| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/26/2004 | US20040036176 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts |
| 02/26/2004 | US20040036175 Semiconductor device and wiring forming method in semiconductor device |
| 02/26/2004 | US20040036174 Semiconductor device having a wire bond pad and method therefor |
| 02/26/2004 | US20040036172 Semiconductor device package with integrated heatspreader |
| 02/26/2004 | US20040036171 Method and apparatus for enabling a stitch wire bond in the absence of discrete bump formation, semiconductor device assemblies and electronic systems including same |
| 02/26/2004 | US20040036170 Double bumping of flexible substrate for first and second level interconnects |
| 02/26/2004 | US20040036169 Semiconductor package and semiconductor device |
| 02/26/2004 | US20040036168 Hydrogen gettering system |
| 02/26/2004 | US20040036167 High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same |
| 02/26/2004 | US20040036166 Method and system for electrically coupling a chip to chip package |
| 02/26/2004 | US20040036165 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set |
| 02/26/2004 | US20040036164 Semiconductor device and its manufacturing method |
| 02/26/2004 | US20040036163 Multi-die semiconductor package |
| 02/26/2004 | US20040036162 Integrated circuit package with heatsink support |
| 02/26/2004 | US20040036161 Semiconductor heat exchangers having thermoconductive sheets comprising metals, ceramics or glass and channels for fluid or gas flow; dissipation |
| 02/26/2004 | US20040036160 Packaged die on PCB with heat sink encapsulant and methods |
| 02/26/2004 | US20040036159 Integrated circuit having memory disposed thereon and method of making thereof |
| 02/26/2004 | US20040036158 Tab tape, method of making same and semiconductor device |
| 02/26/2004 | US20040036157 Semiconductor component with on board capacitor and method of fabrication |
| 02/26/2004 | US20040036156 Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation, and method of forming semiconductor device assembly including same |
| 02/26/2004 | US20040036154 High performance thermally enhanced package and method of fabricating the same |
| 02/26/2004 | US20040036153 Stress balanced semiconductor packages, method of fabrication and modified mold segment |
| 02/26/2004 | US20040036151 Double leadframe-based packaging structure and manufacturing process thereof |
| 02/26/2004 | US20040036150 Semiconductor device for reducing photovolatic current |
| 02/26/2004 | US20040036143 Integrated capacitor and method of making same |
| 02/26/2004 | US20040036141 Multi-concentric pad arrangements for integrated circuit pads |
| 02/26/2004 | US20040036137 Nickel bonding cap over copper metalized bondpads |
| 02/26/2004 | US20040036136 Method and system for electrically coupling a chip to chip package |
| 02/26/2004 | US20040036120 Semiconductor device |
| 02/26/2004 | US20040036098 Semiconductor device including a capacitor |
| 02/26/2004 | US20040036091 High impedance antifuse |
| 02/26/2004 | US20040036090 Semiconductor fuses, methods of using and making the same, and semiconductor devices containing the same |
| 02/26/2004 | US20040036084 Method and device for identifying the version of integrated circuits and use controling operating sequences |
| 02/26/2004 | US20040036083 Semiconductor integrated circuit device, design method for semiconductor integrated circuit device, design aiding device for semiconductor integrated circuit device, program, and program recording medium |
| 02/26/2004 | US20040036081 Chip-type LED and process of manufacturing the same |
| 02/26/2004 | US20040036076 Semiconductor device and method of manufacturing same |
| 02/26/2004 | US20040036074 Optical interconnection integrated circuit, method of manufacturing optical interconnection integrated circuit, electro-optical apparatus, and electronic apparatus |
| 02/26/2004 | US20040036068 Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration |
| 02/26/2004 | US20040035913 Apparatus of clamping semiconductor devices using sliding finger supports |
| 02/26/2004 | US20040035907 Apparatus and method for dispensing solder |
| 02/26/2004 | US20040035840 Component installation, removal, and replacement apparatus and method |
| 02/26/2004 | US20040035606 Method and apparatus for supporting a circuit component having solder column interconnects using an external support |
| 02/26/2004 | US20040035598 Electrically-conductive grid shield for semiconductors |
| 02/26/2004 | US20040035560 Heat sink assembly with fan-driven fluid circulation |
| 02/26/2004 | US20040035558 Heat dissipation tower for circuit devices |
| 02/26/2004 | US20040035557 Cooling device of electronic apparatus |
| 02/26/2004 | US20040035556 Heat-dissipating device with dissipating fins drivable to move within and ambient fluid |
| 02/26/2004 | US20040035555 Counter-stream-mode oscillating-flow heat transport apparatus |
| 02/26/2004 | US20040035554 Heatsink, method of manufacturing the same and cooling apparatus using the same |
| 02/26/2004 | US20040035519 Microelectronic joining processes |
| 02/26/2004 | US20040035245 Plastic control plate of a hydraulic gearbox control device in a motor vehicle |
| 02/26/2004 | DE19623134B4 Leiterrahmenbaugruppe für ein Halbleiterbauelement Lead frame assembly for a semiconductor device |
| 02/26/2004 | DE10334416A1 Halbleiterbaugruppe Semiconductor package |
| 02/26/2004 | DE10331801A1 Kontinuierliche Eigenkalibrierung interner analoger Signale Continuous self-calibration of internal analog signals |
| 02/26/2004 | DE10324598A1 Halbleitervorrichtung Semiconductor device |
| 02/26/2004 | DE10317892A1 Sockel mit Schaummetallkontakten Foam base with metal contacts |
| 02/26/2004 | DE10314516A1 Halbleiter-Bauelement Semiconductor component |
| 02/26/2004 | DE10309598A1 Halbleitervorrichtung mit verkleinertem eingebautem Treiber A semiconductor device having a reduced built-drivers |
| 02/26/2004 | DE10306557A1 Verfahren zum Herstellen eines elektrischen Leiterrahmens, Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements und Leiterrahmenstreifen A method of manufacturing an electrical lead frame method for producing a surface-mountable semiconductor device and lead frame strip |
| 02/26/2004 | DE10301586B3 IC has separate supply voltage networks for different circuit stages coupled together via transistor coupling circuit |
| 02/26/2004 | DE10260765A1 Integrated circuit with a wafer level package and test card for contacting the package has contact elements of differing heights |
| 02/26/2004 | DE10237716A1 Elektronik-Einheit mit wärmeleitender Folie Electronic unit with thermally conductive film |
| 02/26/2004 | DE10236278A1 Transistor outline housing for transistors used for networking computers comprises a punched part as base for supporting electronic components and closed using a cup-like cover |
| 02/26/2004 | DE10235771A1 Encapsulated chip and production process for smart labels has baseplate with conductive surrounding layer and cover plate with conductive surfaces |
| 02/26/2004 | DE10107125B4 Verfahren zum Ausbilden von Kontaktlöchern in einer integrierten Schaltungsvorrichtung durch selektives Ätzen einer Isolationsschicht, um die zu einem Halbleiterbereich benachbarte selbstausrichtende Kontaktfläche zu vergrößern, und dadurch ausgebildeter Kontakt in einer integrierten Schaltungsvorrichtung A process for forming vias in an integrated circuit device by selectively etching an insulating layer, to enlarge the neighboring semiconductor region self-aligned to a contact surface, and thereby contact formed in an integrated circuit device |
| 02/25/2004 | EP1392093A1 Method for manufacturing ceramic multilayered board |
| 02/25/2004 | EP1392091A2 Method and system for printing integrated circuit patterns |
| 02/25/2004 | EP1392088A2 Electronic unit with a thermally conductive sheet |
| 02/25/2004 | EP1391989A1 Tuning circuit and IGFET |
| 02/25/2004 | EP1391969A2 Terminal with Ruthenium Layer and part having the same |
| 02/25/2004 | EP1391966A1 Pressure contact spring and use in power semiconductor module |
| 02/25/2004 | EP1391929A2 Semiconductor device and manufacturing method for the same |
| 02/25/2004 | EP1391928A2 Chip assembly with at least two semiconductor chips and method of controlling the alignment of two adjacent semiconductor chips |
| 02/25/2004 | EP1391927A2 Concentric bonding pad arrangement on an integrated circuit |
| 02/25/2004 | EP1391926A1 Heat sink and its manufacturing method |
| 02/25/2004 | EP1391924A1 Semiconductor device and its manufacturing method, circuit board, and electric apparatus |
| 02/25/2004 | EP1391923A1 Semiconductor device and its manufacturing method, circuit board and electronic apparatus |
| 02/25/2004 | EP1391922A2 Semiconductor device mounting method, semiconductor device mounting structure, electro optical device, electro-optical device manufacturing method and electronic device |
| 02/25/2004 | EP1391853A1 Diversification of the unique identifier of an integrated circuit |
| 02/25/2004 | EP1391673A2 Flat heat transferring device and method of fabricating the same |
| 02/25/2004 | EP1391420A2 Method and apparatus for protecting wiring and integrated circuit device |
| 02/25/2004 | EP1390980A2 Semiconductor structure comprising an electrostatic discharge (esd) protection device |
| 02/25/2004 | EP1390979A2 Semiconductor die package having mesh power and ground planes |
| 02/25/2004 | EP1390692A1 Periodic patterns and technique to control misalignment |
| 02/25/2004 | EP1204948B1 Secure microcontroller against attacks based on current consumption values |
| 02/25/2004 | CN2604777Y Refrigerating photoelectric diode array PDA detector |
| 02/25/2004 | CN2604776Y Radiating apparatus |
| 02/25/2004 | CN2604775Y Radiator |
| 02/25/2004 | CN1478308A Enhanced interface thermoelectric coolers |
| 02/25/2004 | CN1478307A Enhanced interface thermoelectric coolers |
| 02/25/2004 | CN1478300A Information memory device and electrionic apparatus with mounted information memory device |
| 02/25/2004 | CN1478299A Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction |
| 02/25/2004 | CN1477923A 信号传输结构 Signal transmission structure |
| 02/25/2004 | CN1477709A Semiconductor memory device and method for making said device by adopting mosaic bit line process |
| 02/25/2004 | CN1477706A Semiconductor integrated circuit device with multi-stage interconnection |
| 02/25/2004 | CN1477705A Interconnection structure containing stress regulating covering and its mfg. method |
| 02/25/2004 | CN1477704A Elastic electroconductive resin and electronic device |
| 02/25/2004 | CN1477702A Semiconductor mounting substrate for making electronic package and its production process |
| 02/25/2004 | CN1477688A Semiconductor module and method for mfg. semiconductor module |
| 02/25/2004 | CN1477687A Process for preparing zero-shrinkage low-temp, co-fired ceramic multi-layer baseplate |