| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/28/2004 | CN1471446A Functional alloy particles |
| 01/28/2004 | CN1471353A Printed circuit board its manufacturing method and semiconductor device |
| 01/28/2004 | CN1471172A Solid camera device and method for manufacturing same |
| 01/28/2004 | CN1471171A 半导体器件 Semiconductor devices |
| 01/28/2004 | CN1471168A Semiconductor storage module |
| 01/28/2004 | CN1471167A Modular triple chip laminate structure |
| 01/28/2004 | CN1471165A 半导体装置 Semiconductor device |
| 01/28/2004 | CN1471163A Semiconductor device and method for manufacturing semiconductor device |
| 01/28/2004 | CN1471162A Semiconductor device and method for manufacturing semiconductor device |
| 01/28/2004 | CN1471161A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/28/2004 | CN1471160A Method for manufacturing semiconductor package and potted element thereof |
| 01/28/2004 | CN1471159A Microjet array cooling heat sink |
| 01/28/2004 | CN1471158A Decoupling capacitor and radiator on sharing chip |
| 01/28/2004 | CN1471149A Lead frame, method for manufacturing semiconductor device using same |
| 01/28/2004 | CN1471147A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/28/2004 | CN1471144A Method for manufacturing semiconductor device with duoble space walls |
| 01/28/2004 | CN1471142A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/28/2004 | CN1470970A Flow-guiding radiation method and apparatus |
| 01/28/2004 | CN1470908A Liquid crystal display device integrated circuit package and glass-base chip type liquid crystal display device |
| 01/28/2004 | CN1470550A Solidifying promotor, epoxy resin composition and semiconductor device |
| 01/28/2004 | CN1136607C Apparatus and method for manufacturing semiconductor device |
| 01/28/2004 | CN1136390C Bearing for refrigerating machine compressor and compressor for refrigerating machine |
| 01/27/2004 | US6684007 Optical coupling structures and the fabrication processes |
| 01/27/2004 | US6683795 Shield cap and semiconductor package including shield cap |
| 01/27/2004 | US6683788 Operating device for heat sink |
| 01/27/2004 | US6683781 Packaging structure with low switching noises |
| 01/27/2004 | US6683767 Semiconductor integrated circuit |
| 01/27/2004 | US6683669 Apparatus and method for fabricating substrate of a liquid crystal display device and interconnects therein |
| 01/27/2004 | US6683663 Forming displays on flexible or rigid substrates by dispensing slurries; electronics |
| 01/27/2004 | US6683662 Semiconductor device and method for producing the same |
| 01/27/2004 | US6683637 Laser marking techniques |
| 01/27/2004 | US6683592 Electro-optical device |
| 01/27/2004 | US6683512 High frequency module having a laminate board with a plurality of dielectric layers |
| 01/27/2004 | US6683476 Contact ring architecture |
| 01/27/2004 | US6683468 Method and apparatus for coupling to a device packaged using a ball grid array |
| 01/27/2004 | US6683465 Electrical and electronic apparatus comprising substrates having circuits, power sources, switches, controllers and measuring instruments for determination and evaluation of void defects |
| 01/27/2004 | US6683449 Apparatus and method for detecting a mechanical component on a computer system substrate |
| 01/27/2004 | US6683388 Method and apparatus for packaging a microelectronic die |
| 01/27/2004 | US6683387 Flip chip carrier package with adapted landing pads |
| 01/27/2004 | US6683386 Low profile optically-sensitive semiconductor package |
| 01/27/2004 | US6683385 Low profile stack semiconductor package |
| 01/27/2004 | US6683384 Air isolated crossovers |
| 01/27/2004 | US6683383 Wirebond structure and method to connect to a microelectronic die |
| 01/27/2004 | US6683382 Semiconductor device having an interconnect layer with a plurality of layout regions having substantially uniform densities of active interconnects and dummy fills |
| 01/27/2004 | US6683380 Integrated circuit with bonding layer over active circuitry |
| 01/27/2004 | US6683379 Semiconductor device with reinforcing resin layer |
| 01/27/2004 | US6683377 Electrical and electronic apparatus comprising substrates having metallic and nonmetallic surfaces, chips, wires and dielectric adhesives as aperture fillers and coverings for conductors |
| 01/27/2004 | US6683375 Semiconductor die including conductive columns |
| 01/27/2004 | US6683370 Semiconductor component and method of manufacturing same |
| 01/27/2004 | US6683369 Semiconductor chip having a supporting member, tape substrate, semiconductor package having the semiconductor chip and the tape substrate |
| 01/27/2004 | US6683368 Lead frame design for chip scale package |
| 01/27/2004 | US6683365 Edge intensive antifuse device structure |
| 01/27/2004 | US6683355 Semiconductor raised source-drain structure |
| 01/27/2004 | US6683351 Semiconductor device having structures that can avoid deterioration caused by the manufacturing processing |
| 01/27/2004 | US6683339 Stud formed on different layer from bit lines |
| 01/27/2004 | US6683336 Semiconductor integrated circuit, supply method for supplying multiple supply voltages in semiconductor integrated circuit, and record medium for storing program of supply method for supplying multiple supply voltages in semiconductor integrated circuit |
| 01/27/2004 | US6683329 Semiconductor device with slot above guard ring |
| 01/27/2004 | US6683326 Semiconductor photodiode and an optical receiver |
| 01/27/2004 | US6683323 Semiconductor chip |
| 01/27/2004 | US6683322 Flexible hybrid memory element |
| 01/27/2004 | US6683250 Protected electronic assembly |
| 01/27/2004 | US6682999 Semiconductor device having multilevel interconnections and method of manufacture thereof |
| 01/27/2004 | US6682998 Methods for bumped die and wire bonded board-on-chip package |
| 01/27/2004 | US6682995 Iridium conductive electrode/barrier structure and method for same |
| 01/27/2004 | US6682993 Effective Vcc to Vss power ESD protection device |
| 01/27/2004 | US6682985 Semiconductor device and manufacturing method thereof |
| 01/27/2004 | US6682981 Stress controlled dielectric integrated circuit fabrication |
| 01/27/2004 | US6682969 Top electrode in a strongly oxidizing environment |
| 01/27/2004 | US6682959 Architecture of laser fuse box of semiconductor integrated circuit and method for fabricating the same |
| 01/27/2004 | US6682958 Method for manufacturing semiconductor device by using sealing apparatus |
| 01/27/2004 | US6682957 Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereof |
| 01/27/2004 | US6682956 Method of fabricating package having metal runner |
| 01/27/2004 | US6682955 Stacked die module and techniques for forming a stacked die module |
| 01/27/2004 | US6682953 Method for making a mounting structure for an electronic component having an external terminal electrode |
| 01/27/2004 | US6682948 Semiconductor device and method for manufacturing the same |
| 01/27/2004 | US6681982 Pillar connections for semiconductor chips and method of manufacture |
| 01/27/2004 | US6681847 Radiator fin formed by sintering operation |
| 01/27/2004 | US6681842 Cooling apparatus |
| 01/27/2004 | US6681840 Heat sink with enhanced heat spreading and compliant interface for better heat transfer |
| 01/27/2004 | US6681487 Method of manufacturing a composite overmolded heat pipe |
| 01/27/2004 | US6681482 Heatspreader for a flip chip device, and method for connecting the heatspreader |
| 01/22/2004 | WO2004008594A1 Optical semiconductor device |
| 01/22/2004 | WO2004008531A1 Lead frame for stacked semiconductor packages, stacked semiconductor packages using it, and fabrication method thereof |
| 01/22/2004 | WO2004008530A1 Member for semiconductor device |
| 01/22/2004 | WO2004008528A1 Method and wafer for maintaining ultra clean bonding pads on a wafer |
| 01/22/2004 | WO2004008518A1 Film forming method and film forming apparatus |
| 01/22/2004 | WO2004008497A2 Thermal interconnect and interface systems, methods of production and uses thereof |
| 01/22/2004 | WO2004008486A2 Wafer bonding of thinned electronic materials and circuits to high performance substrates |
| 01/22/2004 | WO2004007608A2 Self-healing polymer compositions |
| 01/22/2004 | WO2004007586A1 Process for producing organic compound, epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with the epoxy resin |
| 01/22/2004 | WO2003067653A3 Monitoring of contact hole production |
| 01/22/2004 | WO2003067646A3 Semiconductor substrate comprising an electrically isolated region, in particular for vertical integration |
| 01/22/2004 | WO2003052822A3 Method for making a non-detachable microcircuit card |
| 01/22/2004 | WO2003049183A3 Optimum power and ground bump pad and bump patterns for flip chip packaging |
| 01/22/2004 | WO2003042741A3 Multilayer monolithic electronic device and method for making same |
| 01/22/2004 | WO2003030252A3 Process for producing interconnects |
| 01/22/2004 | WO2003025974A3 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 01/22/2004 | WO2003023819A3 Apparatus with compliant electrical terminals, and methods for forming same |
| 01/22/2004 | WO2003010815A3 Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit |
| 01/22/2004 | WO2002089207A3 High performance, low cost microelectronic circuit package with interposer |