| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/05/2004 | US20040021198 Isolating temperature sensitive components from heat sources in integrated circuits |
| 02/05/2004 | US20040021196 Self-aligned vias in an integrated circuit structure |
| 02/05/2004 | US20040021192 Single die stitch bonding |
| 02/05/2004 | US20040021185 Systems and methods for improving the performance of sensing devices using oscillatory devices |
| 02/05/2004 | US20040021181 IGFET and tuning circuit |
| 02/05/2004 | US20040021180 Method to increase substrate potential in MOS transistors used in ESD protection circuits |
| 02/05/2004 | US20040021176 Integrated circuit device and electronic device |
| 02/05/2004 | US20040021157 Gate length control for semiconductor chip design |
| 02/05/2004 | US20040021156 Semiconductor switching circuit device and manufacturing method thereof |
| 02/05/2004 | US20040021153 Semiconductor device and manufacturing method thereof |
| 02/05/2004 | US20040021149 Pressure-contact type semiconductor device |
| 02/05/2004 | US20040021145 Light-emitting-element array |
| 02/05/2004 | US20040021139 Semiconductor dice having backside redistribution layer accessed using through-silicon vias, methods of fabrication and assemblies |
| 02/05/2004 | US20040021076 Contact opening metrology |
| 02/05/2004 | US20040020973 Bump formation method and bump forming apparatus to semiconductor wafer |
| 02/05/2004 | US20040020688 Bonding pads of printed circuit board capable of holding solder balls securely |
| 02/05/2004 | US20040020676 Hermetically sealed micro-device package with window |
| 02/05/2004 | US20040020673 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 02/05/2004 | US20040020634 Adjustable pedestal thermal interface |
| 02/05/2004 | US20040020513 Methods of thinning a silicon wafer using HF and ozone |
| 02/05/2004 | US20040020231 Electrical apparatus, cooling system therefor, and electric vehicle |
| 02/05/2004 | US20040020213 Cooling Systems |
| 02/05/2004 | US20040020046 Deforming conductive particles by application of a stress; mixing the deformed conductive particles with a binder that includes a thermosetting resin as a main component |
| 02/05/2004 | US20040020045 Method for connecting electronic parts |
| 02/05/2004 | US20040020040 Attaching a wafer to a surface of a tape structure; forming a grid of grooves in wafer to separate dies on the surface of the tape structure; causing to harden into a grid shaped structure |
| 02/05/2004 | US20040020039 Multi-barrel die transfer apparatus and method for transferring dies therewith |
| 02/05/2004 | US20040020038 Positioning second surface to be closely adjacent to the first surface that has dies attached; reducing a distance between first surface and second surface until dies contact second surface and attach to the second surface; moving apart |
| 02/05/2004 | US20040020037 Die frame apparatus and method of transferring dies therewith |
| 02/05/2004 | US20040020036 Method and apparatus for high volume assembly of radio frequency identification tags |
| 02/05/2004 | DE4339786C5 Verfahren zur Herstellung einer Anordung zur Wärmeableitung A process for producing a heat dissipation arrangement for |
| 02/05/2004 | DE19908189B4 Verfahren zum Herstellen eines integrierten elektronischen Bauelementes und integriertes elektronisches Bauelement A method of manufacturing an integrated electronic component and an integrated electronic component |
| 02/05/2004 | DE19851810B4 Härtbares Harz und Harzmasse Curable resin and resin composition |
| 02/05/2004 | DE10333552A1 Leistungsverstärker mit hoher Wärmeableitung Power amplifier with high heat dissipation |
| 02/05/2004 | DE10331811A1 Leiterpaste, Verfahren zum Drucken der Leiterpaste und Verfahren zur Herstellung einer Keramikleiterplatte Conductor paste method for printing the conductor paste and method of manufacturing a ceramic circuit board |
| 02/05/2004 | DE10234493B3 Voltage sense signal generation device for power semiconductor component uses capacitive voltage divider in parallel with source-drain path |
| 02/05/2004 | DE10233836A1 Housing for electronic control unit and electronically controlled gear has peltier element to hold system below a maximum operating temperature |
| 02/05/2004 | DE10231194A1 Lead frame for a sonde magnetic field sensor on a semiconductor chip reduces eddy current production by magnetic fields |
| 02/05/2004 | DE10109542B4 Anordung zur Verbindung eines auf einer Leiterplatte angebrachten Bauelementes mit einer flexiblen Schichtanordnung Arrangement for connecting a mounted component on a circuit board with a flexible layer arrangement |
| 02/05/2004 | DE10080839B4 Verwendung einer Oberflächenbeschichtung aus einem Sol-Gel-Material auf einem Siliciumformteil zur elektronischen Passivierung Use of a surface coating of a sol-gel material on a silicon mold part for electronic passivation |
| 02/04/2004 | EP1387606A2 Device for controlling a vehicle |
| 02/04/2004 | EP1387604A1 Bonding pads of printed circuit board capable of holding solder balls securely |
| 02/04/2004 | EP1387442A1 Method of mounting camera module on wiring board |
| 02/04/2004 | EP1387415A2 Superconducting integrated circuit and method for fabrication thereof |
| 02/04/2004 | EP1387407A1 Semiconductor device and its manufacturing method |
| 02/04/2004 | EP1387404A2 Semiconductor device and method for fabricating the same |
| 02/04/2004 | EP1387403A2 Semiconductor packaging |
| 02/04/2004 | EP1387402A2 Wafer-level method for fine-pitch, high aspect ratio chip interconnect |
| 02/04/2004 | EP1387401A2 Integrated circuits and methods for their fabrication |
| 02/04/2004 | EP1387394A2 Process of final passivation of integrated circuit devices |
| 02/04/2004 | EP1387369A1 High-frequency module device |
| 02/04/2004 | EP1387367A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 02/04/2004 | EP1387146A2 Manufacturing method for magnetic sensor and lead frame therefor |
| 02/04/2004 | EP1387139A2 Heat pipe unit and heat pipe type heat exchanger |
| 02/04/2004 | EP1386398A2 Antifuse reroute of dies |
| 02/04/2004 | EP1386356A2 Fluxless flip chip interconnection |
| 02/04/2004 | EP1386355A2 Semiconductor chip having multiple conductive layers in an opening, and method for fabricating same |
| 02/04/2004 | EP1386354A2 Gallium nitride material based semiconductor devices including thermally conductive regions |
| 02/04/2004 | EP1386345A2 Method for manufacturing a semiconductor device and support plate therefor |
| 02/04/2004 | EP1386333A1 Capacitor having improved electrodes |
| 02/04/2004 | EP1386327A1 Interface materials and methods of production and use thereof |
| 02/04/2004 | EP1385491A1 Phase change thermal interface composition having induced bonding property |
| 02/04/2004 | EP1175290B1 Method for manufacturing encapsulated electronical components |
| 02/04/2004 | CN2602416Y Integrated circuit cool-down device |
| 02/04/2004 | CN1473379A Wiring board with terminal |
| 02/04/2004 | CN1473362A Semiconductor apparatus with improved esd withstanding voltage |
| 02/04/2004 | CN1473357A Substrate processing method |
| 02/04/2004 | CN1473002A 电子机器 Electronic equipment |
| 02/04/2004 | CN1472885A Semiconductor device for making built-in drive small |
| 02/04/2004 | CN1472820A Semiconductor device and manufacture thereof |
| 02/04/2004 | CN1472813A Manuafcture of semiconductor memory device and semiconductor memory device with side wall isolating layers |
| 02/04/2004 | CN1472808A Semiconductor device |
| 02/04/2004 | CN1472807A Ultrathin stack components |
| 02/04/2004 | CN1472803A Cooling device, electronic device and loudspeaker device and manufacture of cooling device |
| 02/04/2004 | CN1472802A Cooling device, electronic device, display unit and manuafcture of cooling device |
| 02/04/2004 | CN1472801A Chip packaging substrate |
| 02/04/2004 | CN1472788A Trade mark position detecting device for integrated circuits |
| 02/04/2004 | CN1472785A Semiconductor chip fixing device and method |
| 02/04/2004 | CN1472783A Noise shielded multi-layer substrates and manufacture thereof |
| 02/04/2004 | CN1472716A 显示装置 Display device |
| 02/04/2004 | CN1472497A Dynamic heat exchanger |
| 02/04/2004 | CN1472133A Bridge for microelectromechanical structure |
| 02/04/2004 | CN1137517C Semiconductor device |
| 02/04/2004 | CN1137515C 芯片卡模块 Chip Card Module |
| 02/04/2004 | CN1137514C Semiconductor device and its producing method |
| 02/04/2004 | CN1137511C Method for galvanically forming conductor structures of high-purity copper in production of integrated circuits |
| 02/04/2004 | CN1137510C Method for making semiconductor device |
| 02/04/2004 | CN1137507C Silica stain forming method, its testing structure and manufacture |
| 02/03/2004 | US6687880 Integrated circuit having a reduced spacing between a bus and adjacent circuitry |
| 02/03/2004 | US6687842 Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element |
| 02/03/2004 | US6687133 Ground plane on 2 layer PBGA |
| 02/03/2004 | US6687125 Cooling system for integrated circuit chip |
| 02/03/2004 | US6687123 Electronic system having electronic apparatus with built-in heat generating component and cooling apparatus to cool the electronic apparatus |
| 02/03/2004 | US6687122 Multiple compressor refrigeration heat sink module for cooling electronic components |
| 02/03/2004 | US6687108 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways |
| 02/03/2004 | US6686791 Oxide anti-fuse structure utilizing high voltage transistors |
| 02/03/2004 | US6686768 Electrically-programmable interconnect architecture for easily-configurable stacked circuit arrangements |
| 02/03/2004 | US6686766 Technique to reduce reflections and ringing on CMOS interconnections |
| 02/03/2004 | US6686666 Plurality of pads formed in stackup that including dielectric and multiple signal routing layers |
| 02/03/2004 | US6686665 Solder pad structure for low temperature co-fired ceramic package and method for making the same |
| 02/03/2004 | US6686664 Structure to accommodate increase in volume expansion during solder reflow |