Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/05/2014CN103563072A High frequency package
02/05/2014CN103563071A Wiring board and high frequency module using same
02/05/2014CN103563067A A routing layer for mitigating stress in a semiconductor die
02/05/2014CN103563062A Bonded structure
02/05/2014CN103562257A Resin compositions comprising modified epoxy resins with sorbic acid
02/05/2014CN103560134A Array substrate, manufacturing method thereof and display device
02/05/2014CN103560126A ESD protection structure with low trigger voltage and high sustaining voltage
02/05/2014CN103560125A Three-dimensional flexible substrate electromagnetic shielding packaged structure and manufacturing method
02/05/2014CN103560124A Through silicon via (TSV) structure and manufacture method thereof
02/05/2014CN103560123A Lead frame with inclined bending portion
02/05/2014CN103560122A Frame csp package with bumping optimization technology and production process thereof
02/05/2014CN103560121A Frame csp package with bumping optimization technology based on chips of different sizes and production process thereof
02/05/2014CN103560120A Chemical method palladium plating copper bonding wire and preparing method thereof
02/05/2014CN103560119A Three-dimensional flexible substrate packaging structure used for multi-shield chips and three-dimensional flexible substrate manufacturing method
02/05/2014CN103560118A Bump i/o contact for semiconductor device
02/05/2014CN103560117A Heat dissipation structure for PoP encapsulation
02/05/2014CN103560116A Embedded optics in modular assemblies
02/05/2014CN103560115A Packaging method with supporting and protecting structure
02/05/2014CN103560113A Array structure and manufacturing method thereof, array substrate and display device
02/05/2014CN103560091A Power device and assembling method thereof
02/05/2014CN103558722A Array substrate, production method of array substrate and display device
02/05/2014CN103555247A Low-temperature curved high-strength plastic package glue and preparation method thereof
02/05/2014CN103554437A Halogen-free epoxy resin composition for IC packaging
02/05/2014CN102683264B Method for manufacturing semiconductor structure
02/05/2014CN102468279B Integrated circuit device and method for preparing same
02/05/2014CN102468225B Fuse structure and manufacturing method thereof
02/05/2014CN102446749B Method for achieving accurate graphic positioning during observation using scanning electron microscope
02/05/2014CN102246296B Semiconductor-sealing resin composition, method for producing semiconductor device, and semiconductor device
02/05/2014CN102066492B Curable organopolysiloxane composition and semiconductor device
02/05/2014CN102054815B 光电元件 Optoelectronics
02/05/2014CN102013673B Electronic static discharge (ESD) protecting device
02/05/2014CN101904000B Power circuit
02/05/2014CN101887853B Method for producing low-k film, semiconductor device, and method for manufacturing same
02/05/2014CN101872770B Pixel unit, coplane conversion type liquid crystal display device and manufacturing method
02/05/2014CN101656235B Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof
02/05/2014CN101630646B Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates
02/05/2014CN101350318B Electronic package and electronic device
02/04/2014US8644125 Seek scan probe (SSP) cantilever to mover wafer bond stop
02/04/2014US8644020 Cooling heat-generating electronics
02/04/2014US8643271 LED lamp module
02/04/2014US8643200 Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant
02/04/2014US8643199 Thermoset polyimides for microelectronic applications
02/04/2014US8643197 Encapsulant for a semiconductor device
02/04/2014US8643196 Structure and method for bump to landing trace ratio
02/04/2014US8643194 Dicing tape-integrated film for semiconductor back surface
02/04/2014US8643193 Semiconductor packages and electronic systems including the same
02/04/2014US8643192 Integrated circuit package with discrete components surface mounted on exposed side
02/04/2014US8643191 On-chip radial cavity power divider/combiner
02/04/2014US8643190 Through substrate via including variable sidewall profile
02/04/2014US8643189 Packaged semiconductor die with power rail pads
02/04/2014US8643188 Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector
02/04/2014US8643186 Processed wafer via
02/04/2014US8643185 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material
02/04/2014US8643184 Crosstalk polarity reversal and cancellation through substrate material tuning
02/04/2014US8643183 Long-term heat-treated integrated circuit arrangements and methods for producing the same
02/04/2014US8643182 Semiconductor film, method for manufacturing the same, and power storage device
02/04/2014US8643181 Integrated circuit packaging system with encapsulation and method of manufacture thereof
02/04/2014US8643180 Semiconductor device
02/04/2014US8643179 Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
02/04/2014US8643178 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
02/04/2014US8643177 Wafers including patterned back side layers thereon
02/04/2014US8643176 Power semiconductor chip having two metal layers on one face
02/04/2014US8643175 Multi-channel package and electronic system including the same
02/04/2014US8643173 Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
02/04/2014US8643172 Heat spreader for center gate molding
02/04/2014US8643171 Power semiconductor device
02/04/2014US8643170 Method of assembling semiconductor device including insulating substrate and heat sink
02/04/2014US8643169 Semiconductor sensor device with over-molded lid
02/04/2014US8643168 Integrated circuit package with input capacitance compensation
02/04/2014US8643167 Semiconductor package with through silicon vias and method for making the same
02/04/2014US8643166 Integrated circuit packaging system with leads and method of manufacturing thereof
02/04/2014US8643165 Semiconductor device having agglomerate terminals
02/04/2014US8643164 Package-on-package technology for fan-out wafer-level packaging
02/04/2014US8643163 Integrated circuit package-on-package stacking system and method of manufacture thereof
02/04/2014US8643161 Semiconductor device having double side electrode structure
02/04/2014US8643160 High voltage and high power boost converter with co-packaged Schottky diode
02/04/2014US8643159 Lead frame with grooved lead finger
02/04/2014US8643158 Semiconductor package and lead frame therefor
02/04/2014US8643157 Integrated circuit package system having perimeter paddle
02/04/2014US8643156 Lead frame for assembling semiconductor device
02/04/2014US8643155 Liquid crystal display and chip on film thereof
02/04/2014US8643154 Semiconductor mounting device having multiple substrates connected via bumps
02/04/2014US8643153 Semiconductor device with staggered leads
02/04/2014US8643151 Passivation layer for semiconductor devices
02/04/2014US8643150 Wafer-level package device having solder bump assemblies that include an inner pillar structure
02/04/2014US8643149 Stress barrier structures for semiconductor chips
02/04/2014US8643147 Seal ring structure with improved cracking protection and reduced problems
02/04/2014US8643139 Semiconductor device
02/04/2014US8643137 Short channel lateral MOSFET
02/04/2014US8643135 Edge termination configurations for high voltage semiconductor power devices
02/04/2014US8643112 Semiconductor device
02/04/2014US8643088 Semiconductor device and method for forming the same
02/04/2014US8643083 Electronic devices with ultraviolet blocking layers
02/04/2014US8643029 Light emitting device having a plurality of light emitting cells and package mounting the same
02/04/2014US8643021 Semiconductor device including multiple insulating films
02/04/2014US8643016 Display device having a pad in electrical contact with a circuit board
02/04/2014US8642939 Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
02/04/2014US8642902 Surface mountable device
02/04/2014US8642682 Resin composition for encapsulation and semiconductor unit encapsulated with resin
02/04/2014US8642467 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
1 ... 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 ... 2262