| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/17/2004 | CN1482680A Electrostatic discharge protection silicon controlled rectifier (esd-scr) for silicon germanium technologies |
| 03/17/2004 | CN1482679A Semiconductor integrated circuit with shortened pad pitch |
| 03/17/2004 | CN1482678A Heat radiating conduit device |
| 03/17/2004 | CN1482677A Electronic element |
| 03/17/2004 | CN1482676A Integrated circuit plate loading substrate with over-voltage protection function and making method thereof |
| 03/17/2004 | CN1482675A Wafer pad on plastic substrate for accepting integrated circuit wafer |
| 03/17/2004 | CN1482658A Method of manufacturing semiconductor packaging device |
| 03/17/2004 | CN1482655A Metal film semiconductor device and a method for forming the same |
| 03/17/2004 | CN1482523A Microflute evaporating and cooling method and apparatus using same |
| 03/17/2004 | CN1482264A Lead wire framework copper belt for IC and its producing process and method |
| 03/17/2004 | CN1142593C Integrated circuit device and process for its manufacture |
| 03/17/2004 | CN1142590C Method and apparatus for retention of fragile conductive lead using protective clamp |
| 03/17/2004 | CN1142589C Chip carrier |
| 03/17/2004 | CN1142404C Composite high-density heat radiator and its making process |
| 03/17/2004 | CN1142059C Low dielectric constant inorganic/organic hybrid films and method of making it |
| 03/16/2004 | US6707685 Multi-layer wiring board |
| 03/16/2004 | US6707682 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board |
| 03/16/2004 | US6707681 Surface mount typed electronic circuit of small size capable of obtaining a high-Q |
| 03/16/2004 | US6707677 Chip-packaging substrate and test method therefor |
| 03/16/2004 | US6707676 Heat sink for automatic assembling |
| 03/16/2004 | US6707674 Dual spring heat sink retention |
| 03/16/2004 | US6707673 Heat sink for chip stacking applications |
| 03/16/2004 | US6707672 Heat sink clip assembly |
| 03/16/2004 | US6707671 Power module and method of manufacturing the same |
| 03/16/2004 | US6707669 Heat dissipation apparatus |
| 03/16/2004 | US6707512 Liquid crystal display units with data line being formed of molybdenum alloy having chromium content |
| 03/16/2004 | US6707334 Semiconductor integrated circuit |
| 03/16/2004 | US6707312 Pseudo variable resistor for tester platform |
| 03/16/2004 | US6707247 Mounting led on each of plurality of divisions of substrate aggregation, forming transparent layer, cutting off at division lines, forming second transparent layer, cutting off, forming reflector film on outside walls, dividing at lines |
| 03/16/2004 | US6707168 Shielded semiconductor package with single-sided substrate and method for making the same |
| 03/16/2004 | US6707167 Semiconductor package with crack-preventing member |
| 03/16/2004 | US6707166 Semiconductor devices and manufacturing method thereof |
| 03/16/2004 | US6707164 Package of semiconductor chip with array-type bonding pads |
| 03/16/2004 | US6707163 Method of eliminating uncontrolled voids in sheet adhesive layer |
| 03/16/2004 | US6707162 Chip package structure |
| 03/16/2004 | US6707160 Semiconductor device using substrate having cubic structure and method of manufacturing the same |
| 03/16/2004 | US6707159 Semiconductor chip and production process therefor |
| 03/16/2004 | US6707158 Semiconductor device and method for producing the same, and anisotropic conductive circuit board |
| 03/16/2004 | US6707157 Three dimensional semiconductor integrated circuit device having a piercing electrode |
| 03/16/2004 | US6707156 Semiconductor device with multilevel wiring layers |
| 03/16/2004 | US6707154 Semiconductor device and production method for the same |
| 03/16/2004 | US6707153 Semiconductor chip with plural resin layers on a surface thereof and method of manufacturing same |
| 03/16/2004 | US6707152 Semiconductor device, electrical conductor system, and method of making |
| 03/16/2004 | US6707151 Semiconductor device |
| 03/16/2004 | US6707149 Package having back face of microelectronic element mounted to top surface of first substrate, contacts electrically connected with conductive pads of second substrate by conductive wires, overlying dielectric sheet |
| 03/16/2004 | US6707148 Bumped integrated circuits for optical applications |
| 03/16/2004 | US6707147 Substrates and assemblies including pre-applied adhesion promoter |
| 03/16/2004 | US6707146 Semiconductor apparatus with decoupling capacitor |
| 03/16/2004 | US6707145 Efficient multiple power and ground distribution of SMT IC packages |
| 03/16/2004 | US6707144 Insulated high speed semiconductor switching device |
| 03/16/2004 | US6707142 Package stacked semiconductor device having pin linking means |
| 03/16/2004 | US6707141 Multi-chip module substrate for use with leads-over chip type semiconductor devices |
| 03/16/2004 | US6707140 Arrayable, scaleable, and stackable molded package configuration |
| 03/16/2004 | US6707139 Semiconductor device with plural unit regions in which one or more MOSFETs are formed |
| 03/16/2004 | US6707138 Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe |
| 03/16/2004 | US6707137 Semiconductor package and method for fabricating the same |
| 03/16/2004 | US6707136 Multi-layer lead frame for a semiconductor device |
| 03/16/2004 | US6707135 Semiconductor leadframe for staggered board attach |
| 03/16/2004 | US6707129 Fuse structure integrated wire bonding on the low k interconnect and method for making the same |
| 03/16/2004 | US6707125 Solid-state imaging apparatus and manufacturing method thereof |
| 03/16/2004 | US6707124 HID land grid array packaged device having electrical and optical interconnects |
| 03/16/2004 | US6707117 Method of providing semiconductor interconnects using silicide exclusion |
| 03/16/2004 | US6707108 Transient voltage suppressor structure |
| 03/16/2004 | US6707103 Low voltage rad hard MOSFET |
| 03/16/2004 | US6707093 Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitors |
| 03/16/2004 | US6707091 Semiconductor device having capacitor |
| 03/16/2004 | US6707064 Test element group structure |
| 03/16/2004 | US6706973 Electrical connection with inwardly deformable contacts |
| 03/16/2004 | US6706972 Electronic assembly comprising a sole plate forming a heat sink |
| 03/16/2004 | US6706971 Stackable microcircuit layer formed from a plastic encapsulated microcircuit |
| 03/16/2004 | US6706967 Lead-less semiconductor device with improved electrode pattern structure |
| 03/16/2004 | US6706646 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same |
| 03/16/2004 | US6706629 Barrier-free copper interconnect |
| 03/16/2004 | US6706624 Method for making multichip module substrates by encapsulating electrical conductors |
| 03/16/2004 | US6706621 Wafer integrated rigid support ring |
| 03/16/2004 | US6706610 Semiconductor device and fabrication process thereof |
| 03/16/2004 | US6706609 Method of forming an alignment feature in or on a multi-layered semiconductor structure |
| 03/16/2004 | US6706588 Method of fabricating an integrated circuit having embedded vertical capacitor |
| 03/16/2004 | US6706584 On-die de-coupling capacitor using bumps or bars and method of making same |
| 03/16/2004 | US6706565 Methods of forming an integrated circuit device |
| 03/16/2004 | US6706564 Method for fabricating semiconductor package and semiconductor package |
| 03/16/2004 | US6706563 Heat spreader interconnect methodology for thermally enhanced PBGA packages |
| 03/16/2004 | US6706562 Electronic assembly with high capacity thermal spreader and methods of manufacture |
| 03/16/2004 | US6706561 Method for fabricating preplated nickel/palladium and tin leadframes |
| 03/16/2004 | US6706560 Method of forming heat sink and semiconductor chip assemblies |
| 03/16/2004 | US6706559 Method of attaching a leadframe to singulated semiconductor dice |
| 03/16/2004 | US6706558 Manufacturing method of semiconductor device |
| 03/16/2004 | US6706557 Method of fabricating stacked die configurations utilizing redistribution bond pads |
| 03/16/2004 | US6706555 Method for filling a gap between spaced layers of a semiconductor |
| 03/16/2004 | US6706554 Conductor posts, construction for and method of fabricating semiconductor integrated circuit chips using the conductor post, and method of probing semiconductor integrated circuit chips |
| 03/16/2004 | US6706553 Dispensing process for fabrication of microelectronic packages |
| 03/16/2004 | US6706547 Method of manufacturing a circuit device with trenches in a conductive foil |
| 03/16/2004 | US6706546 Optical reflective structures and method for making |
| 03/16/2004 | US6706540 Method of manufacturing a semiconductor device with a hydrogen barrier layer |
| 03/16/2004 | US6706422 Electroless Ni—B plating liquid, electronic device and method for manufacturing the same |
| 03/16/2004 | US6706417 Fluxing underfill compositions |
| 03/16/2004 | US6706409 Silicone oligomer, a specified amount of metal hydrate such as aluminum hydroxide, and a resin; heat resistance, free of bromine compounds |
| 03/16/2004 | US6706374 Stereolithographically marked semiconductor devices and methods |
| 03/16/2004 | US6706219 Comprises resin of vinyl terminated polydimethyl siloxane, methylhydrosiloxane-dimethylsiloxane copolymers, polysilicate, silicone rubber formed with use of karstedt cataylst; heat dissipation; heat resistant semiconductors |
| 03/16/2004 | US6705795 Attachment mechanism |