| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/02/2004 | US6698511 Vortex heatsink for high performance thermal applications |
| 03/02/2004 | US6698505 Cooler for an electronic device |
| 03/02/2004 | US6698503 Heat transferring device having adiabatic unit |
| 03/02/2004 | US6698502 Micro cooling device |
| 03/02/2004 | US6698500 Heat sink with fins |
| 03/02/2004 | US6698499 Cooling device and method |
| 03/02/2004 | US6698416 Film frame substrate fixture |
| 03/02/2004 | US6698224 Electronic apparatus having at least two electronic parts operating at different temperatures |
| 03/02/2004 | US6698086 Method for the linear configuration of metallic fuse sections on wafers |
| 03/02/2004 | US6698084 Method for manufacturing radio frequency module components with surface acoustic wave element |
| 02/26/2004 | WO2004017698A1 Cooling device for electronic apparatus |
| 02/26/2004 | WO2004017697A1 Method for heat dissipation in mobile radio devices and a corresponding mobile radio device |
| 02/26/2004 | WO2004017691A1 I-channel surface-mount connector with extended flanges |
| 02/26/2004 | WO2004017687A1 Improved structure of stacked vias in multiple layer electronic device carriers |
| 02/26/2004 | WO2004017495A1 Cooling body and rectifier module for an electrical machine |
| 02/26/2004 | WO2004017476A2 Semiconductor device with a cooling element |
| 02/26/2004 | WO2004017460A1 High-frequency wireless device with integrated antenna |
| 02/26/2004 | WO2004017410A1 Ferroelectric memory and its manufacturing method |
| 02/26/2004 | WO2004017408A2 Integrated circuit with id code and method of manufacturing same |
| 02/26/2004 | WO2004017407A1 Surface-mounted semiconductor component and method for the production thereof |
| 02/26/2004 | WO2004017406A1 Functional coating of an scfm preform |
| 02/26/2004 | WO2004017405A1 Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package |
| 02/26/2004 | WO2004017400A1 Assembly comprising a semiconductor chip and support therefor, in addition to method for a bonded wiring connection |
| 02/26/2004 | WO2004017399A1 Microelectronic packages with self-aligning features |
| 02/26/2004 | WO2004016567A1 Aluminum nitride sintered compact, metallized substrate, heater,jig and method for producing aluminum nitride sintered compact |
| 02/26/2004 | WO2004016368A1 Lead frame processing coining punch, method of manufacturing the coining punch, and lead frame |
| 02/26/2004 | WO2003098867A3 Encryption, authentication, and key management for multimedia content pre-encryption |
| 02/26/2004 | WO2003083942A3 Semiconductor device with components embedded in backside diamond layer |
| 02/26/2004 | WO2003073494A3 Method of controlling metal etch processes, and system for accomplishing same |
| 02/26/2004 | WO2003065454A3 Split-gate power module and method for suppressing oscillation therein |
| 02/26/2004 | WO2003065451A9 Flip chip die bond pads, die bond pad placement and routing optimization |
| 02/26/2004 | WO2003058713A3 Chip module for chip cards |
| 02/26/2004 | WO2003049152A3 Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices |
| 02/26/2004 | WO2003046802A3 Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof |
| 02/26/2004 | WO2003041464A3 Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| 02/26/2004 | WO2003036718A3 Pattern for improved visual inspection of semiconductor devices |
| 02/26/2004 | WO2003028101A3 Method of producing a contact system on the rear face of a component with stacked substrates |
| 02/26/2004 | WO2003010796B1 Structure and method for fabrication of a leadless chip carrier with embedded antenna |
| 02/26/2004 | WO2002067319A8 Copper interconnect structure having diffusion barrier |
| 02/26/2004 | WO2002047151B1 Method for making a semiconductor chip using an integrated rigidity layer |
| 02/26/2004 | WO2002041402A3 Discrete and packaged power devices for radio frequency (rf) applications and methods of forming same |
| 02/26/2004 | WO2002039498A3 Methods and systems for positioning substrates |
| 02/26/2004 | US20040039863 Spare input/output buffer |
| 02/26/2004 | US20040039154 The epoxy resin includes a compound having two or more epoxy groups in one molecule, a compound having two or more phenolic hydroxy groups, in a molecule, and a trisubstituted phosphoniophenolate or salt as a curing accelerator |
| 02/26/2004 | US20040039127 Electronic device using low dielectric loss tangent insulators for high frequency signals |
| 02/26/2004 | US20040038583 Spring-loaded heat sink assembly for a circuit assembly |
| 02/26/2004 | US20040038579 Electrical connector |
| 02/26/2004 | US20040038561 Method for electrically connecting a semiconductor component to an electrical subassembly |
| 02/26/2004 | US20040038560 Methods of fabricating and using shaped springs |
| 02/26/2004 | US20040038547 Method of etching a metal layer using a mask, a metallization method for a semiconductor device, a method of etching a metal layer, and an etching gas |
| 02/26/2004 | US20040038543 Methods for selective removal of material from wafer alignment marks |
| 02/26/2004 | US20040038539 Reticle for creating resist-filled vias in a dual damascene process |
| 02/26/2004 | US20040038523 Interconnect structures in a semiconductor device and processes of formation |
| 02/26/2004 | US20040038519 Wiring method and element arranging method using the same, and method of production image display devices |
| 02/26/2004 | US20040038515 Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles |
| 02/26/2004 | US20040038514 Method for forming low-k hard film |
| 02/26/2004 | US20040038512 Method for implementing selected functionality on an integrated circuit device |
| 02/26/2004 | US20040038510 Method of manufacturing a semiconductor device |
| 02/26/2004 | US20040038509 Chip scale surface mounted device and process of manufacture |
| 02/26/2004 | US20040038508 Method for fabricating a semiconductor device having a tapered-mesa side-wall film |
| 02/26/2004 | US20040038507 Method of producing an integrated circuit configuration |
| 02/26/2004 | US20040038500 Thin microelectronic substrates and methods of manufacture |
| 02/26/2004 | US20040038496 Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
| 02/26/2004 | US20040038473 Symmetric inducting device for an integrated circuit having a ground shield |
| 02/26/2004 | US20040038471 Semiconductor device and method of manufacturing the same |
| 02/26/2004 | US20040038470 Integrated circuit having oversized components |
| 02/26/2004 | US20040038458 Semiconductor fuses, semiconductor devices containing the same, and methods of making and using the same |
| 02/26/2004 | US20040038457 Stress balanced semiconductor packages, method of fabrication and modified mold segment |
| 02/26/2004 | US20040038453 Integrated circuit metallization using a titanium/alminum alloy |
| 02/26/2004 | US20040038452 Connection between semiconductor unit and device carrier |
| 02/26/2004 | US20040038451 Method suitable for forming a microelectronic device package |
| 02/26/2004 | US20040038448 Semiconductor device and method for fabricating the same |
| 02/26/2004 | US20040038447 Packaged microelectronic devices and methods for assembling microelectronic devices |
| 02/26/2004 | US20040038442 Optically interactive device packages and methods of assembly |
| 02/26/2004 | US20040038072 Surface metal layer covering the ruthenium layer formed on a conductivie surface is made of at least one metal selected from Au, Pt, Ag, Pd, Rh, Co, Ni, In and tin or therir alloys |
| 02/26/2004 | US20040038021 Resin containing as cross-linking component a compound having a plurality of styrene groups, for example, 1,2-bis(vinylphenyl)ethane; low dielectric constant, low dielectric dissipation factor |
| 02/26/2004 | US20040038011 Integral-type ceramic circuit board and method of producing same |
| 02/26/2004 | US20040037516 Optical transmission module |
| 02/26/2004 | US20040037136 chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals |
| 02/26/2004 | US20040037060 Solder ball collapse control apparatus and method thereof |
| 02/26/2004 | US20040037059 Integrated circuit package with spacer |
| 02/26/2004 | US20040037057 Radiating structure for electronic circuit units, capable of efficiently radiating heat of heater element |
| 02/26/2004 | US20040037044 Heat sink for surface mounted power devices |
| 02/26/2004 | US20040037043 IC package with an implanted heat-dissipation fin |
| 02/26/2004 | US20040037042 EMI shielding apparatus |
| 02/26/2004 | US20040037041 Fastening structure for a heat sink |
| 02/26/2004 | US20040037039 Heat sink with fins and manufacturing method thereof |
| 02/26/2004 | US20040037038 Heat sink fastener |
| 02/26/2004 | US20040037036 Heat sink and electronic device with heat sink |
| 02/26/2004 | US20040036819 Case for covering electronic parts and display apparatus including the same |
| 02/26/2004 | US20040036731 Method for the printing of homogeneous electronic material with a multi-ejector print head |
| 02/26/2004 | US20040036559 Electromagnetic wave absorber and high-frequency circuit package using the same |
| 02/26/2004 | US20040036542 High-frequency circuit device using slot line and communication apparatus having high frequency circuit device |
| 02/26/2004 | US20040036521 Low resistance contact for an integrated circuit |
| 02/26/2004 | US20040036495 Electromigration test structure for detecting the reliability of wiring |
| 02/26/2004 | US20040036183 Semiconductor package having DAM and method for fabricating the same |
| 02/26/2004 | US20040036181 Connection of integrated circuit to a substrate |
| 02/26/2004 | US20040036180 Chip scale package and manufacturing method therefor |
| 02/26/2004 | US20040036179 Flip-chip device strengthened by substrate metal ring |
| 02/26/2004 | US20040036177 Semiconductor device for applying well bias and method of fabricating the same |