| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/25/2004 | CN1477220A ISIC leading wire frame copper tape and its production process |
| 02/25/2004 | CN1140052C Electronic component |
| 02/25/2004 | CN1139989C Semiconductor module and power converter using the same |
| 02/25/2004 | CN1139987C Semiconductor device interconnecting structure and mfg. method thereof |
| 02/25/2004 | CN1139986C Interconnection in integrated circuit device |
| 02/25/2004 | CN1139984C semiconductor device, assembling method, and circuit baseboard and soft baseboard and mfg. method therefor |
| 02/25/2004 | CN1139983C Wafer-covered solder pad on package base board of integrated circuit |
| 02/25/2004 | CN1139978C Method for producing semiconductor device |
| 02/25/2004 | CN1139977C Semiconductor device with low dielectric constant insulating film and method of mfg. the same |
| 02/25/2004 | CN1139974C Method for producing component |
| 02/25/2004 | CN1139972C Method for making semiconductor device |
| 02/25/2004 | CN1139971C Method of manufacturing semiconductor device having multilayer wiring |
| 02/25/2004 | CN1139863C Heat radiator |
| 02/25/2004 | CN1139626C Epoxy resin composition and semiconductor device encapsulated therewith |
| 02/25/2004 | CN1139553C Barium Titanate powder, semiconductor ceramic and semiconductor ceramic electronic element |
| 02/24/2004 | US6697621 Method and apparatus for providing services in a private wireless network |
| 02/24/2004 | US6697263 Socket having frame for supporting thermal module |
| 02/24/2004 | US6697261 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 02/24/2004 | US6697257 Power semiconductor module |
| 02/24/2004 | US6697256 Fastening device for attaching a heat sink to heat producer |
| 02/24/2004 | US6697253 Liquid cooling system and personal computer using thereof |
| 02/24/2004 | US6697153 Method and apparatus for analyzing line structures |
| 02/24/2004 | US6696765 Thermal stress resistance |
| 02/24/2004 | US6696764 Multilayer thin film wirings formed on front and back surfaces of metal/alloy, then cut to expose inner electrode pads on which chips are mounted |
| 02/24/2004 | US6696763 Solder ball allocation on a chip and method of the same |
| 02/24/2004 | US6696762 Bi-level digit line architecture for high density DRAMS |
| 02/24/2004 | US6696761 Method to encapsulate copper plug for interconnect metallization |
| 02/24/2004 | US6696760 Semiconductor structure |
| 02/24/2004 | US6696758 Interconnect structures and a method of electroless introduction of interconnect structures |
| 02/24/2004 | US6696757 Contact structure for reliable metallic interconnection |
| 02/24/2004 | US6696756 Gold wire for use in semiconductor packaging and high-frequency signal transmission |
| 02/24/2004 | US6696755 Semiconductor device |
| 02/24/2004 | US6696754 Semiconductor module including a plurality of semiconductor devices detachably |
| 02/24/2004 | US6696753 Enhancement of wire bondability in semiconductor device package |
| 02/24/2004 | US6696752 Encapsulated semiconductor device with flash-proof structure |
| 02/24/2004 | US6696751 Semiconductor device and portable device having a mounting region sharing point symmetry |
| 02/24/2004 | US6696750 Semiconductor package with heat dissipating structure |
| 02/24/2004 | US6696749 Package structure having tapering support bars and leads |
| 02/24/2004 | US6696748 Stress balanced semiconductor packages, method of fabrication and modified mold segment |
| 02/24/2004 | US6696747 Semiconductor package having reduced thickness |
| 02/24/2004 | US6696746 Buried conductors |
| 02/24/2004 | US6696745 Methods for use in forming a capacitor and structures resulting from same |
| 02/24/2004 | US6696744 Integrated circuit having a micromagnetic device and method of manufacture therefor |
| 02/24/2004 | US6696732 Semiconductor device having S/D to S/D connection and isolation region between two semiconductor elements |
| 02/24/2004 | US6696731 ESD protection device for enhancing reliability and for providing control of ESD trigger voltage |
| 02/24/2004 | US6696714 Multichip semiconductor device having a hip with redundancy restoration fuse that affects a redundant memory array |
| 02/24/2004 | US6696708 Electrostatic discharge protection apparatus |
| 02/24/2004 | US6696669 Circuit and method for heating an adhesive to package or rework a semiconductor die |
| 02/24/2004 | US6696644 Polymer-embedded solder bumps for reliable plastic package attachment |
| 02/24/2004 | US6696636 By-pass rectifier element and terminal housing for solar battery modules using a by-pass rectifier element |
| 02/24/2004 | US6696635 Thermoelectrically cooling electronic devices |
| 02/24/2004 | US6696369 Method of creating shielded structures to protect semiconductor devices |
| 02/24/2004 | US6696368 Titanium boronitride layer for high aspect ratio semiconductor devices |
| 02/24/2004 | US6696359 Design layout method for metal lines of an integrated circuit |
| 02/24/2004 | US6696358 Viscous protective overlayers for planarization of integrated circuits |
| 02/24/2004 | US6696357 Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating film |
| 02/24/2004 | US6696356 Method of making a bump on a substrate without ribbon residue |
| 02/24/2004 | US6696353 Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film |
| 02/24/2004 | US6696321 High performance multi-chip flip chip package |
| 02/24/2004 | US6696320 Low profile stacked multi-chip package and method of forming same |
| 02/24/2004 | US6696319 Providing a semiconductor device; providing a switching device; forming the electrical contact devices; applying attachment element to surfaces; pressing flexible contact elements onto the contact areas, and securely connecting |
| 02/24/2004 | US6696318 Methods for forming a die package |
| 02/24/2004 | US6696317 Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin |
| 02/24/2004 | US6696315 Semiconductor device configuration with cavities of submicrometer dimensions and method of fabricating structured cavities |
| 02/24/2004 | US6696139 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board and manufacturing method of double-sided wiring board |
| 02/24/2004 | US6696103 Aluminium nitride ceramics and method for preparing the same |
| 02/24/2004 | US6695985 Electromagnetic wave suppressor sheet |
| 02/24/2004 | US6695626 Electrical connector assembly with durable mating connectors |
| 02/24/2004 | US6695045 Bladed heat sink |
| 02/24/2004 | US6695042 Adjustable pedestal thermal interface |
| 02/24/2004 | US6695041 Double heat exchange module for a portable computer |
| 02/24/2004 | US6695040 Thin planar heat distributor |
| 02/24/2004 | US6695039 Orientation insensitive thermosiphon assembly for cooling electronic components |
| 02/24/2004 | US6694613 Method for producing a printed-circuit board having projection electrodes |
| 02/24/2004 | US6694611 Method for manufacturing a thin-film structure having a reliably removable oxide layer |
| 02/24/2004 | US6694583 Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
| 02/24/2004 | CA2205967C Improved metal matrix composite |
| 02/19/2004 | WO2004016063A1 Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board |
| 02/19/2004 | WO2004016055A1 An electronic product, a body and a method of manufacturing |
| 02/19/2004 | WO2004015773A2 Semiconductor wafer having electrically connected contact and testing surfaces |
| 02/19/2004 | WO2004015772A1 Protosubstrates |
| 02/19/2004 | WO2004015771A2 Semiconductor device and method of manufacturing the same |
| 02/19/2004 | WO2004015770A1 Multi-layer circuit carrier and production thereof |
| 02/19/2004 | WO2004015769A1 Method for the production of an electrically-conducting frame, method for production of a surface mounting semiconductor component and conductor frame strips |
| 02/19/2004 | WO2004015768A1 Heat-dissipating member and joined structure |
| 02/19/2004 | WO2004015767A1 Heat dissipation device for integrated circuits |
| 02/19/2004 | WO2004015766A1 Method of fabricating a heat exchanger for regulating the temperature of multiple integrated circuit modules |
| 02/19/2004 | WO2004015765A1 Multilayer printed wiring board |
| 02/19/2004 | WO2004015764A2 Vertical system integration |
| 02/19/2004 | WO2004015762A1 Anisotropic conductivity connector, probe member, wafer inspecting device, and wafer inspecting method |
| 02/19/2004 | WO2004015761A1 Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method |
| 02/19/2004 | WO2004015760A1 Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method |
| 02/19/2004 | WO2004015758A1 Semiconductor device and method for manufacturing the same |
| 02/19/2004 | WO2004015744A2 Via programmable gate array interconnect architecture |
| 02/19/2004 | WO2004015441A2 Radio frequency identificaton device and method |
| 02/19/2004 | WO2004015432A1 Fiducial alignment marks on microelectronic spring contacts |
| 02/19/2004 | WO2004015150A2 Discontinuous carbon fiber reinforced metal matrix composite |
| 02/19/2004 | WO2004014626A1 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 02/19/2004 | WO2003098666A3 High-frequency power semiconductor module with a hollow housing and method for the production thereof |
| 02/19/2004 | WO2003095922A3 Cooling unit and flow distributing element for use in such unit |