| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/03/2004 | US6686663 Semiconductor device and a method of manufacturing the same |
| 02/03/2004 | US6686662 Semiconductor device barrier layer |
| 02/03/2004 | US6686660 Semiconductor device |
| 02/03/2004 | US6686659 Selectable decoupling capacitors for integrated circuit and methods of use |
| 02/03/2004 | US6686658 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same |
| 02/03/2004 | US6686657 Interposer for improved handling of semiconductor wafers and method of use of same |
| 02/03/2004 | US6686653 Miniature microdevice package and process for making thereof |
| 02/03/2004 | US6686652 Locking lead tips and die attach pad for a leadless package apparatus and method |
| 02/03/2004 | US6686651 Multi-layer leadframe structure |
| 02/03/2004 | US6686650 Connected to antenna coil via a plurality of bumps |
| 02/03/2004 | US6686649 Multi-chip semiconductor package with integral shield and antenna |
| 02/03/2004 | US6686648 Electronic component with stacked semiconductor chips and method of producing the component |
| 02/03/2004 | US6686646 Diverse band gap energy level semiconductor device |
| 02/03/2004 | US6686645 Fuse and fuse window structure |
| 02/03/2004 | US6686644 High-strength protective member of tungsten under disconnecting point of fuse; laser irradiation |
| 02/03/2004 | US6686643 Substrate with at least two metal structures deposited thereon, and method for fabricating the same |
| 02/03/2004 | US6686636 Semiconductor raised source-drain structure |
| 02/03/2004 | US6686615 Flip-chip type semiconductor device for reducing signal skew |
| 02/03/2004 | US6686606 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
| 02/03/2004 | US6686539 Tamper-responding encapsulated enclosure having flexible protective mesh structure |
| 02/03/2004 | US6686277 Method of manufacturing semiconductor device |
| 02/03/2004 | US6686273 Method of fabricating copper interconnects with very low-k inter-level insulator |
| 02/03/2004 | US6686271 Protective layers prior to alternating layer deposition |
| 02/03/2004 | US6686269 Semiconductor device having improved contact hole structure, and method of manufacturing the same |
| 02/03/2004 | US6686268 Method of forming overmolded chip scale package and resulting product |
| 02/03/2004 | US6686266 Method for forming a fuse in a semiconductor device |
| 02/03/2004 | US6686258 Method of trimming and singulating leaded semiconductor packages |
| 02/03/2004 | US6686254 Semiconductor structure and method for reducing charge damage |
| 02/03/2004 | US6686227 Method and system for exposed die molding for integrated circuit packaging |
| 02/03/2004 | US6686226 Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame |
| 02/03/2004 | US6686224 Chip manufacturing method for cutting test pads from integrated circuits by sectioning circuit chips from circuit substrate |
| 02/03/2004 | US6686223 Method for fabricating multi-chip package semiconductor device |
| 02/03/2004 | US6686222 Stacked semiconductor device manufacturing method |
| 02/03/2004 | US6686221 Method for forming packaged semiconductor device having stacked die |
| 02/03/2004 | US6686214 Method of aligning a photolithographic mask to a crystal plane |
| 02/03/2004 | US6686030 Metal/ceramic circuit board |
| 02/03/2004 | US6686015 Transferable resilient element for packaging of a semiconductor chip and method therefor |
| 02/03/2004 | US6685983 Cured vitrified host polymer, decomposing the porogen which is a nitrogenous polymer |
| 02/03/2004 | US6685853 Lithography in microelectronic fabrication to avoid the effects of charging on resists from electron beams, acid neutralizer, energy sensitive material, electronconductive material |
| 02/03/2004 | US6685817 Controlling thickness of plating over a width of a substrate |
| 02/03/2004 | US6685777 Paste applicator and paste application method for die bonding |
| 02/03/2004 | US6685454 Apparatus for filling a gap between spaced layers of a semiconductor |
| 02/03/2004 | US6684942 Heat sink |
| 02/03/2004 | US6684520 Mask-alignment detection circuit in x and y directions |
| 02/03/2004 | US6684501 Foil heat sink and a method for fabricating same |
| 02/03/2004 | US6684496 Forming chip packages by positioning and connecting die pads to frame supports, then encapsulating in plastics and hardening to form protective coatings; electrical and electronic apparatus |
| 02/03/2004 | US6684493 Vertically mountable interposer, assembly and method |
| 02/03/2004 | US6684476 Heat sink fastening structure assembly method of use |
| 01/29/2004 | WO2004010749A2 Interconnection system |
| 01/29/2004 | WO2004010502A1 Hybrid integrated circuit device |
| 01/29/2004 | WO2004010501A1 Integrated circuit arrangement |
| 01/29/2004 | WO2004010500A1 Stacked microelectronic packages |
| 01/29/2004 | WO2004010499A1 Module component |
| 01/29/2004 | WO2004010498A2 Oxygen getter and method for forming it |
| 01/29/2004 | WO2004010497A1 Semiconductor device |
| 01/29/2004 | WO2004010493A1 Method of preventing shift of alignment marks during rapid thermal processing |
| 01/29/2004 | WO2004010467A2 Low temperature dielectric deposition using aminosilane and ozone |
| 01/29/2004 | WO2004009349A1 Laminated glazing panel |
| 01/29/2004 | WO2003077411A3 Improved emitter turn-off thyristors and their drive circuits |
| 01/29/2004 | WO2003046702A3 Active cooling system for cpu |
| 01/29/2004 | WO2003034482A3 Method for selecting faulty dielectrics of a semiconductor component |
| 01/29/2004 | WO2003034467A3 Semiconductor power module |
| 01/29/2004 | WO2003032391A3 Method for forming a package for electronic components and package for electronic components |
| 01/29/2004 | WO2003032390A3 Device with power semiconductor components for controlling the power of high currents and use of said device |
| 01/29/2004 | WO2002099851A3 Temperature controlled vacuum chuck |
| 01/29/2004 | US20040019814 Architecture for controlling dissipated power in a system-on-chip and related system |
| 01/29/2004 | US20040018945 Dry thermal interface material |
| 01/29/2004 | US20040018823 On-chip differential inductor and applications thereof |
| 01/29/2004 | US20040018755 Retainer device for electronic package |
| 01/29/2004 | US20040018754 Conductive contact structure and process |
| 01/29/2004 | US20040018753 Flexible electric-contact structure for IC package |
| 01/29/2004 | US20040018744 Method for fabrication a semiconductor device having an organic insulating layer |
| 01/29/2004 | US20040018726 Patterned thin film and method of forming same |
| 01/29/2004 | US20040018718 Plug structure having low contact resistance and manufacturing method thereof |
| 01/29/2004 | US20040018717 Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens |
| 01/29/2004 | US20040018716 Semiconductor device and production method therefor |
| 01/29/2004 | US20040018713 Semiconductor component having encapsulated, bonded, interconnect contacts and method of fabrication |
| 01/29/2004 | US20040018712 Method of forming a through-substrate interconnect |
| 01/29/2004 | US20040018710 Integrated circuitry, methods of fabricating integrated circuitry, methods of forming local interconnects, and methods of forming conductive lines |
| 01/29/2004 | US20040018709 Stereolithographic methods for securing conductive elements to contacts of semiconductor device components |
| 01/29/2004 | US20040018706 Method for forming a thermal conducting trench in a semiconductor structure |
| 01/29/2004 | US20040018697 Method and structure of interconnection with anti-reflection coating |
| 01/29/2004 | US20040018693 Capacitor and semiconductor device and method for fabricating the semiconductor device |
| 01/29/2004 | US20040018671 Semiconductor processing methods of forming integrated circuitry, forming conductive lines, forming a conductive grid, forming a conductive network, forming an electrical interconnection to a node location, forming an electrical interconnection with a transistor source/drain region, and integrated circuitry |
| 01/29/2004 | US20040018667 Method and apparatus for producing a silicon wafer chip package |
| 01/29/2004 | US20040018666 Wafer level package structure and method for packaging the same |
| 01/29/2004 | US20040018665 Moisture-sensitive device protection system |
| 01/29/2004 | US20040018664 Lightweight semiconductor device and method for its manufacture |
| 01/29/2004 | US20040018663 .Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame |
| 01/29/2004 | US20040018662 Method of manufacturing a semiconductor device |
| 01/29/2004 | US20040018661 Stacked semiconductor module and method of manufacturing the same |
| 01/29/2004 | US20040018660 Method of fabricating multilayered UBM for flip chip interconnections by electroplating |
| 01/29/2004 | US20040018659 Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device |
| 01/29/2004 | US20040018658 Noise shield type multi-layered substrate and munufacturing method thereof |
| 01/29/2004 | US20040018654 Method and apparatus for electronically aligning capacitively coupled chip pads |
| 01/29/2004 | US20040018652 Modification of circuit features that are interior to a packaged integrated circuit |
| 01/29/2004 | US20040018648 Method for improved metrology of photoresist profiles |
| 01/29/2004 | US20040018452 Prepassivation before cleaning |
| 01/29/2004 | US20040018372 Etching substrate material, etching process and article obtained by etching |
| 01/29/2004 | US20040018347 Web process interconnect in electronic assemblies |