| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/18/2004 | CN1476618A Cascade capacitor |
| 02/18/2004 | CN1476287A Copper size and wiring board using same |
| 02/18/2004 | CN1476166A Elastic surface wave apparatus and mfg. method thereof |
| 02/18/2004 | CN1476100A Camera module and mfg. method thereof |
| 02/18/2004 | CN1476091A Electronic circuit with transmission line type noise filter |
| 02/18/2004 | CN1476089A Structure containing palladium and/or platinum middle layer and its manufacturing method |
| 02/18/2004 | CN1476088A Metal internal ligature structure |
| 02/18/2004 | CN1476087A Layer insulated film and its forming method and polymer composition |
| 02/18/2004 | CN1476086A Semiconductor device and mfg. method thereof |
| 02/18/2004 | CN1476085A Semiconductor device and mfg. method thereof circuitboard and electronic apparatus |
| 02/18/2004 | CN1476084A Heat dissipation mould set |
| 02/18/2004 | CN1476083A Cover for packaging electronic device and its mfg. method |
| 02/18/2004 | CN1476082A 半导体器件 Semiconductor devices |
| 02/18/2004 | CN1476077A Multi-layer wiring forming method and its checking method |
| 02/18/2004 | CN1476072A Semiconductor device |
| 02/18/2004 | CN1476066A Method for mfg. semiconductor device, adhesive sheet and semiconductor device therefor |
| 02/18/2004 | CN1139154C Testable electric connector for inserted grid mesh array component |
| 02/18/2004 | CN1139129C Semiconductor IC device and method for mfg. same |
| 02/18/2004 | CN1139127C Electric circuit apparatus and its producing method |
| 02/18/2004 | CN1139125C High-power microwave hybrid integrated circuit |
| 02/18/2004 | CN1139123C Fuse structure for semiconductor memory and its mfg. method |
| 02/18/2004 | CN1139122C Semiconductor device and its mfg. method |
| 02/18/2004 | CN1139121C Electronic part and making method thereof |
| 02/18/2004 | CN1139119C Radiator and its mfg. method |
| 02/18/2004 | CN1139117C Silicon nitride circuit substrate |
| 02/18/2004 | CN1139116C Integrated circuit package and computer system with the same |
| 02/18/2004 | CN1139112C Metal conductor layer of integrated circuit and its forming method |
| 02/18/2004 | CN1139111C Semiconductor device and process for production thereof |
| 02/18/2004 | CN1139017C Portable computer cooling method and computer retainer |
| 02/18/2004 | CN1138807C Solvent-free, room temp. curing reactive systems and use thereof in production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 02/18/2004 | CN1138629C Multilayer base plate |
| 02/17/2004 | US6694500 Design circuit pattern for test of semiconductor circuit |
| 02/17/2004 | US6694282 Method and device for determining an operating temperature of a semiconductor component |
| 02/17/2004 | US6693834 Device and method for detecting alignment of bit lines and bit line contacts in DRAM devices |
| 02/17/2004 | US6693819 High voltage switch circuitry |
| 02/17/2004 | US6693801 Electronic device |
| 02/17/2004 | US6693508 Protection of electrical devices with voltage variable materials |
| 02/17/2004 | US6693446 Apparatus for testing reliability of interconnection in integrated circuit |
| 02/17/2004 | US6693384 Interconnect structure for electronic devices |
| 02/17/2004 | US6693366 Electroless deposition of doped noble metals and noble metal alloys |
| 02/17/2004 | US6693364 Optical integrated circuit element package and process for making the same |
| 02/17/2004 | US6693363 Ball grid array chip packages having improved testing and stacking characteristics |
| 02/17/2004 | US6693362 Chips are densely mounted, have high operating frequencies, are mounted in arrangement that is easy to repair, and have good heat radiation property |
| 02/17/2004 | US6693361 Packaging of integrated circuits and vertical integration |
| 02/17/2004 | US6693360 Static type semiconductor memory device |
| 02/17/2004 | US6693359 Conducting members are provided at positions above conductor pattern, so that more conducting members can be arranged within same interval and distance between conducting members and die bonded thereon will be shorter |
| 02/17/2004 | US6693358 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
| 02/17/2004 | US6693357 Methods and semiconductor devices with wiring layer fill structures to improve planarization uniformity |
| 02/17/2004 | US6693356 Integrated circuit in surface of semiconductor comprising dielectric layer with hole, barrier layer over dielectric including walls and bottom of hole and operable to seal copper, transition layer with copper doping gradient |
| 02/17/2004 | US6693355 Method of manufacturing a semiconductor device with an air gap formed using a photosensitive material |
| 02/17/2004 | US6693353 Package comprising thin heat-radiating substrate of composite obtained by forming green compact of molybdenum by compression and impregnating 30 to 40% by mass of copper melt into compact, without sintering |
| 02/17/2004 | US6693350 Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure |
| 02/17/2004 | US6693349 Semiconductor chip package having a leadframe with a footprint of about the same size as the chip |
| 02/17/2004 | US6693348 Semiconductor device with power supplying unit between a semiconductor chip and a supporting substrate |
| 02/17/2004 | US6693346 Semiconductor memory module having double-sided stacked memory chip layout |
| 02/17/2004 | US6693343 Laser fuse prevented from corrosion and oxidation when fuse is blown by laser energy by annealing copper alloy between liner and dielectric cap to provide self-passivating dopant rich layer on top of fuse and at interfaces |
| 02/17/2004 | US6693342 Thin microelectronic substrates and methods of manufacture |
| 02/17/2004 | US6693336 Intergrated circuit chip package with reduced parameter offsets |
| 02/17/2004 | US6693335 Semiconductor raised source-drain structure |
| 02/17/2004 | US6693334 Semiconductor integrated circuit device |
| 02/17/2004 | US6693315 Semiconductor device with an active region and plural dummy regions |
| 02/17/2004 | US6693304 Laminated lead frame comprising plurality of lead frames and tie bar made of liquid crystal polymer insulating material for holding plurality of lead frames like laminate |
| 02/17/2004 | US6693243 Surface mounting component and mounted structure of surface mounting component |
| 02/17/2004 | US6693239 Overmolded circuit board with underfilled surface-mount component and method therefor |
| 02/17/2004 | US6693237 Sealing composition for sealing solar cell, and solar cell module and building material-integral type solar cell module using said composition |
| 02/17/2004 | US6693049 Filling with an oxyalkylated melamine, benzoguanamine, acetoguanamine, glycol uryl, urea, thiourea, guanidine, alkyleneurea or succinylamide and heating at 150-250 c, whereby no bubble is generated when the fine hole is filled. |
| 02/17/2004 | US6693046 Method of manufacturing semiconductor device having multilevel wiring |
| 02/17/2004 | US6693038 Method for forming electrical contacts through multi-level dielectric layers by high density plasma etching |
| 02/17/2004 | US6693032 Method of forming a contact structure having an anchoring portion |
| 02/17/2004 | US6693031 Formation of a metallic interlocking structure |
| 02/17/2004 | US6693029 Method of forming an insulative substrate having conductive filled vias |
| 02/17/2004 | US6693028 Semiconductor device having multilayer wiring structure and method for manufacturing the same |
| 02/17/2004 | US6693025 Local interconnect structures for integrated circuits and methods for making the same |
| 02/17/2004 | US6693020 Method of preparing copper metallization die for wirebonding |
| 02/17/2004 | US6693001 Process for producing semiconductor integrated circuit device |
| 02/17/2004 | US6692997 Thin film transistors with dual layered source/drain electrodes and manufacturing method thereof, and active matrix display device and manufacturing method thereof |
| 02/17/2004 | US6692995 Physically deposited layer to electrically connect circuit edit connection targets |
| 02/17/2004 | US6692994 A chalcogenide fuse is formed on top of the resistor; a conductive layer is deposited on top of the chalcogenide fuse for providing electrical conduction to the chalcogenide fuse. |
| 02/17/2004 | US6692992 Hardened Fe-Ni alloy for the manufacture of integrated circuit leaderframes and manufacturing process |
| 02/17/2004 | US6692991 Resin-encapsulated semiconductor device and method for manufacturing the same |
| 02/17/2004 | US6692990 Method for manufacturing a semiconductor device |
| 02/17/2004 | US6692989 Plastic molded type semiconductor device and fabrication process thereof |
| 02/17/2004 | US6692988 Method of fabricating a substrate-based semiconductor package without mold flash |
| 02/17/2004 | US6692987 BOC BGA package for die with I-shaped bond pad layout |
| 02/17/2004 | US6692978 Methods for marking a bare semiconductor die |
| 02/17/2004 | US6692898 Self-aligned conductive line for cross-point magnetic memory integrated circuits |
| 02/17/2004 | US6692610 Oled packaging |
| 02/17/2004 | US6692576 Wafer support system |
| 02/17/2004 | US6691911 Avoiding gold rich phases in the solder by using a solder consisting essentially of from 78 wt % to less than 79.5 wt % gold and the balance tin |
| 02/17/2004 | US6691770 Cooling apparatus |
| 02/17/2004 | US6691769 Heat sink for convection cooling in horizontal applications |
| 02/17/2004 | US6691768 Heatsink design for uniform heat dissipation |
| 02/17/2004 | US6691696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 02/17/2004 | US6691406 Methods of die attachment for BOC and F/C surface mount |
| 02/17/2004 | US6691398 Electronic packaging device and method |
| 02/17/2004 | CA2272653C Laser based method and system for integrated circuit repair or reconfiguration |
| 02/12/2004 | WO2004014114A1 Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 02/12/2004 | WO2004013934A1 Dielectric interconnect frame incorporating emi shield and hydrogen absorber for tile t/r modules |
| 02/12/2004 | WO2004013928A1 Transmission line and semiconductor integrated circuit device |
| 02/12/2004 | WO2004013913A1 Thin film transistor array panel |