| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/16/2004 | US6705512 Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding |
| 03/16/2004 | US6705393 Ceramic heat sink with micro-pores structure |
| 03/16/2004 | US6705389 Reconfigurable system and method for cooling heat generating objects |
| 03/16/2004 | US6705388 Non-electrically conductive thermal dissipator for electronic components |
| 03/16/2004 | US6705144 Manufacturing process for a radial fin heat sink |
| 03/16/2004 | US6705089 Heat exchanging |
| 03/16/2004 | US6704976 Fastener for a heat-radiator |
| 03/16/2004 | CA2310977C Lga clamp mechanism |
| 03/11/2004 | WO2004021756A1 Heat sink having folded fin heat exchanger core |
| 03/11/2004 | WO2004021516A1 Anisotropic conductive sheet, its manufacturing method, and its application |
| 03/11/2004 | WO2004021447A1 Tft array substrate, liquid crystal display device, manufacturing methods of tft array substrate and liquid crystal display device, and electronic device |
| 03/11/2004 | WO2004021438A1 Hermetic transistor outline housing comprising a ceramic connection for high frequency applications |
| 03/11/2004 | WO2004021437A1 Coating of an integrated semiconductor circuit, and method for producing said coating |
| 03/11/2004 | WO2004021436A1 A packaged semiconductor with coated leads and method therefore |
| 03/11/2004 | WO2004021435A1 Module part |
| 03/11/2004 | WO2004021431A1 Production of a rewiring layer on a supporting material |
| 03/11/2004 | WO2004021400A2 Substrate based unmolded package |
| 03/11/2004 | WO2004021398A2 Wafer-level seal for non-silicon-based devices |
| 03/11/2004 | WO2004020961A1 Hermetic packaging |
| 03/11/2004 | WO2004020022A2 Valve pump |
| 03/11/2004 | WO2004001842A3 Layer assembly and method for producing a layer assembly |
| 03/11/2004 | WO2003079434A3 Semiconductor device having a wire bond pad and method therefor |
| 03/11/2004 | WO2003079432A3 Automatically adjusting serial connections of thick and thin layers and method for the production thereof |
| 03/11/2004 | WO2003073467A3 Integrated active moisture and oxygen getter layers |
| 03/11/2004 | WO2003063246A3 Rf amplifier |
| 03/11/2004 | WO2003058717A3 Package for a non-volatile memory device including integrated passive devices and method for making the same |
| 03/11/2004 | WO2003050850A3 Contacting of a semiconductor chip on a substrate using flip-chip-like technology |
| 03/11/2004 | WO2003030245A3 Method for assembly of complementary-shaped receptacle site and device microstructures |
| 03/11/2004 | WO2003028903A3 Method for edge sealing barrier films |
| 03/11/2004 | WO2003007338A3 Method for attaching an electronic component to a substrate |
| 03/11/2004 | US20040049755 Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, charge pump circuit, layout designing apparatus, and layout designing program |
| 03/11/2004 | US20040048971 Epoxy resin composition for semiconductor encapsulation |
| 03/11/2004 | US20040048490 Interlayer insulation film used for multilayer interconnect of semiconductor integrated circuit and method of manufacturing the same |
| 03/11/2004 | US20040048488 Methods of forming vertical power devices having deep and shallow trenches therein |
| 03/11/2004 | US20040048476 Method of manufacturing semiconductor device having metal interconnections of different thickness |
| 03/11/2004 | US20040048473 Method for producing an integrated circuit, at least partially transforming an oxide layer into a conductive layer |
| 03/11/2004 | US20040048465 Method of forming conductor wiring pattern |
| 03/11/2004 | US20040048464 Semiconductor device having a planarized structure and the method for producing the same |
| 03/11/2004 | US20040048463 Semiconductor device and manufacturing method thereof |
| 03/11/2004 | US20040048462 Method for fabricating semiconductor device |
| 03/11/2004 | US20040048459 Positioning circuit within electroconductive substrate; encapsulation |
| 03/11/2004 | US20040048458 Fabrication method for strengthening flip-chip solder bumps |
| 03/11/2004 | US20040048449 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
| 03/11/2004 | US20040048445 Thinned semiconductor wafer and die and corresponding method |
| 03/11/2004 | US20040048421 Method of encapsulating conductive lines of semiconductor devices |
| 03/11/2004 | US20040048418 Low cost and compliant microelectronic packages for high I/O and fine pitch |
| 03/11/2004 | US20040048417 Techniques for joining an opto-electronic module to a semiconductor package |
| 03/11/2004 | US20040048415 Fabrication method for a semiconductor CSP type package |
| 03/11/2004 | US20040048413 Structure and method of direct chip attach |
| 03/11/2004 | US20040048402 Semiconductor device and test method for manufacturing same |
| 03/11/2004 | US20040048401 Semiconductor component having test contacts |
| 03/11/2004 | US20040048202 Metal bump with an insulating sidewall and method of fabricating thereof |
| 03/11/2004 | US20040048039 Method and apparatus for retaining a thermally conductive pin in a thermal spreader plate |
| 03/11/2004 | US20040048033 Oled devices with improved encapsulation |
| 03/11/2004 | US20040047540 Optical module |
| 03/11/2004 | US20040047210 Storage apparatus, card type string apparatus, and electronic apparatus |
| 03/11/2004 | US20040047201 Semiconductor memory device having self-aligned wiring conductor |
| 03/11/2004 | US20040047151 Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| 03/11/2004 | US20040047136 Wiring board having terminal |
| 03/11/2004 | US20040047135 Electronic element |
| 03/11/2004 | US20040047131 Clip for heat sink |
| 03/11/2004 | US20040047130 Heat sink clip assembly |
| 03/11/2004 | US20040047129 Fan-securing device for use with a heat transfer device |
| 03/11/2004 | US20040047127 Method of mounting chip |
| 03/11/2004 | US20040047126 CPU cooling using a heat pipe assembly |
| 03/11/2004 | US20040047125 Module support for electrical/electronic components |
| 03/11/2004 | US20040047109 Method for forming a photoresist pattern, method for forming a capacitor using the same and capacitor |
| 03/11/2004 | US20040046630 Integrated transformer |
| 03/11/2004 | US20040046588 Global chip interconnect |
| 03/11/2004 | US20040046501 Sealing substrate, method of fabricating the same, display device, and electronic instrument |
| 03/11/2004 | US20040046267 Semiconductor package having a die pad with downward extended tabs |
| 03/11/2004 | US20040046266 Method of manufacturing semiconductor device |
| 03/11/2004 | US20040046265 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly |
| 03/11/2004 | US20040046264 High density integrated circuit packages and method for the same |
| 03/11/2004 | US20040046262 Chip mounting substrate, first level assembly, and second level assembly |
| 03/11/2004 | US20040046261 In a semiconductor device, an insulating interlayer having a groove is formed on an insulating underlayer. A silicon-diffused metal layer including no metal silicide is buried in the groove. A metal diffusion barrier layer is formed on the |
| 03/11/2004 | US20040046260 Plasma treatment for copper oxide reduction |
| 03/11/2004 | US20040046259 Composite dielectric layers |
| 03/11/2004 | US20040046258 Specially shaped contact via and integrated circuit therewith |
| 03/11/2004 | US20040046257 Package design and method of manufacture for chip grid array |
| 03/11/2004 | US20040046256 Semiconductor device and method of manufacturing semiconductor device including semiconductor elements mounted on base plate |
| 03/11/2004 | US20040046255 Chip package structure |
| 03/11/2004 | US20040046254 Integrated chip package structure using metal substrate and method of manufacturing the same |
| 03/11/2004 | US20040046253 Method for controlling die attach fillet height to reduce die shear stress |
| 03/11/2004 | US20040046251 Semiconductor contact structure and method of forming the same |
| 03/11/2004 | US20040046250 Multichip wafer level packages and computing systems incorporating same |
| 03/11/2004 | US20040046249 Electronic package with thermally-enhanced lid |
| 03/11/2004 | US20040046248 Microsystem packaging and associated methods |
| 03/11/2004 | US20040046247 Hermetic semiconductor package |
| 03/11/2004 | US20040046246 Press-fit package diode |
| 03/11/2004 | US20040046244 Multilayered substrate for semiconductor device |
| 03/11/2004 | US20040046243 Methods of split cavity wall plating for an integrated circuit package |
| 03/11/2004 | US20040046241 Method of manufacturing enhanced thermal dissipation integrated circuit package |
| 03/11/2004 | US20040046240 Semiconductor device and its manufacturing method |
| 03/11/2004 | US20040046238 Semiconductor chip grid array package design and method of manufacture |
| 03/11/2004 | US20040046237 Lead frame and method of manufacturing the same |
| 03/11/2004 | US20040046236 Semiconductor package method |
| 03/11/2004 | US20040046235 Impedance-Matched electrical interconnect |
| 03/11/2004 | US20040046231 Semiconductor device having a fuse |
| 03/11/2004 | US20040046221 Wafer-level test structure for edge-emitting semiconductor lasers |