| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/04/2004 | US20040042140 Double-sided thermally enhanced IC chip package |
| 03/04/2004 | US20040041958 Array substrate for LCD device having double-layered gate and data lines and manufacturing method thereof |
| 03/04/2004 | US20040041393 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 03/04/2004 | US20040041309 Ceramic component and production method therefor |
| 03/04/2004 | US20040041283 System and method of enhancing alignment marks |
| 03/04/2004 | US20040041282 Flip-chip image sensor packages and methods of fabrication |
| 03/04/2004 | US20040041281 Semiconductor integrated circuit and method for designing semiconductor integrated circuit |
| 03/04/2004 | US20040041280 Bonding semiconductor to chip carrier; reaction product of epoxide, anhydride and acyclic acetal compound |
| 03/04/2004 | US20040041279 Electronic device package |
| 03/04/2004 | US20040041277 Multilayer board and a semiconductor device |
| 03/04/2004 | US20040041276 Electrical assembly and method for manufacturing the electrical assembly |
| 03/04/2004 | US20040041274 Versatile system for diffusion limiting void formation |
| 03/04/2004 | US20040041273 Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process |
| 03/04/2004 | US20040041271 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
| 03/04/2004 | US20040041270 Semiconductor package, method of production of same, and semiconductor device |
| 03/04/2004 | US20040041269 Semiconductor device and manufacturing method thereof |
| 03/04/2004 | US20040041268 Multilayer metal structure of supply rings with large parasitic capacitance |
| 03/04/2004 | US20040041267 Semiconductor device and manufacturing method thereof |
| 03/04/2004 | US20040041266 Semiconductor device and fabrication method therefor |
| 03/04/2004 | US20040041264 Method for alloy-electroplating group IB metals with refractory metals for interconnections |
| 03/04/2004 | US20040041263 Integrated circuit with modified metal features and method of fabrication therefor |
| 03/04/2004 | US20040041262 Inlet for an electronic tag |
| 03/04/2004 | US20040041261 Electroconductive tracers overcoatings radiation transparent substrate; flexible circuit |
| 03/04/2004 | US20040041260 Semiconductor component with backside contacts and method of fabrication |
| 03/04/2004 | US20040041259 Double capacity stacked memory and fabrication method thereof |
| 03/04/2004 | US20040041258 Semiconductor chip having bond pads and multi-chip package |
| 03/04/2004 | US20040041257 Adhesion method and electronic component |
| 03/04/2004 | US20040041256 Semiconductor device |
| 03/04/2004 | US20040041255 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
| 03/04/2004 | US20040041254 Packaged microchip |
| 03/04/2004 | US20040041252 Solder mask on bonding ring |
| 03/04/2004 | US20040041251 Universal package for an electronic component with a semiconductor chip and method for producing the universal package |
| 03/04/2004 | US20040041250 Semiconductor device and a method of manufacturing the same |
| 03/04/2004 | US20040041248 Packaged microchip with isolation |
| 03/04/2004 | US20040041247 Flip-chip image sensor packages and methods of fabrication |
| 03/04/2004 | US20040041246 Signal communication structures |
| 03/04/2004 | US20040041245 Programmable capacitor associated with an input/output pad |
| 03/04/2004 | US20040041244 Low expansion plate, method of manufacturing the same, and semiconductor device using the low expansion plate |
| 03/04/2004 | US20040041243 Thin film circuit board device and its manufacturing method |
| 03/04/2004 | US20040041242 Substrate based unmolded package including lead frame structure and semiconductor die |
| 03/04/2004 | US20040041241 Packaged semiconductor with coated leads and method therefore |
| 03/04/2004 | US20040041240 Porous insulator created from a "void" creating material, structures and semiconductor devices including same, and methods of forming |
| 03/04/2004 | US20040041239 Etching depth indicator in silicon oxycarbide layer; optics emission spectra; reduced electrical resistance variations |
| 03/04/2004 | US20040041238 Beta control using a rapid thermal oxidation |
| 03/04/2004 | US20040041233 Shallow trench antifuse and methods of making and using same |
| 03/04/2004 | US20040041230 Semiconductor package for series-connected diodes |
| 03/04/2004 | US20040041227 Intermeshed guard bands for multiple voltage supply structures on an integrated circuit, and methods of making same |
| 03/04/2004 | US20040041224 Photoconductor-on-active-pixel (POAP) sensor utilizing a multi-layered radiation absorbing structure |
| 03/04/2004 | US20040041211 Post passivation interconnection schemes on top of the IC chips |
| 03/04/2004 | US20040041204 Trench interconnect structure and formation method |
| 03/04/2004 | US20040041201 Semiconductor device and capacitance regulation circuit |
| 03/04/2004 | US20040041168 Test insert with electrostatic discharge structures and associated methods |
| 03/04/2004 | US20040041167 Gate dielectric antifuse circuit to protect a high-voltage transistor |
| 03/04/2004 | US20040041166 Ball grid array structures and tape-based method of manufacturing same |
| 03/04/2004 | US20040041152 Electro-optical device and semiconductor device |
| 03/04/2004 | US20040041149 Contact structure of semiconductor device, manufacturing method thereof, thin film transistor array panel including contact structure, and manufacturing method thereof |
| 03/04/2004 | US20040041010 Exothermic processing |
| 03/04/2004 | US20040040856 Method for making plastic packages |
| 03/04/2004 | US20040040855 Bonding pads; integrated circuit dies; multilayers; electroconductive and dielectric layers |
| 03/04/2004 | US20040040743 Multilayer modules with flexible substrates |
| 03/04/2004 | US20040040742 Mounting board and electronic device using the same |
| 03/04/2004 | US20040040741 Configurable microelectronic package using electrically conductive material |
| 03/04/2004 | US20040040740 Electric element built-in module and method for manufacturing the same |
| 03/04/2004 | US20040040738 Multilayer wiring board |
| 03/04/2004 | US20040040735 Wire bonding surface for connecting an electrical energy storage device to an implantable medical device |
| 03/04/2004 | US20040040700 Heat sink assembly structure |
| 03/04/2004 | US20040040696 Flat heat transferring device and method of fabricating the same |
| 03/04/2004 | US20040040695 Modular capillary pumped loop cooling system |
| 03/04/2004 | US20040040578 Hermetic sealed container; absorbent |
| 03/04/2004 | US20040040328 Self-contained spray cooling module |
| 03/04/2004 | US20040040327 Power module and air conditioner |
| 03/04/2004 | US20040040318 Method for automatic thermal calibration of a cooling system |
| 03/04/2004 | US20040040126 Fastener for a heat-radiator |
| 03/04/2004 | DE20317865U1 Tragbares elektronisches Kommunikationsgerät mit zwei verschiebbaren Tastaturen Portable electronic communication device with two sliding keyboards |
| 03/04/2004 | DE20314428U1 Cooling system for use with electronics has circuit board in contact with parallel metal heat conducting filaments on a base |
| 03/04/2004 | DE10332132A1 Halbleiterbaugruppe vom Stapeltyp mit einer oder mehrerer darin gestapelter Halbleiterbaugruppen Semiconductor package stack type with one or more is stacked semiconductor packages |
| 03/04/2004 | DE10316835A1 Halbleiterbaugruppe Semiconductor package |
| 03/04/2004 | DE10250778B3 Semiconductor chip used in flip-chip technology for producing circuit boards has a buffer body with a protective layer made from a damping material arranged between a contact surfaces and above a semiconductor component structures |
| 03/04/2004 | DE10238975A1 Cooling of an electronic processor module uses a finned heat sink held in contact with a heat distributing plate. |
| 03/04/2004 | DE10238523A1 Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung An encapsulated electronic component and methods for making |
| 03/04/2004 | DE10234585A1 Optoelectronic surface mounted device component for receiving electromagnetic radiation, especially sunlight in a motor vehicle has angled supports on a carrier plate |
| 03/04/2004 | DE10157008B4 Halbleiterbauteil mit einem Halbleiterplättchen A semiconductor device comprising a semiconductor chip |
| 03/04/2004 | DE10034309B4 Vorrichtung für die Reduktion von durch die thermische Ausdehnung in einem Substrat verursachten Grenzflächenspannungen A device for the reduction of the thermal expansion in a substrate caused interfacial tensions |
| 03/04/2004 | DE10011005B4 Multichip module and method for producing a multichip module |
| 03/03/2004 | EP1395101A1 Method of manufacturing electronic part and electronic part obtained by the method |
| 03/03/2004 | EP1395098A1 Electrical heating for vehicle |
| 03/03/2004 | EP1394857A2 Semiconductor device |
| 03/03/2004 | EP1394855A2 Universal housing for an electronic semiconductor device and method of its manufacture |
| 03/03/2004 | EP1394854A1 Apparatus and method for gettering contaminants in a hermetic enclosure |
| 03/03/2004 | EP1394851A2 Semiconductor chip and fabrication method thereof |
| 03/03/2004 | EP1394846A2 Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame |
| 03/03/2004 | EP1394845A2 Method for making an electric circuit including a polishing step |
| 03/03/2004 | EP1394734A1 Ic card |
| 03/03/2004 | EP1394597A2 Contact structure of semiconductor device, manufacturing method thereof, thin film transistor array panel including contact structure, and manufacturing method thereof |
| 03/03/2004 | EP1394557A2 Electronic apparatus |
| 03/03/2004 | EP1394286A1 Pretreatment of an organic layer for ALD thereof |
| 03/03/2004 | EP1394100A2 Apparatus and method for controlling movement of a device after packaging |
| 03/03/2004 | EP1393605A2 Circuit board with at least one electronic component |
| 03/03/2004 | EP1393375A1 Contact system |
| 03/03/2004 | EP1393373A1 High power semiconductor module |