| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/12/2004 | WO2004013911A2 Thermal management system having porous fluid transfer element |
| 02/12/2004 | WO2004013910A1 Microelectronic adaptors, assemblies and methods |
| 02/12/2004 | WO2004013909A1 Semiconductor integrated circuit incorporating memory |
| 02/12/2004 | WO2004013646A1 Integrated magnetic signal isolator with feedback |
| 02/12/2004 | WO2004012896A1 Method and appartus for high volume assembly of radio frequency identification tags |
| 02/12/2004 | WO2003094234A3 Component |
| 02/12/2004 | WO2003086958A3 Method for producing a product having a structured surface |
| 02/12/2004 | WO2003083941A3 Heat sink and method of removing heat from power electronics components |
| 02/12/2004 | WO2003041157A3 Large area silicon carbide devices and manufacturing methods therefor |
| 02/12/2004 | WO2003028095A3 Power delivery and other systems for integrated circuits |
| 02/12/2004 | WO2003023856A3 Semiconductor structures with cavities, and methods of fabrication |
| 02/12/2004 | WO2003016205A3 Mems and method of manufacturing mems |
| 02/12/2004 | WO2002099881A3 Heatsink assembly and method of manufacturing the same |
| 02/12/2004 | US20040031004 Semiconductor integrated circuit device and fabrication method thereof |
| 02/12/2004 | US20040030517 Descriptor for identifying a defective die site and methods of formation |
| 02/12/2004 | US20040029701 Composition for insulating ceramics and insulating ceramics using the same |
| 02/12/2004 | US20040029415 Electrical connector assembly with durable mating connectors |
| 02/12/2004 | US20040029413 Film material comprising spikes and method for the production thereof |
| 02/12/2004 | US20040029411 Compliant interconnect assembly |
| 02/12/2004 | US20040029404 High performance system-on-chip passive device using post passivation process |
| 02/12/2004 | US20040029401 Organic insulating film forming method, semiconductor device manufacture method, and TFT substrate manufacture method |
| 02/12/2004 | US20040029400 Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition |
| 02/12/2004 | US20040029397 Method for fabricating semiconductor device |
| 02/12/2004 | US20040029380 Method for forming a capping layer on a copper interconnect |
| 02/12/2004 | US20040029374 Compact semiconductor structure and method for producing the same |
| 02/12/2004 | US20040029372 Semiconductor memory devices having contact pads with silicide caps thereon and related methods |
| 02/12/2004 | US20040029371 Buried digit line stack and process for making same |
| 02/12/2004 | US20040029361 Method for producing semiconductor modules and a module produced according to said method |
| 02/12/2004 | US20040029360 Wafer-level package with silicon gasket |
| 02/12/2004 | US20040029329 Method for transferring and stacking of semiconductor devices |
| 02/12/2004 | US20040029318 A substrate having a wiring comprises a plurality of recesses arranged in a direction crossing the longitudinal direction of the wiring, and wherein the thickness of the wiring is 30 nm or more at the bottom of each of the plurality of recesses; noncracking; antipeeling agents |
| 02/12/2004 | US20040029315 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 02/12/2004 | US20040029314 Semiconductor device and manufacturing method thereof |
| 02/12/2004 | US20040029312 Integrated circuit and laminated leadframe package |
| 02/12/2004 | US20040029311 Methods of and device for encapsulation and termination of electronic devices |
| 02/12/2004 | US20040029308 Method for manufacturing contact structures of wirings |
| 02/12/2004 | US20040029306 Method of search and identify reference die |
| 02/12/2004 | US20040028915 Silica-based organic film and method of manufacturing the same, and base material comprising organic film |
| 02/12/2004 | US20040028888 Three dimensional multilayer RF module having air cavities and method fabricating same |
| 02/12/2004 | US20040028882 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof |
| 02/12/2004 | US20040028821 Cyclization of polyhydroxylamide by heating; electronics |
| 02/12/2004 | US20040028152 Continuous self-calibration of internal analog signals |
| 02/12/2004 | US20040027869 Semiconductor device |
| 02/12/2004 | US20040027814 Die paddle for receiving an integrated circuit die in a plastic substrate |
| 02/12/2004 | US20040027813 Manufacturing methods for an electronic assembly with vertically connected capacitors |
| 02/12/2004 | US20040027811 Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board |
| 02/12/2004 | US20040027809 IC card and semiconductor integrated circuit device package |
| 02/12/2004 | US20040027807 Heat sink, fixing method thereof and electronic apparatus using heat sink |
| 02/12/2004 | US20040027806 Porous CPU cooler |
| 02/12/2004 | US20040027805 Heat dissipation apparatus |
| 02/12/2004 | US20040027804 Air Guide |
| 02/12/2004 | US20040027801 Method of controlling cooling system for a personal computer and personal computer |
| 02/12/2004 | US20040027800 Electronic apparatus with a pump to force out liquid coolant |
| 02/12/2004 | US20040027788 Polymer-embedded solder bumps for reliable plastic package attachment |
| 02/12/2004 | US20040027783 Structure of metal-metal capacitor |
| 02/12/2004 | US20040027771 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 02/12/2004 | US20040027477 Camera module and method for manufacturing the same |
| 02/12/2004 | US20040027343 Display device |
| 02/12/2004 | US20040027218 Latching micro magnetic relay packages and methods of packaging |
| 02/12/2004 | US20040027150 Semiconductor device downsizing its built-in driver |
| 02/12/2004 | US20040026798 Electronic device with heat conductive encasing device |
| 02/12/2004 | US20040026797 Flip chip package substrate |
| 02/12/2004 | US20040026796 Chip scale surface mounted device and process of manufacture |
| 02/12/2004 | US20040026795 Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging |
| 02/12/2004 | US20040026794 High speed I/O pad and pad/cell interconnection for flip chips |
| 02/12/2004 | US20040026793 Transceiver having shadow memory facilitating on-transceiver collection and communication of local parameters |
| 02/12/2004 | US20040026792 Flip-chip package with underfill having low density filler |
| 02/12/2004 | US20040026790 Semiconductor device and semiconductor chip for use therein |
| 02/12/2004 | US20040026789 Semiconductor device |
| 02/12/2004 | US20040026788 Method for manufacturing a semiconductor wafer |
| 02/12/2004 | US20040026787 Semiconductor device and method for fabricating the same |
| 02/12/2004 | US20040026786 Semiconductor device using an interconnect |
| 02/12/2004 | US20040026785 Semiconductor device |
| 02/12/2004 | US20040026783 Low-k dielectric film with good mechanical strength |
| 02/12/2004 | US20040026782 Semiconductor device |
| 02/12/2004 | US20040026781 Printed wiring board and production method for printed wiring board |
| 02/12/2004 | US20040026780 High-frequency semiconductor device |
| 02/12/2004 | US20040026779 Semiconductor devices with improved heat dissipation and method for fabricating same |
| 02/12/2004 | US20040026777 Semiconductor device |
| 02/12/2004 | US20040026776 Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies |
| 02/12/2004 | US20040026775 Method for protecting electronic or micromechanical components |
| 02/12/2004 | US20040026774 Integrated circuit package electrical enhancement with improved lead frame design |
| 02/12/2004 | US20040026773 Packaged microelectronic components |
| 02/12/2004 | US20040026772 Apparatus for implementing selected functionality on an integrated circuit device in an electronic device |
| 02/12/2004 | US20040026770 Power source circuit device |
| 02/12/2004 | US20040026769 Mounting structure of electronic device and method of mounting electronic device |
| 02/12/2004 | US20040026767 Wiring substrate having position information |
| 02/12/2004 | US20040026766 Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
| 02/12/2004 | US20040026764 Low-loss bipolar transistor and method of manufacturing the same |
| 02/12/2004 | US20040026762 Semiconductor device |
| 02/12/2004 | US20040026757 Modular semiconductor die package and method of manufacturing thereof |
| 02/12/2004 | US20040026754 Radio frequency identification device and method |
| 02/12/2004 | US20040026753 Semiconductor device |
| 02/12/2004 | US20040026744 Semiconductor module |
| 02/12/2004 | US20040026741 Semiconductor integrated circuit device |
| 02/12/2004 | US20040026726 Semiconductor memory device having metal contact structure and method of manufacturing the same |
| 02/12/2004 | US20040026717 Semiconductor integrated circuit device |
| 02/12/2004 | US20040026716 Semiconductor integrated circuit device |
| 02/12/2004 | US20040026715 Package for a non-volatile memory device including integrated passive devices and method for making the same |
| 02/12/2004 | US20040026693 Test structure for locating electromigration voids in dual damascene interconnects |