| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/10/2004 | US6689638 Substrate-on-chip packaging process |
| 02/10/2004 | US6689637 Method of manufacturing a multi-chip semiconductor package |
| 02/10/2004 | US6689636 Semiconductor device and fabrication method of the same |
| 02/10/2004 | US6689634 Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability |
| 02/10/2004 | US6689629 Array substrate for display, method of manufacturing array substrate for display and display device using the array substrate |
| 02/10/2004 | US6689471 Thermal management device and method of making such a device |
| 02/10/2004 | US6689186 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom |
| 02/10/2004 | US6688584 Compound structure for reduced contact resistance |
| 02/10/2004 | US6688381 Multiscale transport apparatus and methods |
| 02/10/2004 | US6688379 Heat dissipation device with high efficiency |
| 02/10/2004 | US6688377 Loop heat pipe modularized heat exchanger |
| 02/10/2004 | US6687988 Method for forming pin-form wires and the like |
| 02/10/2004 | US6687985 Method of Manufacturing a multi-layer circuit board |
| 02/10/2004 | US6687973 Optimized metal fuse process |
| 02/10/2004 | CA2178390C Imager device with integral address line repair segments |
| 02/10/2004 | CA2178389C Solid state array with supplementary crossover structure |
| 02/05/2004 | WO2004012486A1 Conductive inks for metalization in integrated polymer microsystems |
| 02/05/2004 | WO2004012485A2 Mounting surfaces for electronic devices |
| 02/05/2004 | WO2004012274A1 Semiconductor structure for imaging detectors |
| 02/05/2004 | WO2004012266A1 Electronic package substrate with back side, cavity mounted capacitors and method of fabrication therefor |
| 02/05/2004 | WO2004012265A1 Method and apparatus for electronically aligning capacitively coupled chip pads |
| 02/05/2004 | WO2004012262A2 Method for accommodating small minimum die in wire bonded area array packages |
| 02/05/2004 | WO2004012261A2 A power/ground configuration for low impedance integrated circuit |
| 02/05/2004 | WO2004012253A1 Method and device for laser beam processing of silicon substrate, and method and device for laser beam cutting of silicon wiring |
| 02/05/2004 | WO2004012226A2 Method for making an anisotropic conductive polymer film on a semiconductor wafer |
| 02/05/2004 | WO2004012107A2 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 02/05/2004 | WO2004011867A1 Heat-exchanging device |
| 02/05/2004 | WO2003083956A3 Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package |
| 02/05/2004 | WO2003073501A3 Leadframe inductors |
| 02/05/2004 | WO2003062136A3 Method and system for locally connecting microstructures |
| 02/05/2004 | WO2003044858A3 Semiconductor device and method of enveloping an integrated circuit |
| 02/05/2004 | WO2003025476A3 Microelectronic system with integral cyrocooler, and its fabrication and use |
| 02/05/2004 | WO2003017350A3 Ic-chip with protective structure |
| 02/05/2004 | US20040024551 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture |
| 02/05/2004 | US20040024482 Engineered thermal management devices and methods of the same |
| 02/05/2004 | US20040024124 A curable blends comprising a cycloalkanone solvent, is easily desolventized during film formation, also epoxy resins; good workability, used in spin coating, screen printing, adhesive layer on printed circuits |
| 02/05/2004 | US20040024106 Use for semiconductor packaging material and products in which the conductivity is requested |
| 02/05/2004 | US20040023529 Electrical connector with damage-resistant terminals |
| 02/05/2004 | US20040023488 Integrated circuit trenched features and method of producing same |
| 02/05/2004 | US20040023487 Electronic component package and method of manufacturing same |
| 02/05/2004 | US20040023483 Manufacturing method of semiconductor device |
| 02/05/2004 | US20040023482 Method for adjusting an electrical parameter on an integrated electronic component |
| 02/05/2004 | US20040023480 Semiconductor processing methods, and semiconductor assemblies |
| 02/05/2004 | US20040023466 Stacked wafer aligment method |
| 02/05/2004 | US20040023463 Heterojunction bipolar transistor and method for fabricating the same |
| 02/05/2004 | US20040023450 Semiconductor integrated circuit device and its manufacturing method |
| 02/05/2004 | US20040023445 Electronic circuit |
| 02/05/2004 | US20040023441 Edge intensive antifuse and method for making the same |
| 02/05/2004 | US20040023440 Mosfet anti-fuse structure |
| 02/05/2004 | US20040023439 Apparatus and method for manufacturing semiconductor device |
| 02/05/2004 | US20040023438 Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin |
| 02/05/2004 | US20040023436 Structure of high performance combo chip and processing method |
| 02/05/2004 | US20040023132 Requires correction of line degeneration during exposure of a miniaturized integrated circuit pattern. |
| 02/05/2004 | US20040023058 Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules |
| 02/05/2004 | US20040023011 Copper paste, wiring board using the same, and production method of wiring board |
| 02/05/2004 | US20040022960 Depositing a reactant gas containing a precursor of the dielectric film using plasma; stopping the gas supply and continuing the plasma treatment to form a dielectric layer; repeating the steps until a desired thickness is obtained. |
| 02/05/2004 | US20040022959 Method of marking substandard parts |
| 02/05/2004 | US20040022664 High heat resistance and a low electrical resistance |
| 02/05/2004 | US20040022502 Method and apparatus for hermetically sealing photonic devices |
| 02/05/2004 | US20040022102 Thermal conducting trench in a semiconductor structure and method for forming the same |
| 02/05/2004 | US20040022043 Laminated ceramic electronic component and method of producing the same |
| 02/05/2004 | US20040022038 Electronic package with back side, cavity mounted capacitors and method of fabrication therefor |
| 02/05/2004 | US20040022032 Composite electronic components |
| 02/05/2004 | US20040022031 Overmolded device with contoured surface |
| 02/05/2004 | US20040022029 Power module and power module with heat sink |
| 02/05/2004 | US20040022028 Apparatus and system for cooling electric circuitry, integrated circuit cards, and related components |
| 02/05/2004 | US20040022027 Thermal management system having porous fluid transfer element |
| 02/05/2004 | US20040022019 Method for producing input/output permutation of several conductive strips with paralell branches of an integrated circuit and resulting circuit |
| 02/05/2004 | US20040022016 Mounting surfaces for electronic devices |
| 02/05/2004 | US20040022012 Electrical insulating plate, prepreg laminate and method for producing them |
| 02/05/2004 | US20040022003 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 02/05/2004 | US20040021544 Integrated magnetic signal isolator with feedback |
| 02/05/2004 | US20040021534 Electronic circuit with transmission line type noise filter |
| 02/05/2004 | US20040021497 Integrated circuit, and an arrangement and method for interconnecting components of an integrated circuit |
| 02/05/2004 | US20040021477 Method for ball grid array chip packages having improved testing and stacking characteristics |
| 02/05/2004 | US20040021473 Process for measuring depth of source and drain |
| 02/05/2004 | US20040021234 Semiconductor device and manufacturing method thereof |
| 02/05/2004 | US20040021233 Vertical conduction flip-chip device with bump contacts on single surface |
| 02/05/2004 | US20040021232 Flip-chip ball grid array package for electromigration testing |
| 02/05/2004 | US20040021231 Semiconductor device and its manufacturing method |
| 02/05/2004 | US20040021229 Stacked semiconductor package and method producing same |
| 02/05/2004 | US20040021227 Semiconductor device and method for fabricating the same |
| 02/05/2004 | US20040021225 Integrated circuits including insulating spacers that extend beneath a conductive line, and methods of fabricating same |
| 02/05/2004 | US20040021224 Enhancing the effects of reducing parasitic capacitance associated with a first-layer wiring pattern |
| 02/05/2004 | US20040021223 Semiconductor device and fabrication method thereof |
| 02/05/2004 | US20040021220 Dissipates heat |
| 02/05/2004 | US20040021219 To connections to a plurality of metalized pads while allowing selective electrical isolation therebetween |
| 02/05/2004 | US20040021218 Module component |
| 02/05/2004 | US20040021216 Semiconductor device |
| 02/05/2004 | US20040021215 Power/ground configuration for low impedance integrated circuit |
| 02/05/2004 | US20040021213 Thermally-enhanced integrated circuit package |
| 02/05/2004 | US20040021212 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal |
| 02/05/2004 | US20040021211 Microelectronic adaptors, assemblies and methods |
| 02/05/2004 | US20040021210 Semiconductor packaging apparatus |
| 02/05/2004 | US20040021208 Semiconductor integrated circuit |
| 02/05/2004 | US20040021207 Dual gauge lead frame |
| 02/05/2004 | US20040021205 Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers |
| 02/05/2004 | US20040021201 Apparatus and method for forming a battery in an integrated circuit |
| 02/05/2004 | US20040021200 Edge intensive antifuse and method for making the same |
| 02/05/2004 | US20040021199 Edge intensive antifuse device structure |