| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/09/2004 | US6703692 Leadframe with support members |
| 03/09/2004 | US6703691 Including ground-wing structure which is exposed to bottom outside of encapsulation body to help enhance grounding effect and electrical performance of packaged chip during operation |
| 03/09/2004 | US6703689 Miniature optical element for wireless bonding in an electronic instrument |
| 03/09/2004 | US6703686 Semiconductor device |
| 03/09/2004 | US6703680 Programmable element programmed by changes in resistance due to phase transition |
| 03/09/2004 | US6703666 Thin film resistor device and a method of manufacture therefor |
| 03/09/2004 | US6703651 Electronic device having stacked modules and method for producing it |
| 03/09/2004 | US6703650 Semiconductor integrated circuit including a circuit protecting against static electricity |
| 03/09/2004 | US6703641 Structure for detecting charging effects in device processing |
| 03/09/2004 | US6703598 Semiconductor photo-detecting apparatus |
| 03/09/2004 | US6703582 Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train |
| 03/09/2004 | US6703573 Method for sorting integrated circuit devices |
| 03/09/2004 | US6703567 Conductor track layer structure and prestage thereof |
| 03/09/2004 | US6703561 Header assembly having integrated cooling device |
| 03/09/2004 | US6703560 Stress resistant land grid array (LGA) module and method of forming the same |
| 03/09/2004 | US6703559 Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough |
| 03/09/2004 | US6703311 Method for estimating capacitance of deep trench capacitors |
| 03/09/2004 | US6703310 Semiconductor device and method of production of same |
| 03/09/2004 | US6703286 Metal bond pad for low-k inter metal dielectric |
| 03/09/2004 | US6703263 Semiconductor fuses, methods of using the same, methods of making the same, and semiconductor devices containing the same |
| 03/09/2004 | US6703261 Semiconductor device and manufacturing the same |
| 03/09/2004 | US6703260 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes |
| 03/09/2004 | US6703251 Semiconductor wafer |
| 03/09/2004 | US6703133 Polyimide silicone resin, its solution composition, and polyimide silicone resin film |
| 03/09/2004 | US6703128 For managing/dissipating heat generated by electronic devices |
| 03/09/2004 | US6703105 Stereolithographically marked semiconductor devices and methods |
| 03/09/2004 | US6703075 Wafer treating method for making adhesive dies |
| 03/09/2004 | US6703069 Under bump metallurgy for lead-tin bump over copper pad |
| 03/09/2004 | US6702624 Electronic component in which an insert member is tightly held by a resin portion and prevented from deformation thereof |
| 03/09/2004 | US6702588 Electrical connector assembly with snap-fit base and frame |
| 03/09/2004 | US6702489 Inking apparatus with multi-positioning capability |
| 03/09/2004 | US6702007 Heat sink structure |
| 03/09/2004 | US6702003 Three-phase heat transfer structure |
| 03/09/2004 | US6702002 Hydronic pump type heat radiator |
| 03/09/2004 | US6702001 Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly |
| 03/09/2004 | US6702000 Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus |
| 03/09/2004 | US6701910 Film frame substrate fixture |
| 03/04/2004 | WO2004019667A1 Method for forming bump on electrode pad with use of double-layered film |
| 03/04/2004 | WO2004019490A1 Encapsulated electronic component and production method |
| 03/04/2004 | WO2004019406A1 An electronic assembly having a more dense arrangement of contacts tha allows for routing of traces to the contacts |
| 03/04/2004 | WO2004019405A1 Semiconductor component having a chip scale package (csp) housing |
| 03/04/2004 | WO2004019379A2 Compact, high-efficiency thermoelectric systems |
| 03/04/2004 | WO2004018719A1 Negative volume expansion lead-free electrical connection |
| 03/04/2004 | WO2004008486A3 Wafer bonding of thinned electronic materials and circuits to high performance substrates |
| 03/04/2004 | WO2003036719A3 Micro- or nano-electronic component comprising a power source and means for protecting the power source |
| 03/04/2004 | WO2002099883A3 Electronic device and relative fabrication method |
| 03/04/2004 | WO2002089191A3 Improvement of titanium disilicide resistance in narrow active regions of semiconductor devices |
| 03/04/2004 | WO2002023583A9 Monitor system and method for semiconductor processes |
| 03/04/2004 | US20040044168 Phosphorus- and nitrogen-containing resin hardener and a flame retarding resin composition containing said hardener |
| 03/04/2004 | US20040044167 Curing agent composition for epoxy resins, epoxy resin composition and use thereof |
| 03/04/2004 | US20040044162 Oxidation and heat resistance; dielectrics; forming boron nitride from organoboron polymer |
| 03/04/2004 | US20040043675 Multi-component integrated circuit contacts |
| 03/04/2004 | US20040043673 Connector and substrate for eletronic circuit fabrication |
| 03/04/2004 | US20040043656 Test structure |
| 03/04/2004 | US20040043615 Manufacturing method of a semiconductor substrate provided with a through hole electrode |
| 03/04/2004 | US20040043614 Semiconductor chip and fabrication method thereof |
| 03/04/2004 | US20040043607 Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures |
| 03/04/2004 | US20040043603 Semiconductor component with backside contacts and method of fabrication |
| 03/04/2004 | US20040043597 Method of etching insulating film and method of forming interconnection layer |
| 03/04/2004 | US20040043596 Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method |
| 03/04/2004 | US20040043591 Design layout method for metal lines of an integrated circuit |
| 03/04/2004 | US20040043579 MRAM MTJ stack to conductive line alignment method |
| 03/04/2004 | US20040043556 Capacitor formed in a multilayer wiring structure of a semiconductor device |
| 03/04/2004 | US20040043543 Reducing the migration of grain boundaries |
| 03/04/2004 | US20040043540 Methods of fabrication for flip-chip image sensor packages |
| 03/04/2004 | US20040043539 Plastic ball grid array with integral heatsink |
| 03/04/2004 | US20040043538 Wafer level package incorporating dual compliant layers and method for fabrication |
| 03/04/2004 | US20040043537 Method of manufacturing a semiconductor device having a flexible wiring substrate |
| 03/04/2004 | US20040043536 Method of producing integrated circuit package units |
| 03/04/2004 | US20040043535 Castellation wafer level packaging of integrated circuit chips |
| 03/04/2004 | US20040043534 Semiconductor device and manufacturing method thereof |
| 03/04/2004 | US20040043533 Multi-chip wafer level system packages and methods of forming same |
| 03/04/2004 | US20040043522 Semiconductor memory device manufacturing method |
| 03/04/2004 | US20040043518 Semiconductor device and method of manufacturing the same |
| 03/04/2004 | US20040043515 Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housing |
| 03/04/2004 | US20040043310 Processing method, manufacturing method of semiconductor device, and processing apparatus |
| 03/04/2004 | US20040043229 Heat conductive composite sheet and process for producing same |
| 03/04/2004 | US20040043225 Material composite and production and use of the material composite |
| 03/04/2004 | US20040043198 Method and apparatus to easily measure reticle blind positioning with an exposure apparatus |
| 03/04/2004 | US20040043197 High speed propagation of signals; multilayer circuits; aromatic resins |
| 03/04/2004 | US20040043190 Laminated electronic component |
| 03/04/2004 | US20040042318 Current limiting antifuse programming path |
| 03/04/2004 | US20040042317 Circuits and methods to protect a gate dielectric antifuse |
| 03/04/2004 | US20040042299 Layout structure of fuse bank of semiconductor memory device |
| 03/04/2004 | US20040042285 Semiconductor device and manufacturing method thereof |
| 03/04/2004 | US20040042243 Trimming pattern |
| 03/04/2004 | US20040042190 Multiple chip semiconductor package and method of fabricating same |
| 03/04/2004 | US20040042188 Chip package structure |
| 03/04/2004 | US20040042187 Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame |
| 03/04/2004 | US20040042185 Tab package and method for fabricating the same |
| 03/04/2004 | US20040042184 Electronic apparatus provided with liquid cooling type cooling unit cooling heat generating component |
| 03/04/2004 | US20040042183 Flex circuit package |
| 03/04/2004 | US20040042181 Thermoelectric module and process for producing the same |
| 03/04/2004 | US20040042180 Electronic circuit device including heat-generating element mounted on circuit board |
| 03/04/2004 | US20040042178 Heat spreader with surface cavity |
| 03/04/2004 | US20040042177 Heat sink for automatic assembling |
| 03/04/2004 | US20040042174 Electronic apparatus |
| 03/04/2004 | US20040042172 Electronic apparatus comprising heat generating element |
| 03/04/2004 | US20040042171 Electronic apparatus having display unit containing radiator radiating heat of heat generating component |
| 03/04/2004 | US20040042143 Electrostatic discharge protection circuit with active device |