manufacturing the device |
| 01/22/2004 | US20040014330 Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer |
| 01/22/2004 | US20040014321 Methods for manufacturing contact plugs for semiconductor devices |
| 01/22/2004 | US20040014317 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/22/2004 | US20040014313 Minimizing space; placement close to integrated circuit chip; simple; high yield |
| 01/22/2004 | US20040014312 Semiconductor device and manufacturing method thereof |
| 01/22/2004 | US20040014309 Multilayer laser trim interconnect method |
| 01/22/2004 | US20040014308 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack |
| 01/22/2004 | US20040014273 Techniques to create low K ILD for BEOL |
| 01/22/2004 | US20040014270 microelectromechanical systems (MEMS); microsensors; die protects from damage; protected from galvanic attack |
| 01/22/2004 | US20040014267 Power device and direct aluminum bonded substrate thereof |
| 01/22/2004 | US20040014266 Bonding wire for semiconductor and method of manufacturing the bonding wire |
| 01/22/2004 | US20040014260 Copper fuse structure and method for manufacturing the same |
| 01/22/2004 | US20040014259 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 01/22/2004 | US20040014257 Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package |
| 01/22/2004 | US20040014256 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators |
| 01/22/2004 | US20040014255 Thick solder mask for confining encapsulant material over selected locations of a substrate, assemblies including the solder mask, and methods |
| 01/22/2004 | US20040013860 Good mechanical properties together with high opacity properties, white inorganic pigment |
| 01/22/2004 | US20040013804 Method and apparatus for pretreating a substrate prior to electroplating |
| 01/22/2004 | US20040013397 Optical fiber arrays with precise hole sizing |
| 01/22/2004 | US20040013152 Optical semiconductor module and method of producing the same |
| 01/22/2004 | US20040012941 Low profile stacked multi-chip package and method of forming same |
| 01/22/2004 | US20040012938 Interconnect module with reduced power distribution impedance |
| 01/22/2004 | US20040012928 High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same |
| 01/22/2004 | US20040012927 Heat sink assembly with adjustable clip |
| 01/22/2004 | US20040012925 Heat transfer apparatus |
| 01/22/2004 | US20040012914 Electronic device substrate assembly with multilayer impermeable barrier and method of making |
| 01/22/2004 | US20040012911 Integrated circuit metal-insulator-metal capacitors formed of pairs of capacitors connected in antiparallel |
| 01/22/2004 | US20040012476 Fuse structure window |
| 01/22/2004 | US20040012474 Vertical transformer |
| 01/22/2004 | US20040012442 Power amplifier module for wireless communication devices |
| 01/22/2004 | US20040012298 MEMS device having electrothermal actuation and release and method for fabricating |
| 01/22/2004 | US20040012099 Stability of electrical characteristics; heat radiation |
| 01/22/2004 | US20040012098 Conductor bodies attached adhesive sheet, process for producing semiconductor device and semiconductor device |
| 01/22/2004 | US20040012097 Structure and method for fine pitch flip chip substrate |
| 01/22/2004 | US20040012096 Stack-type semiconductor package having one or more semiconductor packages stacked therein |
| 01/22/2004 | US20040012095 Semiconductor integrated device and method for manufacturing semiconductor integrated device |
| 01/22/2004 | US20040012094 Flip-chip integrated circuit package and method of assembly |
| 01/22/2004 | US20040012093 Semiconductor integrated circuit device |
| 01/22/2004 | US20040012092 Apparatus and method for reducing interference between signal lines |
| 01/22/2004 | US20040012091 Semiconductor integrated circuit device having multilevel interconnection |
| 01/22/2004 | US20040012089 Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications |
| 01/22/2004 | US20040012088 Semiconductor device having a ball grid array and a fabrication process thereof |
| 01/22/2004 | US20040012087 Method and apparatus for forming a DMD window frame with molded glass |
| 01/22/2004 | US20040012086 Method and packaging structure for optimizing warpage of flip chip organic packages |
| 01/22/2004 | US20040012085 Semiconductor device |
| 01/22/2004 | US20040012084 Apparatus and method for attaching an integrated circuit sensor to a substrate |
| 01/22/2004 | US20040012083 Electronic and optoelectronic component packaging technique |
| 01/22/2004 | US20040012081 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same |
| 01/22/2004 | US20040012080 Connection of integrated circuits |
| 01/22/2004 | US20040012079 Multiple chip semiconductor packages |
| 01/22/2004 | US20040012078 Folded tape area array package with one metal layer |
| 01/22/2004 | US20040012077 Semiconductor leadframes having dual surface finish for varied molding compound adhesion |
| 01/22/2004 | US20040012076 For use in fabrication of integrated circuit devices and integrated circuit packaging devices |
| 01/22/2004 | US20040012074 Method for forming antifuse via structure |
| 01/22/2004 | US20040012073 Semiconductor device and method of manufacturing the same |
| 01/22/2004 | US20040012072 Fuse structure window |
| 01/22/2004 | US20040012071 Comprising a portion used as a fuse |
| 01/22/2004 | US20040012065 Semiconductor integrated circuit device |
| 01/22/2004 | US20040012064 Semiconductor module and power conversion device |
| 01/22/2004 | US20040012052 Semiconductor device |
| 01/22/2004 | US20040012049 Semiconductor device |
| 01/22/2004 | US20040012044 Semiconductor device |
| 01/22/2004 | US20040011699 Plastic package base, air cavity type package and their manufacturing methods |
| 01/22/2004 | US20040011554 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby |
| 01/22/2004 | US20040011511 Thermosiphon for electronics cooling with nonuniform airflow |
| 01/22/2004 | US20040011509 Vapor augmented heatsink with multi-wick structure |
| 01/22/2004 | US20040011508 Heat sink |
| 01/22/2004 | US20040011507 Heat sink with enhanced heat spreading and compliant interface for better heat transfer |
| 01/22/2004 | US20040011503 Thermal module with temporary heat storage |
| 01/22/2004 | US20040010912 Method for making a heat sink device and product made thereby |
| 01/22/2004 | US20040010910 Heating the interfaces between the lips and substrates, made of liquid crystal polymer layers, to form closures |
| 01/22/2004 | DE19612392B4 Halbleiteranordnung mit Leiterrahmen A semiconductor device with lead frames |
| 01/22/2004 | DE10326555A1 Brücken für mikroelektromechanische Strukturen Bridges for microelectromechanical structures |
| 01/22/2004 | DE10325290A1 Sicherungskonfiguration mit modifizierter Kondensatorgrenzbereichs-Anordnung für eine Halbleiter-Speichervorrichtung Backup configuration with a modified capacitor boundary area assembly for a semiconductor memory device |
| 01/22/2004 | DE10244625A1 Wärmeabfuhrvorrichtung Heat dissipation device |
| 01/22/2004 | DE10229067A1 Optoelektronisches Bauelement und Verfahren zu dessen Herstellung Optoelectronic component and process for its preparation |
| 01/22/2004 | DE10228328A1 Elektronisches Bauelement mit einem Mehrlagensubstrat und Herstellungsverfahren An electronic device with a multi-layer substrate and manufacturing method |
| 01/22/2004 | DE10224180A1 Schaltungsanordnung zur Einstellung des Eingangswiderstandes und der Eingangskapazität eines integrierten Halbleiterschaltungschips Circuit arrangement for setting the input resistance and the input capacitance of a semiconductor integrated circuit chip |
| 01/22/2004 | DE10223176B3 Integrierte Schaltung mit sicherheitskritischen Schaltungskomponenten Integrated circuit with safety-critical circuit components |
| 01/22/2004 | DE10207671B4 Wärmetauscher Heat exchanger |
| 01/22/2004 | CA2485419A1 Member for semiconductor device |
| 01/21/2004 | EP1383369A2 Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
| 01/21/2004 | EP1383362A2 Copper paste and wiring board using the same |
| 01/21/2004 | EP1383361A2 Copper paste, wiring board using the same, and production method of wiring board |
| 01/21/2004 | EP1383182A2 System for applying a gas sorbing device on a surface and processes for the production thereof |
| 01/21/2004 | EP1383171A1 Heat sinks |
| 01/21/2004 | EP1383170A2 Thermosiphon for electronics cooling with nonuniform airflow |
| 01/21/2004 | EP1383169A1 Heat radiating member |
| 01/21/2004 | EP1383030A2 Cooling device of electronic apparatus |
| 01/21/2004 | EP1382091A2 Connection housing for an electronic component |
| 01/21/2004 | EP1382069A2 Liquid-cooled power semiconductor device heatsink |
| 01/21/2004 | EP1382068A2 Method for producing metallic bit line contacts |
| 01/21/2004 | EP1382065A1 Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 01/21/2004 | EP1382057A2 Self-coplanarity bumbing shape for flip chip |