| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/12/2004 | US20040026689 Encapsulated organic-electronic component, method for producing the same and use thereof |
| 02/12/2004 | US20040026681 Protosubstrates |
| 02/12/2004 | US20040026670 Mixture of silicone anf head conductive fillers; electronic interface |
| 02/12/2004 | US20040026515 Descriptor for identifying a defective die site and methods of formation |
| 02/12/2004 | US20040026484 Multi-functional solder and articles made therewith, such as microelectronic components |
| 02/12/2004 | US20040026478 Bondhead lead clamp apparatus |
| 02/12/2004 | US20040026119 Semiconductor device having amorphous barrier layer for copper metallurgy |
| 02/12/2004 | US20040026073 Heat sink |
| 02/12/2004 | US20040026044 Method and apparatus for application of adhesive tape to semiconductor devices |
| 02/12/2004 | DE20315170U1 Wärmeabführrippen-Modul Heat dissipating fins module |
| 02/12/2004 | DE19841996B4 Halbleiterbauelement im Chip-Format und Verfahren zu seiner Herstellung A semiconductor device in chip format and process for its preparation |
| 02/12/2004 | DE19840251B4 Schaltungschip, insbesondere Transponder mit Lichtschutz Circuit chip, in particular transponder with sunscreen |
| 02/12/2004 | DE19601372B4 Halbleitermodul Semiconductor module |
| 02/12/2004 | DE19500655B4 Chipträger-Anordnung zur Herstellung einer Chip-Gehäusung Chip carrier assembly for producing a chip-Gehäusung |
| 02/12/2004 | DE10335314A1 Multichip module and disconnection process has two semiconductor chips in the same housing and a temperature sensor in one chip only |
| 02/12/2004 | DE10318412A1 Halbleitervorrichtung mit einem Kondensator mit MIM-Aufbau A semiconductor device having a MIM capacitor having a structure |
| 02/12/2004 | DE10315246A1 Halbleiter-Speichermodul A semiconductor memory module |
| 02/12/2004 | DE10310809A1 Leistungshalbleitereinrichtung Power semiconductor device |
| 02/12/2004 | DE10310074A1 Halbleitervorrichtung und Verfahren zur Herstellung der Halbleitervorrichtung A semiconductor device and method of manufacturing the semiconductor device |
| 02/12/2004 | DE10306286A1 Zuleitungsrahmen, Verfahren zum Herstellen einer Halbleitervorrichtung und Verfahren zum Prüfen der elektrischen Eigenschaften kleiner Vorrichtungen unter Verwendung des Zuleitungsrahmens Lead frame, method of manufacturing a semiconductor device and method for testing the electrical properties of small devices using the lead frame |
| 02/12/2004 | DE10234995A1 Light diode arrangement including laser diodes for illumination and signaling has thermal chip connection and light diode module |
| 02/12/2004 | DE10234978A1 Surface-mounted semiconductor component used in the production of luminescent diodes in mobile telephone keypads comprises a semiconductor chip, external electrical connections, and a chip casing |
| 02/12/2004 | DE10234951A1 Production of a semiconductor module used e.g. in computers comprises applying a structured connecting layer on a substrate, applying active and/or passive switching units, connecting using a filler and applying electrical connecting units |
| 02/12/2004 | DE10234659A1 Connecting arrangement used in a chip card comprises an integrated electronic component with contact surfaces electrically insulated from each other, a switching circuit support and electrically conducting connections |
| 02/12/2004 | DE10234648A1 Semiconductor wafer with electrically connected contact and test surfaces and after treatment process has passive contact region and test surfaces in active component region of chip |
| 02/12/2004 | DE10233641A1 Circuit and process for connecting an integrated circuit to a substrate in chip size and wafer level packages uses a frame and elastic contact between electrical contacts |
| 02/12/2004 | DE10233607A1 Semiconductor chip and carrier are connected by wire with nail head contact points and a wedge and through contact on the carrier |
| 02/12/2004 | DE10232692A1 Cooling system for an electronic device has fluid circulated around a cooling loop by a piezo electric oscillated diaphragm pumping unit |
| 02/12/2004 | DE10230712A1 Electronic unit used in precision electronics comprises a strip conductor system with power components arranged on an insulating layer made from a sintered electrically insulating polymer layer on a low melting metallic support |
| 02/12/2004 | DE10228770A1 Dielektrikum mit Sperrwirkung gegen Kupferdiffusion Dielectric barrier action against copper diffusion |
| 02/12/2004 | CA2494487A1 Method and apparatus for high volume assembly of radio frequency identification tags |
| 02/11/2004 | EP1388988A2 Chip-scale coils and isolators based thereon |
| 02/11/2004 | EP1388952A1 Transceiver having shadow memory facilitating on-transceiver collection and communication of local parameters |
| 02/11/2004 | EP1388548A2 Interlayer insulating film, method for forming the same and polymer composition |
| 02/11/2004 | EP1388277A2 Method and apparatus for cooling electronic components |
| 02/11/2004 | EP1388175A2 Optical semiconductor housing with incorporated lens and shielding |
| 02/11/2004 | EP1388170A2 Bond wire tuning of rf power transistors and amplifiers |
| 02/11/2004 | EP1388169A2 Integrated circuit comprising an energy storage capacitor |
| 02/11/2004 | EP1388168A2 Method for producing an electronic component, especially a memory chip |
| 02/11/2004 | EP1388167A2 Method of removing oxide from copper bond pads |
| 02/11/2004 | EP1151033B1 Thermally conductive composite material |
| 02/11/2004 | EP0981154B1 Doping frit appropriate for the production of conductor ceramic enamels |
| 02/11/2004 | EP0882308B1 Optimizing the power connection between chip and circuit board for a power switch |
| 02/11/2004 | EP0645806B1 Semiconductor device |
| 02/11/2004 | CN2603595Y Heat conduction structure for circuit board |
| 02/11/2004 | CN2603516Y Heat-tube heat-sink for CPU of desk computer |
| 02/11/2004 | CN2603515Y Radiator |
| 02/11/2004 | CN2603514Y Radiation fin device |
| 02/11/2004 | CN2603513Y Fin for radiator |
| 02/11/2004 | CN2603512Y Radiation fin |
| 02/11/2004 | CN2603511Y Power semiconductor element capalbe of quick heat radiation |
| 02/11/2004 | CN2603510Y Contact of socket for IC |
| 02/11/2004 | CN2603509Y Chip package structure |
| 02/11/2004 | CN1475034A Semiconductor device with reduced line-to-line capacitance and cross talk noise |
| 02/11/2004 | CN1475030A Integrated circuit inductor structure and non-destructive etch depth measurement |
| 02/11/2004 | CN1474454A Integrated circuit structure with metal-metal capacitors and its forming method |
| 02/11/2004 | CN1474453A Integrated circuit and layered lead frame package |
| 02/11/2004 | CN1474451A Heat exchangin technology suitable for high heat flow temperature uniforming heat radiation |
| 02/11/2004 | CN1474450A Heat radiator and its producing method |
| 02/11/2004 | CN1474422A Electrolytic capacitor and its producing method |
| 02/11/2004 | CN1474248A Electronic device with pump for discharge liquid coolant |
| 02/11/2004 | CN1473874A Flame-retardant epoxy resin composition, semiconductor packaging material using said composition, and resin packaged semiconductor |
| 02/11/2004 | CN1138460C Method for mounting semiconductor element to circuit board, and semiconductor device |
| 02/11/2004 | CN1138314C Electric contact element and use of electric contact element |
| 02/11/2004 | CN1138305C Semiconductor structure having conductive fuse and making method thereof |
| 02/11/2004 | CN1138304C Method for improving adhesion to copper |
| 02/11/2004 | CN1138303C Resin sealing type semiconductor device and its making method |
| 02/11/2004 | CN1138302C Method for producing semiconductor device and package for semiconductor device |
| 02/11/2004 | CN1138230C Apparatus and method of maintaining cipher in interior of IC package |
| 02/10/2004 | US6690845 Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making |
| 02/10/2004 | US6690583 Carrier for electronic components |
| 02/10/2004 | US6690580 Integrated circuit structure with dielectric islands in metallized regions |
| 02/10/2004 | US6690577 Air guide |
| 02/10/2004 | US6690557 CMOS whole chip low capacitance ESD protection circuit |
| 02/10/2004 | US6690188 Method of testing a semiconductor device |
| 02/10/2004 | US6690093 Metal contact structure in semiconductor device and method for forming the same |
| 02/10/2004 | US6690092 Multilayer interconnection structure of a semiconductor device |
| 02/10/2004 | US6690091 Damascene structure with reduced capacitance using a boron carbon nitride passivation layer, etch stop layer, and/or cap layer |
| 02/10/2004 | US6690090 Semiconductor device having reliable coupling with mounting substrate |
| 02/10/2004 | US6690089 Semiconductor device having multi-chip package |
| 02/10/2004 | US6690087 Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base |
| 02/10/2004 | US6690086 Apparatus and method for reducing interposer compression during molding process |
| 02/10/2004 | US6690081 Compliant wafer-level packaging devices and methods of fabrication |
| 02/10/2004 | US6690077 Antireflective coating and field emission display device, semiconductor device and wiring line comprising same |
| 02/10/2004 | US6690074 Radiation resistant semiconductor device structure |
| 02/10/2004 | US6690069 Low voltage complement ESD protection structures |
| 02/10/2004 | US6690067 ESD protection circuit sustaining high ESD stress |
| 02/10/2004 | US6690066 Minimization and linearization of ESD parasitic capacitance in integrated circuits |
| 02/10/2004 | US6690045 Semiconductor device with reduced CMP dishing |
| 02/10/2004 | US6689690 Semiconductor device manufacturing method of forming an etching stopper film on a diffusion prevention film at a higher temperature |
| 02/10/2004 | US6689683 Method of manufacturing a semiconductor device |
| 02/10/2004 | US6689681 Semiconductor device and a method of manufacturing the same |
| 02/10/2004 | US6689680 Semiconductor device and method of formation |
| 02/10/2004 | US6689679 Semiconductor device having bumps |
| 02/10/2004 | US6689678 Process for fabricating ball grid array package for enhanced stress tolerance |
| 02/10/2004 | US6689670 High-frequency module |
| 02/10/2004 | US6689643 Adjustable 3D capacitor |
| 02/10/2004 | US6689642 Semiconductor device and manufacturing method thereof |
| 02/10/2004 | US6689640 Chip scale pin array |
| 02/10/2004 | US6689639 Method of making semiconductor device |