| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/11/2004 | US20040046198 Stacked memory cell having diffusion barriers |
| 03/11/2004 | US20040046195 Semiconductor integrated circuit device and process for manufacturing the same |
| 03/11/2004 | US20040046154 Composition that includes conductive particles and glass particles dispersed in a thermoplastic polymer system. The hot melt conductor paste composition according to the invention is a solid at room temperature, but melts at a temperature of |
| 03/11/2004 | US20040046005 Stack package and manufacturing method thereof |
| 03/11/2004 | US20040046002 Self assembled nano-devices using DNA |
| 03/11/2004 | US20040045737 Processes for manufacturing flexible wiring boards |
| 03/11/2004 | US20040045702 Heatsink with multiple fin types |
| 03/11/2004 | US20040045701 Radiator |
| 03/11/2004 | US20040045656 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package |
| 03/11/2004 | US20040045655 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
| 03/11/2004 | US20040045375 Method and apparatus for detecting bearing failure |
| 03/11/2004 | US20040045163 Electronic assemblies with high capacity heat sinks and methods of manufacture |
| 03/11/2004 | US20040045161 Capacitor plate for substrate components |
| 03/11/2004 | US20040045159 Electrical connection with inwardly deformable contacts |
| 03/11/2004 | US20040045158 Thin film deposition as an active conductor and method therefor |
| 03/11/2004 | US20040045157 Flexible wiring boards |
| 03/11/2004 | DE29724788U1 Manufacturing LED with hermetically sealed casing |
| 03/11/2004 | DE20316334U1 Wärmetauschervorrichtung Heat exchange apparatus |
| 03/11/2004 | DE19600300B4 Supraleitende Verdrahtung und diese verwendende Halbleitervorrichtung Superconducting wiring and use this semiconductor device |
| 03/11/2004 | DE10338675A1 Reserve-Eingangs-/Ausgangs-Puffer Replacement input / output buffer |
| 03/11/2004 | DE10338292A1 Etching metal layer for semiconductor device, comprises etching exposed portions of metal layer with etching gas formed by mixing chlorine and nitrogen |
| 03/11/2004 | DE10338252A1 Semiconductor device comprises an insulating film formed on a semiconductor substrate, a bit line surrounded by the insulating film, and a bit line covering layer protruding from the insulating film |
| 03/11/2004 | DE10334116A1 Strahlungssystem, Strahlungsverfahren, Wärmepuffer, Halbleitermodul, Wärmeverteilungseinrichtung und Substrat Radiation system, radiation process, heat buffer, semiconductor module, heat distribution device and substrate |
| 03/11/2004 | DE10244077A1 Production of a semiconductor component used in microelectronics comprises dry etching a hole in the substrate of a component, lining the hole with an insulating layer, removing the insulating layer, and producing an electrical connection |
| 03/11/2004 | DE10241891A1 Electronic switching part for high frequency applications, e.g. a distance radar in a vehicle, comprises an electrical/electronic component with contact elements arranged on a substrate |
| 03/11/2004 | DE10241154A1 Integrated switching arrangement comprises a metallization layer, a conducting pathway dielectric, a conducting pathway intermediate material, conducting connecting sections, dielectric, and connecting section intermediate material |
| 03/11/2004 | DE10241141A1 Semiconductor component test system and process has individual characterization number for each semiconductor element for electronic testing and fewer test channels |
| 03/11/2004 | DE10240461A1 Universelles Gehäuse für ein elektronisches Bauteil mit Halbleiterchip und Verfahren zu seiner Herstellung Universal enclosure for an electronic device having semiconductor chip and process for its preparation |
| 03/11/2004 | DE10240460A1 Universelles Halbleitergehäuse mit vorvernetzten Kunststoffeinbettmassen und Verfahren zur Herstellung desselben Of the same semiconductor package with a universal pre-crosslinked Kunststoffeinbettmassen and methods for preparing |
| 03/11/2004 | DE10239081A1 Production of a semiconductor device used as a wafer level/chip size package, involves applying conductor strips to a semiconductor substrate, structuring the strips, and applying a solder layer to the structured strips |
| 03/11/2004 | DE10239080A1 Integrated circuit used in wafer level packages comprises an elastically deformable protrusion, a contact unit, and a rewiring unit for electrically connecting an active semiconductor section of the circuit to the contact unit |
| 03/11/2004 | DE10238835A1 Halbleiterchip, Chipanordnung mit zumindest zwei Halbleiterchips und Verfahren zur Überprüfung der Ausrichtung zumindest zweier übereinander liegender Halbleiterchips in einer Chipanordnung Semiconductor chip, chip assembly having at least two semiconductor chip and method for checking the alignment of at least two superimposed semiconductor chips in a chip assembly |
| 03/11/2004 | DE10238816A1 Production of connecting regions of an integrated circuit comprises applying a dielectric on the circuit, applying an oxidizable and/or corrodable metallization, applying a protective unit, and structuring the protective unit |
| 03/11/2004 | DE10238582A1 Integrated circuit used in wafer level packages comprises an elastically deformable protrusion on a switching substrate, a contact unit arranged on the protrusion for producing an electrical connection, and a rewiring unit |
| 03/11/2004 | DE10238581A1 Halbleiterbauelement Semiconductor device |
| 03/11/2004 | DE10238024A1 Integration of air as dielectric in semiconductor device involves applying and structurizing dielectric, metallization, applying organic dielectric, and contact with fluorine compound to replace first dielectric with air |
| 03/11/2004 | DE10237871A1 Semiconductor power module with heat dissipating contact surface and connection process has a spring device to press module to the cooling element |
| 03/11/2004 | DE10237338A1 Herstellung einer Umverdrahtungslage auf einem Trägermaterial Preparing a rewiring layer on a carrier material |
| 03/11/2004 | DE10234778B4 Chip-Leiterplatten-Anordnung für optische Mäuse (Computer-Mäuse) und zugehöriger Linsendeckel Chip circuit board assembly for optical mice (computer mice) and associated lens cover |
| 03/11/2004 | DE10059234B4 Elektrisch leitende Paste und Verfahren zur Bildung eines Schaltkreises Electrically conductive paste and process for forming a circuit |
| 03/11/2004 | CA2496042A1 Heat sink having folded fin heat exchanger core |
| 03/10/2004 | EP1397031A2 Circuit board for mounting electronic parts |
| 03/10/2004 | EP1396886A2 Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip |
| 03/10/2004 | EP1396885A1 Resin moulded automotive electronic control unit |
| 03/10/2004 | EP1396884A2 Interlayer insulation film used for multilayer interconnect of semiconductor integrated circuit and method of manufacturing the same |
| 03/10/2004 | EP1396034A1 Encapsulated photovoltaic modules and method of manufacturing same |
| 03/10/2004 | EP1396023A1 A method of producing a lamp |
| 03/10/2004 | EP1396021A2 Damping of high frequency bond wire vibration |
| 03/10/2004 | EP1396020A2 High performance flipchip package that incorporates heat removal with minimal thermal mismatch |
| 03/10/2004 | EP1144933B1 A device for temperature control |
| 03/10/2004 | EP0800754B1 Compliant interface for a semiconductor chip |
| 03/10/2004 | CN2606456Y Water circulating CPU radiator |
| 03/10/2004 | CN2606455Y Radiating module |
| 03/10/2004 | CN2606392Y Fin and assembled fin device |
| 03/10/2004 | CN1481659A Electromagnetic noise reduction device |
| 03/10/2004 | CN1481658A Method for mfg. mulfilayer circuit board for semiconductor device |
| 03/10/2004 | CN1481563A Capacitor with extended surface lands and method of fabrication therefor |
| 03/10/2004 | CN1481208A Composite process of heat sink and its products |
| 03/10/2004 | CN1481023A Multiple chips integrated module |
| 03/10/2004 | CN1481022A Electrostatic discharge protecter and its producing method |
| 03/10/2004 | CN1481021A 半导体器件 Semiconductor devices |
| 03/10/2004 | CN1481020A Method for manufacturing inner connecting line possessing antireflection coating |
| 03/10/2004 | CN1481019A Lead fram and its mfg. method |
| 03/10/2004 | CN1481018A Power amplifier with vadiator |
| 03/10/2004 | CN1481017A Semiconductor capsulation |
| 03/10/2004 | CN1481004A Method for conecting integrated circuit with substrate and corresponding circuit confiuration |
| 03/10/2004 | CN1481003A Chip sticking means and chip sticking method |
| 03/10/2004 | CN1481002A Mfg. method for semiconductor device |
| 03/10/2004 | CN1480818A Radiator |
| 03/10/2004 | CN1141739C Clad plate for lead frame's lead frame using the same, and method of manufacturing lead frame |
| 03/10/2004 | CN1141213C Super conducting heat transfer medium, its prepn. method and super conducting heat transferring appts. |
| 03/09/2004 | US6704609 Multi-chip semiconductor module and manufacturing process thereof |
| 03/09/2004 | US6704248 High density power module incorporating passive components distributed in a substrate |
| 03/09/2004 | US6704235 Anti-fuse memory cell with asymmetric breakdown voltage |
| 03/09/2004 | US6704204 IC package with edge connect contacts |
| 03/09/2004 | US6704201 Power feed and heat dissipating device for power semiconductor devices |
| 03/09/2004 | US6704200 Loop thermosyphon using microchannel etched semiconductor die as evaporator |
| 03/09/2004 | US6704199 Low profile equipment housing with angular fan |
| 03/09/2004 | US6704197 Electronic unit having desired heat radiation properties |
| 03/09/2004 | US6703953 Semiconductor device, method of manufacturing semiconductor device and communication method |
| 03/09/2004 | US6703909 Covering sheet, triplate line using the sheet, signal bus for computer using the sheet and covering structure of electronic circuit using the sheet |
| 03/09/2004 | US6703715 Semiconductor device having interconnection layer with multiply layered sidewall insulation film |
| 03/09/2004 | US6703714 Methods for fabricating flip-chip devices and preventing coupling between signal interconnections |
| 03/09/2004 | US6703713 Window-type multi-chip semiconductor package |
| 03/09/2004 | US6703711 Semiconductor device and method for fabricating the same |
| 03/09/2004 | US6703710 Dual damascene metal trace with reduced RF impedance resulting from the skin effect |
| 03/09/2004 | US6703707 Semiconductor device having radiation structure |
| 03/09/2004 | US6703706 Concurrent electrical signal wiring optimization for an electronic package |
| 03/09/2004 | US6703705 Semiconductor device and method for packaging same |
| 03/09/2004 | US6703704 Stress reducing stiffener ring |
| 03/09/2004 | US6703702 IC chip mounting structure and display device |
| 03/09/2004 | US6703701 Semiconductor device with integrated circuit elements of group III-V comprising means for preventing pollution by hydrogen |
| 03/09/2004 | US6703700 Semiconductor packaging structure |
| 03/09/2004 | US6703699 Semiconductor device |
| 03/09/2004 | US6703698 Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same |
| 03/09/2004 | US6703697 Having stand-off disposed on second substrate surface, sized to maintain distance between capacitor and another substrate and to allow electrical connection element to directly connect substrate surfaces when stand-off is mounted to other surface |
| 03/09/2004 | US6703696 Semiconductor package |
| 03/09/2004 | US6703695 Semiconductor device and method for producing the same |
| 03/09/2004 | US6703694 Frame for semiconductor package including plural lead frames having thin parts or hollows adjacent the terminal roots |
| 03/09/2004 | US6703693 Apparatus for reversing lead frame |