| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/19/2004 | WO2003065469A3 Power module |
| 02/19/2004 | WO2003065449A3 Power semiconductor, and method for producing the same |
| 02/19/2004 | WO2003052813A3 Dual cure b-stageable underfill for wafer level |
| 02/19/2004 | WO2003028102A3 Modification of the function of a chip using a multi-chip housing |
| 02/19/2004 | WO2003026016A3 Image sensor with recessed planarizing layers and method for making same |
| 02/19/2004 | WO2002103791A3 Semiconductor structure implementing sacrificial material and methods for making and implementing the same |
| 02/19/2004 | WO2002068320A3 Devices having substrates with openings passing through the substrates and conductors in the openings, and methods of manufacture |
| 02/19/2004 | WO2002058145A3 Layered dielectric nanoporous materials and methods of producing same |
| 02/19/2004 | US20040034489 High frequency module board device |
| 02/19/2004 | US20040034161 Mixtures of polyepoxides, phenolic resin curing agent, zinc molybdate, polysiloxanes, polyethersiloxane copolymers and fillers, used as flameproofing casings for electronics |
| 02/19/2004 | US20040034125 Phosphonium borate catalyst containing a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and monovalent anion portion in which four specific groups are bonded to boron atom |
| 02/19/2004 | US20040033700 Electronic device manufacture |
| 02/19/2004 | US20040033689 Method for defining a dummy pattern around an alignment mark on a wafer |
| 02/19/2004 | US20040033685 Aluminum/copper clad interconnect layer for VLSI applications |
| 02/19/2004 | US20040033682 Selective passivation of exposed silicon |
| 02/19/2004 | US20040033680 Selective passivation of exposed silicon |
| 02/19/2004 | US20040033676 Electronic components and method of fabricating the same |
| 02/19/2004 | US20040033673 Method of packaging semiconductor dice employing at least one redistribution layer |
| 02/19/2004 | US20040033654 Semiconductor device and method of fabricating the same |
| 02/19/2004 | US20040033652 Method for fabricating microstructures and arrangement of microstructures |
| 02/19/2004 | US20040033644 Methods for transfer molding encapsulation of a semiconductor die with attached heat sink |
| 02/19/2004 | US20040033642 Methods for application of adhesive tape to semiconductor devices |
| 02/19/2004 | US20040033636 Testing design for flip chip connection process |
| 02/19/2004 | US20040033634 Device and method for detecting alignment of deep trench capacitors and active areas in DRAM devices |
| 02/19/2004 | US20040033381 Interlayer insulating film, method for forming the same and polymer composition |
| 02/19/2004 | US20040033373 Low kappa dielectric inorganic/organic hybrid films and methods of making |
| 02/19/2004 | US20040032720 Foldable retention device for land grid array connector assembly |
| 02/19/2004 | US20040032718 Heatsink with improved heat dissipation capability |
| 02/19/2004 | US20040032304 Energy conditioning circuit assembly |
| 02/19/2004 | US20040032279 Semiconductor device having bonding pads and probe pads |
| 02/19/2004 | US20040032031 Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates |
| 02/19/2004 | US20040032030 Laser alignment structure |
| 02/19/2004 | US20040032029 Semiconductor device and its production method |
| 02/19/2004 | US20040032028 Laminated multilayer package |
| 02/19/2004 | US20040032027 Memory cell having a thin insulation collar and memory module |
| 02/19/2004 | US20040032026 Wafer level package and the process of the same |
| 02/19/2004 | US20040032025 Flip chip package with thermometer |
| 02/19/2004 | US20040032024 Low fabrication cost, high performance, high reliability chip scale package |
| 02/19/2004 | US20040032023 Method of creating shielded structures to protect semiconductor devices |
| 02/19/2004 | US20040032022 [cavity down ball grid array package] |
| 02/19/2004 | US20040032021 Structure of a heat dissipation fin |
| 02/19/2004 | US20040032019 Semiconductor device |
| 02/19/2004 | US20040032017 Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device |
| 02/19/2004 | US20040032016 Multi chip package |
| 02/19/2004 | US20040032015 Semiconductor device |
| 02/19/2004 | US20040032014 Substrate for semiconductor package |
| 02/19/2004 | US20040032013 Semiconductor dice packages employing at least one redistribution layer and methods of fabrication |
| 02/19/2004 | US20040032011 Microelectronic assemblies incorporating inductors |
| 02/19/2004 | US20040032010 Amorphous soft magnetic shielding and keeper for MRAM devices |
| 02/19/2004 | US20040032009 Semicondutor wafer device |
| 02/19/2004 | US20040032008 Circuit configuration for setting the input resistance and the input capacitance of an integrated semiconductor circuit chip |
| 02/19/2004 | US20040031998 Electrostatic discharge protection device |
| 02/19/2004 | US20040031997 Semiconductor device, method for evaluating the same, and method for fabricating the same |
| 02/19/2004 | US20040031972 Stacked packages |
| 02/19/2004 | US20040031960 Test key and method for validating the position of a word line overlaying a trench capacitor in DRAMS |
| 02/19/2004 | US20040031952 Expoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
| 02/19/2004 | US20040031779 Method and system for calibrating a laser processing system and laser marking system utilizing same |
| 02/19/2004 | US20040031621 Packaged microelectronic component assemblies |
| 02/19/2004 | US20040031618 Radiation shielding of three dimensional multi-chip modules |
| 02/19/2004 | US20040031594 MEMS heat pumps for integrated circuit heat dissipation |
| 02/19/2004 | US20040031589 Air guide apparatus of heat sink |
| 02/19/2004 | US20040031588 Heat sink and method of removing heat from power electronics components |
| 02/19/2004 | US20040031587 Heat-exchanging fin device fro enhancing heat exchange efficiency |
| 02/19/2004 | US20040031586 Component to heat sink spring clip method and apparatus |
| 02/19/2004 | US20040031570 Apparatus for bonding a chip using an insulating adhesive tape |
| 02/19/2004 | US20040031545 Melting copper (Cu) and copper oxide (Cu2O) in a specified atmosphere of an oxygen partial pressure, and solidifying the same; Cu and Cu2O are dispersed with each other; plastic workability; use as heat-radiating board of a semiconductor |
| 02/19/2004 | US20040031340 Process condition sensing wafer and data analysis system |
| 02/19/2004 | US20040031281 MEMS heat pumps for integrated circuit heat dissipation |
| 02/19/2004 | DE20314759U1 Cooling system for use with electronic equipment uses closed circuit fluid system having evaporator and condenser |
| 02/19/2004 | DE20314755U1 Equalizing container for cooling Liquid and equalizing Liquid. losses in semiconductor cooling installations with automatic limiting of included air, in which Liquid container |
| 02/19/2004 | DE20314715U1 Cooling system has closed fluid vessel in which fluid vaporises and condenses on under side of finned heat sink |
| 02/19/2004 | DE20314532U1 Vorrichtung zur Ableitung von Wärme von elektronischen und elektrischen Bauelementen A device for dissipating heat from electronic and electrical components |
| 02/19/2004 | DE19781558B4 Schaltungskomponente für ein IC-Gehäuse und Verfahren zu deren Herstellung Circuit component for an IC package and process for their preparation |
| 02/19/2004 | DE19510318B4 Verfahren und Vorrichtung zur Herstellung epitaktischer Schichten Method and apparatus for producing epitaxial layers |
| 02/19/2004 | DE10330490A1 Metal-insulator-metal integrated circuit capacitor for integrated circuit devices, comprises pair of capacitors on integrated circuit substrate that are electrically connected in antiparallel |
| 02/19/2004 | DE10237084A1 Electrically conductive frame with a semiconductor light diode, to illuminate a mobile telephone keypad, has a layered structure with the electrical connections and an encapsulated diode chip in very small dimensions |
| 02/19/2004 | DE10236184A1 Semiconductor element for wafer level and chip scale packaging has housing joined to chip by only an adhesive layer and contacts directly connected to the plate |
| 02/19/2004 | DE10235797A1 Semiconductor chip on a carrier and connection process has foil with structured metallization giving electrical contact between chip and carrier surfaces |
| 02/19/2004 | DE10235332A1 Multiple layer switch support used in flip-chip technology comprises a semiconductor chip and/or a discrete component, a rewiring layer, an insulating layer with through-structures, and outer contact surfaces |
| 02/19/2004 | DE10234704A1 Semiconductor device comprises a semiconductor component, especially power laser diode billet, arranged on cooling element containing channel for introducing coolant and microstructures for effective heat transfer to the coolant |
| 02/19/2004 | DE10234500A1 Heat extraction in mobile radio equipment involves bringing electrical components into heat extraction contact with metal film with corrugated and/or honeycomb structure in contact with cooling body |
| 02/19/2004 | DE10135775B4 Verfahren und Vorrichtungen zum Prüfen und Auslesen der Programmierung einer Hohlraumfuse Methods and apparatus for checking and reading out the programming of a Hohlraumfuse |
| 02/18/2004 | EP1389897A1 Printed circuit board, its manufacturing method, and csp manufacturing methdo |
| 02/18/2004 | EP1389820A2 Low inductance circuit arrangement for power semiconductor moduls |
| 02/18/2004 | EP1389802A1 Protective layer for an intermediate contact plate in a power semiconductor module |
| 02/18/2004 | EP1389801A2 Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
| 02/18/2004 | EP1389753A2 Apparatus for separating heat dissipation system from CPU |
| 02/18/2004 | EP1389404A2 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
| 02/18/2004 | EP1389346A2 Dispensing process for fabrication of microelectronic packages |
| 02/18/2004 | EP1389345A1 Chip scale package with flip chip interconnect |
| 02/18/2004 | EP1389340A1 Raised on-chip inductor and method of manufacturing same |
| 02/18/2004 | EP1084482B1 Method for producing an integrated circuit card and card produced according to said method |
| 02/18/2004 | EP1018159B1 Cooling module for electronic components |
| 02/18/2004 | CN1476637A Fabrication of semiconductor devices |
| 02/18/2004 | CN1476636A Molecule component |
| 02/18/2004 | CN1476635A Integrated circuit configuration that is protected agaist analysis, and method for producing configuration |
| 02/18/2004 | CN1476634A Structure and process for reducing die corner and edge stresses in microelectronic packages |
| 02/18/2004 | CN1476633A High-frequency module board device |
| 02/18/2004 | CN1476632A substrate and method for producing same |
| 02/18/2004 | CN1476631A Direct build-up layer on encapsulated die package having moisture barrier structure |