| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/29/2004 | US20040018342 Thermally conductive sheet and method for manufacturing the same |
| 01/29/2004 | US20040018297 Conductive inks for metalization in integrated polymer microsystems |
| 01/29/2004 | US20040017726 Vertical interconnection structure and methods |
| 01/29/2004 | US20040017710 Test key for detecting overlap between active area and deep trench capacitor of a DRAM and detection method thereof |
| 01/29/2004 | US20040017701 Semiconductor switching circuit device |
| 01/29/2004 | US20040017674 Low current blow trim fuse |
| 01/29/2004 | US20040017672 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 01/29/2004 | US20040017670 Multilayer ceramic substrate with a cavity |
| 01/29/2004 | US20040017668 Leadframeless package structure and method |
| 01/29/2004 | US20040017664 Semiconductor memory module |
| 01/29/2004 | US20040017662 Retaining device for heat sink |
| 01/29/2004 | US20040017661 Method and system for removing heat from an active area of an integrated circuit device |
| 01/29/2004 | US20040017660 Mounting assembly for heat sink |
| 01/29/2004 | US20040017659 Heat dissipating assembly |
| 01/29/2004 | US20040017658 Heat dissipating apparatus for interface cards |
| 01/29/2004 | US20040017656 Heat sink and package surface design |
| 01/29/2004 | US20040017419 Method of forming a through-substrate interconnect |
| 01/29/2004 | US20040017295 Electrically modifiable product labeling |
| 01/29/2004 | US20040017279 Wiring structure |
| 01/29/2004 | US20040017260 Power amplifier having high heat dissipation |
| 01/29/2004 | US20040017013 Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same |
| 01/29/2004 | US20040017012 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
| 01/29/2004 | US20040017008 Semiconductor device |
| 01/29/2004 | US20040017007 Semiconductor package and substrate thereof |
| 01/29/2004 | US20040017006 Support assembly for an integrated circuit package having solder columns |
| 01/29/2004 | US20040017005 Power semiconductor module |
| 01/29/2004 | US20040017004 Baking composites to form shaped ceramic substrates, then forming metallization layers and covering with dielectrics; supports for semiconductor or crystal resonators; electrical and electronic apparatus |
| 01/29/2004 | US20040017003 Semiconductor device and method of producing the same |
| 01/29/2004 | US20040017002 Integrated circuit device with exposed upper and lower die surfaces |
| 01/29/2004 | US20040017001 Film carrier tape for semiconductor package and manufacturing method thereof |
| 01/29/2004 | US20040017000 Integrated circuit package with exposed die surfaces and auxiliary attachment |
| 01/29/2004 | US20040016999 Semiconductor device |
| 01/29/2004 | US20040016996 Ceramic/organic hybrid substrate |
| 01/29/2004 | US20040016994 Semiconductor package and fabricating method thereof |
| 01/29/2004 | US20040016992 Esd protection device for enhancing reliability and for providing control of esd trigger voltage |
| 01/29/2004 | US20040016990 Fuse and fuse window structure |
| 01/29/2004 | US20040016982 Semiconductor device, image scanning unit including the semiconductor device, and image forming apparatus including the image scanning unit |
| 01/29/2004 | US20040016980 Semiconductor integrated device |
| 01/29/2004 | US20040016979 Semiconductor device |
| 01/29/2004 | US20040016978 Electrolytic capacitor and a fabrication method therefor |
| 01/29/2004 | US20040016970 Esd protection device coupled between two high power lines |
| 01/29/2004 | US20040016949 Semiconductor device and fabrication method thereof |
| 01/29/2004 | US20040016948 High performance system-on-chip discrete components using post passivation process |
| 01/29/2004 | US20040016946 Semiconductor device having MIM structure capacitor |
| 01/29/2004 | US20040016942 Semiconductor device and a method of manufacturing the same, a circuit board and an electronic apparatus |
| 01/29/2004 | US20040016941 Hetero-junction bipolar transistor and a manufacturing method of the same |
| 01/29/2004 | US20040016940 Semiconductor device |
| 01/29/2004 | US20040016939 Encapsulation of a stack of semiconductor dice |
| 01/29/2004 | US20040016930 Electronic device and supporting member |
| 01/29/2004 | US20040016927 Thin film transistor, liquid crystal display substrate, and their manufacture methods |
| 01/29/2004 | US20040016925 Display device and method for repairing line disconnection thereof |
| 01/29/2004 | US20040016908 Wavelength-converting casting composition and white light-emitting semiconductor component |
| 01/29/2004 | US20040016794 Method of making a circuitized substrate and the resultant circuitized substrate |
| 01/29/2004 | US20040016748 Radiator system, radiating method, thermal buffer, semiconductor module, heat spreader and substrate |
| 01/29/2004 | US20040016570 Substrate and method of manufacturing the same |
| 01/29/2004 | US20040016534 Bottom fixation type integrated circuit chip cooling structure |
| 01/29/2004 | US20040016533 Cooling apparatus |
| 01/29/2004 | US20040016532 Cooling apparatus |
| 01/29/2004 | US20040016257 Cooling system and electronic apparatus having the same |
| 01/29/2004 | DE19631046B4 Bond-Struktur Bond structure |
| 01/29/2004 | DE10318825A1 Testsystem für ferroelektrische Materialien und Edelmetallelektroden bei Halbleiterkondensatoren Test system for ferroelectric materials and precious metal electrodes in semiconductor capacitors |
| 01/29/2004 | DE10317580A1 Elektrische Vorrichtung, Kühlsystem für diese und elektrisches Fahrzeug An electrical device cooling system for this and electric vehicle |
| 01/29/2004 | DE10310536A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 01/29/2004 | DE10255621A1 Optisches Sender-Empfängermodul, Verfahren zur Herstellung desselben und das Modul verwendende elektronische Vorrichtung An optical transceiver module, method for producing the same, and the module used electronic device |
| 01/29/2004 | DE10231638A1 Integrierte Schaltungsanordnung An integrated circuit device |
| 01/29/2004 | DE10231206A1 Halbleitervorrichtung Semiconductor device |
| 01/29/2004 | DE10229542A1 Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben The same electronic device having multilayer rewiring and methods for preparing |
| 01/29/2004 | DE10229493A1 Integrierte Halbleiterstruktur Integrated semiconductor structure |
| 01/29/2004 | DE10229038A1 Mikrostrukturbauelement, insbesondere mikrostrukturiertes Hochfrequenzbauelement Microstructure device, especially micro-structured high-frequency component |
| 01/29/2004 | CA2493805A1 Interconnection system |
| 01/29/2004 | CA2493547A1 Method of preventing shift of alignment marks during rapid thermal processing |
| 01/29/2004 | CA2491719A1 Oxygen getter and method for forming it |
| 01/28/2004 | EP1385211A1 Mosfet anti-fuse structure and method for making same |
| 01/28/2004 | EP1385208A2 Folded tape area array package with one metal layer |
| 01/28/2004 | EP1385206A2 Method and system for removing heat from an active area of an integrated circuit device |
| 01/28/2004 | EP1385205A2 Moisture-sensitive device protection system |
| 01/28/2004 | EP1385204A2 Copper paste and wiring board using the same |
| 01/28/2004 | EP1385201A2 Method of fabricating dual damascene interconnections of microelectronic device |
| 01/28/2004 | EP1384738A1 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
| 01/28/2004 | EP1384567A1 Thermally conductive polymer molded article and method for producing the same |
| 01/28/2004 | EP1384396A1 Integrated cooling of a printed circuit board structure |
| 01/28/2004 | EP1384268A1 Three-dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same |
| 01/28/2004 | EP1384266A2 Arrangement comprising at least two different electronic semiconductor circuits |
| 01/28/2004 | EP1384264A2 Metal-to-metal antifuse structure and fabrication method |
| 01/28/2004 | EP1384263A2 Support for electrical circuit elements |
| 01/28/2004 | EP1384261A1 Isolated thermal interface |
| 01/28/2004 | EP1384256A2 Ordered two-phase dielectric film, and semiconductor device containing the same |
| 01/28/2004 | EP1384179A2 System and method for product yield prediction |
| 01/28/2004 | EP1384035A2 Thermoelectric device for dna genomic and proteonic chips and thermo-optical seitching circuits |
| 01/28/2004 | EP1383645A1 Graphite article having predetermined anisotropic characteristics and process therefor |
| 01/28/2004 | EP1383644A2 Anisotropic thermal solution |
| 01/28/2004 | EP0897256B1 Semiconductor device |
| 01/28/2004 | CN2601462Y Circuit board mounted spherical contact array encapsulated chip |
| 01/28/2004 | CN2601421Y Heat abstractor of computer |
| 01/28/2004 | CN1471804A Integrated circuit carrier with recesses |
| 01/28/2004 | CN1471803A A multi-chip integrated circuit carrier |
| 01/28/2004 | CN1471802A Method of manufacturing an integrated circuit carrier |
| 01/28/2004 | CN1471801A An integrated circuit carrier |
| 01/28/2004 | CN1471734A Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| 01/28/2004 | CN1471730A Electronic circuit device and method for manufacturing the same |