Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/06/2014US20140035142 Profile control in interconnect structures
02/06/2014US20140035141 Self aligned borderless contact
02/06/2014US20140035140 Semiconductor Structure and Method for Manufacturing the Same
02/06/2014US20140035139 Semiconductor device and method of manufacturing the same
02/06/2014US20140035138 Package structure having embedded semiconductor component and fabrication method thereof
02/06/2014US20140035137 Semiconductor package and method of forming the same
02/06/2014US20140035136 Embedded Package Security Tamper Mesh
02/06/2014US20140035135 Solder bump for ball grid array
02/06/2014US20140035134 Dense interconnect with solder cap (disc) formation with laser ablation and resulting semiconductor structures and packages
02/06/2014US20140035133 Semiconductor package containing silicon-on-insulator die mounted in bump-on-leadframe manner to provide low thermal resistance
02/06/2014US20140035132 Surface mount chip
02/06/2014US20140035131 Semiconductor devices having multi-bump electrical interconnections and methods for fabricating the same
02/06/2014US20140035130 Packaging method using solder coating ball and package manufactured thereby
02/06/2014US20140035129 Thin integrated circuit chip-on-board assembly and method of making
02/06/2014US20140035128 Semiconductor seal ring
02/06/2014US20140035127 Chip package and a method for manufacturing a chip package
02/06/2014US20140035126 Semiconductor manufacturing method and semiconductor structure thereof
02/06/2014US20140035125 Semiconductor manufacturing method, semiconductor structure and package structure thereof
02/06/2014US20140035124 Semiconductor device and manufacturing method of same
02/06/2014US20140035123 Semiconductor device and method for manufacturing semiconductor device
02/06/2014US20140035122 Power semiconductor device
02/06/2014US20140035120 Semiconductor unit
02/06/2014US20140035119 Electronic semi - conductor device intended for mounting in a pressed stack assembly, and a pressed stack assembly comprising such device
02/06/2014US20140035118 Semiconductor Module Arrangement and Method for Producing and Operating a Semiconductor Module Arrangement
02/06/2014US20140035117 Explosion-Protected Semiconductor Module
02/06/2014US20140035116 Top Exposed Semiconductor Chip Package
02/06/2014US20140035115 Semiconductor device
02/06/2014US20140035113 Packaging and methods for packaging
02/06/2014US20140035112 Semiconductor device and manufacturing method thereof
02/06/2014US20140035109 Method and structure of forming backside through silicon via connections
02/06/2014US20140035108 Semiconductor integrated circuit and pattern layouting method for the same
02/06/2014US20140035107 Double seal ring
02/06/2014US20140035106 Multiple seal-ring structure for the design, fabrication, and packaging of integrated circuits
02/06/2014US20140035095 Semiconductor package and method for fabricating base for semiconductor package
02/06/2014US20140035089 Pad design for circuit under pad in semiconductor devices
02/06/2014US20140034588 Frame with connection member for connecting flanges of the frame
02/06/2014DE102013215124A1 Halbleitereinheit Semiconductor unit
02/06/2014DE102013209116A1 Leistungshalbleitervorrichtungsmodul Power semiconductor device module
02/06/2014DE102013206480A1 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
02/06/2014DE102013108352A1 Integriertes System und Verfahren zum Herstellen des integrierten Systems Integrated system and method for manufacturing the integrated system
02/06/2014DE102013108196A1 Ein Chippackage und ein Verfahren zum Herstellen eines Chippackage A chip package and a method of manufacturing a chip package
02/06/2014DE102013108167A1 Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
02/06/2014DE102013108075A1 Chip-Gehäuse und Verfahren zur Herstellung eines Chip-Gehäuses Chip package and method of manufacturing a chip package
02/06/2014DE102013107725A1 Chipkartenmodul Chip card module
02/06/2014DE102012213566A1 Verfahren zum Herstellen eines Bondpads zum Thermokompressionsbonden und Bondpad A method for manufacturing a bonding pad to the thermocompression bonding and bonding pad
02/06/2014DE102012213555A1 Method for manufacturing DCB substrate for e.g. power semiconductor component in power converter, involves electroplating metal film on metallization layer and around cover so as to form pocket at desired position of power component
02/06/2014DE102012213548A1 Bondpad zum Thermokompressionsbonden, Verfahren zum Herstellen eines Bondpads und Bauelement Bonding pad for thermo-compression bonding, bonding pads and a method for producing component
02/06/2014DE102010042583B4 Leistungshalbleitervorrichtung für Zündvorrichtung Power semiconductor device for primer
02/06/2014DE102009014056B4 Halbleitervorrichtung Semiconductor device
02/06/2014DE102005010156B4 Verfahren zum Ausbilden einer Anordnung aus gestapelten Einzelschaltkreisen A method of forming an array of stacked individual circuits
02/05/2014EP2693520A1 Battery pack and electric bicycle
02/05/2014EP2693478A1 An integrated circuit based varactor
02/05/2014EP2693477A1 Pop encapsulation structure
02/05/2014EP2693476A1 Three-dimensional integrated circuit laminate and interlayer filler material for three-dimensional integrated circuit laminate
02/05/2014EP2693475A1 Three-dimensionally mounted semiconductor device and method for manufacturing same
02/05/2014EP2693474A2 Method of manufacturing a silver bond pad on a semiconductor power device using silver nanopaste, as well as an assembly including said semiconductor device
02/05/2014EP2693473A1 Electronic semiconductor device intended for mounting in a pressed stack assembly, and a pressed stack assembly comprising such a device
02/05/2014EP2693472A2 Power semiconductor module and its method of manufacturing
02/05/2014EP2693471A2 Semiconductor device and method for manufacturing the same
02/05/2014EP2693470A2 Diffusion barrier for surface mount modules
02/05/2014EP2693469A2 Hermetically sealed package for a silicon carbide semiconductor device
02/05/2014EP2693468A1 Method for flip-chip assembly of two electronic components
02/05/2014EP2693467A1 A method of producing a semiconductor device having an interconnect through the substrate
02/05/2014EP2693465A1 Electronic device and method of manufacturing such device
02/05/2014EP2692901A1 Metal foil provided with electrically resistive film, and method for producing same
02/05/2014EP2692879A1 Cu-co-si-based copper alloy strip for electron material, and method for manufacturing same
02/05/2014EP2692759A1 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device
02/05/2014EP2691983A1 An interposer having an inductor
02/05/2014EP2691981A1 Electronic module and method for the production thereof
02/05/2014EP2691471A1 Curable silicone resins for led encapsulation
02/05/2014CN203423190U Surface-mounted diode
02/05/2014CN203423181U Oxide semiconductor thin-film transistor substrate
02/05/2014CN203423179U Three-phase fully-controlled bridge silicone-controlled rectifier assembly
02/05/2014CN203423178U Three-dimensional packaged SDRAM memory with capacity of 256M*8bit
02/05/2014CN203423177U Three-dimensional packaged SDRAM having 64M*48bit capacity
02/05/2014CN203423176U Three-dimensional packaged DDR1 memory having 64M*32bit capacity
02/05/2014CN203423175U Three-dimensional packaged SDRAM having 128M*16bit capacity
02/05/2014CN203423174U Three-dimensional packaged SDRAM having 512M*32bit capacity
02/05/2014CN203423173U Three-dimensional packaged SDRAM having 256K*32bit capacity
02/05/2014CN203423172U Three-dimensional packaged SDRAM having 1M*16bit capacity
02/05/2014CN203423171U Three-dimensional packaged SDRAM having 2M*8bit capacity
02/05/2014CN203423170U Surface-mounted inductive device adopting wafer-level production technology
02/05/2014CN203423169U 静电防护装置 ESD protection device
02/05/2014CN203423168U Rectifier bridge structure
02/05/2014CN203423167U Semiconductor device
02/05/2014CN203423166U Wafer level silicon hole structure of adapter board
02/05/2014CN203423165U Wiring terminal, and IGBT power module with wiring terminal
02/05/2014CN203423164U Temperature equalization superconductive heat radiator
02/05/2014CN203423163U Nonmetal radiating film structure
02/05/2014CN203423162U Silicon controlled rectifier module
02/05/2014CN203423161U Pistol-type silicone-controlled rectifier module
02/05/2014CN203423160U Passive-element packaging structure
02/05/2014CN203423159U High-power ceramic package IGBT (insulated gate bipolar transistor) efficient two-sided refrigerating integral tube shell
02/05/2014CN103563503A Electronic apparatus
02/05/2014CN103563166A Integrated circuit with electromagnetic communication
02/05/2014CN103563077A Semiconductor device and method for manufacturing same
02/05/2014CN103563076A Alternative surface finishes for flip-chip ball grid arrays
02/05/2014CN103563075A Semiconductor unit and semiconductor device using same
02/05/2014CN103563074A Ceramic printed circuit board comprising an al cooling body
02/05/2014CN103563073A Heat spreader for electrical components
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