| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/03/2004 | EP1393372A2 Integrated circuit die having an interference shield |
| 03/03/2004 | EP1393371A2 Electronic module and method for assembling same |
| 03/03/2004 | EP1393370A2 Electronic chip and electronic chip assembly |
| 03/03/2004 | EP1393369A1 High performance heat sink for printed circuit boards |
| 03/03/2004 | EP1393368A2 Product comprising a substrate and a chip attached to the substrate |
| 03/03/2004 | EP1393367A2 Integrated sensor packaging and methods of making the same |
| 03/03/2004 | EP1393364A2 Plastic housing comprising several semiconductor chips and a wiring modification plate, and method for producing the plastic housing in an injection-moulding mould |
| 03/03/2004 | EP1393357A2 A method for making a metal-insulator-metal capacitor using plate-through mask techniques |
| 03/03/2004 | EP1393247A1 Lead-frame configuration for chips |
| 03/03/2004 | EP1392761A1 Organosilicate polymer and insulating film therefrom |
| 03/03/2004 | EP1392449A1 Over-clocking in a microdeposition control system to improve resolution |
| 03/03/2004 | CN2605665Y Heat-tube radiating device |
| 03/03/2004 | CN2605664Y Packaged solderless substrate |
| 03/03/2004 | CN2605600Y High density radiating device |
| 03/03/2004 | CN2605598Y Radiating device assembly |
| 03/03/2004 | CN1479855A Cooling device, electronic device and method of manufacturing cooling device |
| 03/03/2004 | CN1479804A Ultralow dielectric constant material as intralevel or interlevel dielectric in semiconductor device, method for fabricating the same, and electronic device containing the same |
| 03/03/2004 | CN1479802A Alluminium alloy thin film, wiring circuit having the thin film and target material depositing the thin film |
| 03/03/2004 | CN1479768A Material for insulating substrate, printed circuit board, laminate, copper foil with resin, copper-clad laminate, polymide film, film for TAB and prepreg |
| 03/03/2004 | CN1479567A Wiring base plate, semconductor device and its manufacturing mtehod, circuit board and electronic instrument |
| 03/03/2004 | CN1479566A Laminated ceramic electronic component and manufacturing method thereof |
| 03/03/2004 | CN1479407A Semiconductor assembly structure combined with antenna |
| 03/03/2004 | CN1479383A Semiconductor device and its making method |
| 03/03/2004 | CN1479375A 电容器 Capacitors |
| 03/03/2004 | CN1479374A External discharge protection circuite |
| 03/03/2004 | CN1479373A 半导体元件及半导体封装 Semiconductor elements and semiconductor packages |
| 03/03/2004 | CN1479372A Line baseplate |
| 03/03/2004 | CN1479371A Packaging baseplate having electrostatic discharge protection |
| 03/03/2004 | CN1479370A Packaging baseplate having electrostatic discharge protection |
| 03/03/2004 | CN1479369A Packaging base plate having concave-convex side |
| 03/03/2004 | CN1479366A Manufacturing method of semiconductor memory device |
| 03/03/2004 | CN1479349A Flip-chip packaged scab technology |
| 03/03/2004 | CN1479185A 电子装置 Electronic devices |
| 03/03/2004 | CN1478824A Electronic element for high frequency using low-dielectric loss angle tangent insulating material |
| 03/03/2004 | CN1140928C Heat sink |
| 03/03/2004 | CN1140920C Double wafer structure without wafer holder |
| 03/03/2004 | CN1140647C Copper alloy with improved resistance to cracking |
| 03/03/2004 | CN1140603C Packaging sealing composition for electronic device |
| 03/02/2004 | US6700794 Decoupling capacitor closely coupled with integrated circuit |
| 03/02/2004 | US6700793 Semiconductor device |
| 03/02/2004 | US6700790 Circuit board with integrated circuit |
| 03/02/2004 | US6700789 High-frequency wiring board |
| 03/02/2004 | US6700783 Three-dimensional stacked heat spreader assembly for electronic package and method for assembling |
| 03/02/2004 | US6700782 Apparatus and method to retain an electronic component in a precise position during assembly manufacturing |
| 03/02/2004 | US6700692 Electrochromic rearview mirror assembly incorporating a display/signal light |
| 03/02/2004 | US6700457 Impedance compensation for circuit board breakout region |
| 03/02/2004 | US6700456 High-frequency module |
| 03/02/2004 | US6700399 High density parasitic measurement structure |
| 03/02/2004 | US6700210 Electronic assemblies containing bow resistant semiconductor packages |
| 03/02/2004 | US6700209 Partial underfill for flip-chip electronic packages |
| 03/02/2004 | US6700208 Surface mounting substrate having bonding pads in staggered arrangement |
| 03/02/2004 | US6700207 Flip-chip ball grid array package for electromigration testing |
| 03/02/2004 | US6700206 Stacked semiconductor package and method producing same |
| 03/02/2004 | US6700205 Semiconductor devices having contact plugs and local interconnects |
| 03/02/2004 | US6700202 Reducing the oxidized interface with a hydrogen containing plasma and introducing second-layer-forming compounds |
| 03/02/2004 | US6700201 Reduction of sector connecting line capacitance using staggered metal lines |
| 03/02/2004 | US6700199 Gold-silver bonding wire for semiconductor device |
| 03/02/2004 | US6700198 Resin for semiconductor wire |
| 03/02/2004 | US6700195 Electronic assembly for removing heat from a flip chip |
| 03/02/2004 | US6700194 Semiconductor device |
| 03/02/2004 | US6700193 Semiconductor package with elevated tub |
| 03/02/2004 | US6700192 Leadframe and method of manufacturing a semiconductor device using the same |
| 03/02/2004 | US6700190 Integrated circuit device with exposed upper and lower die surfaces |
| 03/02/2004 | US6700189 Resin sealed semiconductor device |
| 03/02/2004 | US6700188 Low-pin-count chip package having concave die pad and/or connections pads |
| 03/02/2004 | US6700187 Semiconductor package and method for manufacturing the same |
| 03/02/2004 | US6700186 Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device |
| 03/02/2004 | US6700185 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device |
| 03/02/2004 | US6700184 Lead frame and semiconductor device having the same |
| 03/02/2004 | US6700182 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 03/02/2004 | US6700181 Method and system for broadband transition from IC package to motherboard |
| 03/02/2004 | US6700178 Package of a chip with beveled edges |
| 03/02/2004 | US6700177 Compact, surface-mounting-type, electronic-circuit unit |
| 03/02/2004 | US6700176 MOSFET anti-fuse structure and method for making same |
| 03/02/2004 | US6700164 Tungsten hot wire current limiter for ESD protection |
| 03/02/2004 | US6700162 Chip structure to improve resistance-capacitance delay and reduce energy loss of the chip |
| 03/02/2004 | US6700161 Variable resistor structure and method for forming and programming a variable resistor for electronic circuits |
| 03/02/2004 | US6700147 Semiconductor device and method of manufacturing the same |
| 03/02/2004 | US6700138 Modular semiconductor die package and method of manufacturing thereof |
| 03/02/2004 | US6700135 Active matrix panel |
| 03/02/2004 | US6700077 Packaging substrate with electrostatic discharge protection |
| 03/02/2004 | US6700076 Multi-layer interconnect module and method of interconnection |
| 03/02/2004 | US6700073 Semiconductor device |
| 03/02/2004 | US6700072 Electrical connection with inwardly deformable contacts |
| 03/02/2004 | US6700053 N-type thermoelectric elements containing compound with skutterudite structure; p-type element connected by manganese-silicon series compound |
| 03/02/2004 | US6699787 Semiconductor device and method of production of same |
| 03/02/2004 | US6699783 Method for controlling conformality with alternating layer deposition |
| 03/02/2004 | US6699782 Method of fabricating a wafer level package |
| 03/02/2004 | US6699781 Conductive material for integrated circuit fabrication |
| 03/02/2004 | US6699762 Methods of fabricating integrated circuit devices with contact hole alignment |
| 03/02/2004 | US6699737 Method of manufacturing a semiconductor device |
| 03/02/2004 | US6699735 Semiconductor device and method for manufacturing the semiconductor device |
| 03/02/2004 | US6699734 Method and apparatus for coupling a semiconductor die to die terminals |
| 03/02/2004 | US6699731 Substrate of semiconductor package |
| 03/02/2004 | US6699730 Stacked microelectronic assembly and method therefor |
| 03/02/2004 | US6699726 Semiconductor device and method for the manufacture thereof |
| 03/02/2004 | US6699571 Devices and methods for mounting components of electronic circuitry |
| 03/02/2004 | US6699337 Copper-base alloys having improved punching properties on press and a process for producing them |
| 03/02/2004 | US6699304 Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom |
| 03/02/2004 | US6698646 Room temperature gold wire bonding |