| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/18/2004 | US20040053429 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip |
| 03/18/2004 | US20040053061 100 parts of a thermoplastic resin or a mixture with a thermosetting resin and .1-100 parts of a layered silicate |
| 03/18/2004 | US20040053039 Heat conductive material |
| 03/18/2004 | US20040053033 Multifunctional monomers and their use in making cross-linked polymers and porous films |
| 03/18/2004 | US20040052998 Preappliable phase change thermal interface pad |
| 03/18/2004 | US20040052990 Novel pad structure to prompt excellent bondability for low-k intermetal dielectric layers |
| 03/18/2004 | US20040052933 Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition |
| 03/18/2004 | US20040052886 Molds for wafer scale molding of protective caps |
| 03/18/2004 | US20040052663 Device for the local cooling or heating of an object |
| 03/18/2004 | US20040052064 Electromagnetic shielding and cooling device for printed circuit board |
| 03/18/2004 | US20040052060 Low profile chip scale stacking system and method |
| 03/18/2004 | US20040052057 Cooling device, electronic apparatus, display unit, and method of producing cooling device |
| 03/18/2004 | US20040052056 Cooling device, electronic equipment device, and method of manufacturing cooling device |
| 03/18/2004 | US20040052055 Fixing apparatus for heat sink |
| 03/18/2004 | US20040052054 Heat dissipating assembly |
| 03/18/2004 | US20040052053 Clip for heat sink |
| 03/18/2004 | US20040052052 Circuit cooling apparatus |
| 03/18/2004 | US20040052051 Heat sink with heat pipe and base fins |
| 03/18/2004 | US20040052050 Polymer solder hybrid |
| 03/18/2004 | US20040052049 Integrated fluid cooling system for electronic components |
| 03/18/2004 | US20040052048 Integrated fluid cooling system for electronic components |
| 03/18/2004 | US20040052027 Heat sink and electromagnetic interference reduction device |
| 03/18/2004 | US20040051553 Test structures for on-chip real-time reliability testing |
| 03/18/2004 | US20040051547 Semiconductor wafer testing system |
| 03/18/2004 | US20040051184 Hermetic chip and method of manufacture |
| 03/18/2004 | US20040051183 Method of forming self-aligned contact structure with locally etched gate conductive layer |
| 03/18/2004 | US20040051182 Flip-chip BGA semiconductor device for achieving a superior cleaning effect |
| 03/18/2004 | US20040051180 Interconnect, interconnect forming method, thin film transistor, and display device |
| 03/18/2004 | US20040051179 Platinum-containing integrated circuits and capacitor constructions |
| 03/18/2004 | US20040051178 Semiconductor recessed mask interconnect technology |
| 03/18/2004 | US20040051177 Adaptation of an integrated circuit to specific needs |
| 03/18/2004 | US20040051176 Roughness at interface; solidification in argon plasma |
| 03/18/2004 | US20040051175 Forming metal barrier for overcoating substrate; then nitriding; multilayer coating |
| 03/18/2004 | US20040051174 Electronic device with a voltage supply structure, semiconductor wafer with electronic devices, and associated production methods |
| 03/18/2004 | US20040051173 High frequency interconnect system using micromachined plugs and sockets |
| 03/18/2004 | US20040051172 Radiation type bga package and production method therefor |
| 03/18/2004 | US20040051171 Surface mountable electronic device |
| 03/18/2004 | US20040051170 Semiconductor device and method of manufacturing the same |
| 03/18/2004 | US20040051169 Lead-bond type chip package and manufacturing method thereof |
| 03/18/2004 | US20040051168 Semiconductor device and method for manufacturing the same |
| 03/18/2004 | US20040051167 Semiconductor device and its manufacturing method |
| 03/18/2004 | US20040051166 Shielding line system for an integrated circuit |
| 03/18/2004 | US20040051163 Strobe light control circuit and IGBT device |
| 03/18/2004 | US20040051162 Structure and method of providing reduced programming voltage antifuse |
| 03/18/2004 | US20040051158 Semiconductor device |
| 03/18/2004 | US20040051155 Fingerprint sensor |
| 03/18/2004 | US20040051146 ESD protection circuit with high substrate-triggering efficiency |
| 03/18/2004 | US20040051127 Semiconductor device |
| 03/18/2004 | US20040051122 Semiconductor integrated circuit device |
| 03/18/2004 | US20040051120 Semiconductor device and method of manufacturing the same |
| 03/18/2004 | US20040051119 Stacked semiconductor device and method of producing the same |
| 03/18/2004 | US20040051117 Method of using materials based on Ruthenium and Iridium and their oxides, as a Cu diffusion barrier, and integrated circuits incorporating same |
| 03/18/2004 | US20040051116 Contact bump construction for the production of a connector construction for substrate connecting surfaces |
| 03/18/2004 | US20040051102 Electronic circuit |
| 03/18/2004 | US20040051098 Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing |
| 03/18/2004 | US20040050911 Solder-fill and its manufacturing method for using semiconductor package and its application for mounting semiconductor chip on PCB |
| 03/18/2004 | US20040050587 Transmission line and device including the same |
| 03/18/2004 | US20040050585 Method to obtain high density signal wires with low resistance in an electronic package |
| 03/18/2004 | US20040050536 Heat-emitting element cooling apparatus |
| 03/18/2004 | US20040050535 Heat sink with angled heat pipe |
| 03/18/2004 | US20040050534 Heat sink with heat pipe in direct contact with component |
| 03/18/2004 | US20040050533 Modular capillary pumped loop cooling system |
| 03/18/2004 | US20040049912 Embedding electrical and electronic apparatus such as integrated circuit chips, semiconductors, capacitors or resistors in printed circuits |
| 03/18/2004 | DE20317298U1 Heat exchanger has flow channels within main body and has heat transfer elements in the channels |
| 03/18/2004 | DE19651549B4 Anschlußrahmen und Chipgehäuse Lead frame and chip package |
| 03/18/2004 | DE10339986A1 System und Verfahren zum Verbessern von Justiermarken System and method for improving alignment marks |
| 03/18/2004 | DE10240921A1 Process for selectively metallizing, especially gold-plating, three dimensional structures on wafers such as contact bumps in the production of circuit boards comprises partially immersing the structures on the wafer in an electrolyte |
| 03/18/2004 | DE10240641A1 Cooling air guide for computer component e.g. processor, has flexible U-shaped element fitted on one side to motherboard and being movable in three directions on side connected to the cooling air outlet |
| 03/18/2004 | DE10240355A1 Composite component used in the production of optical lenses and filters comprises bodies joined together by a solder connection free from a fluxing agent |
| 03/18/2004 | CA2670068A1 Metallic material for electronic components, method of working and process for producing thereof |
| 03/18/2004 | CA2669987A1 Metallic material for electronic components, method of working and process for producing thereof |
| 03/18/2004 | CA2497482A1 optical microsystem and method for making same |
| 03/18/2004 | CA2497451A1 Organic species that facilitate charge transfer to or from nanostructures |
| 03/18/2004 | CA2497395A1 Metallic material for electronic components, method of working and process for producing thereof |
| 03/17/2004 | EP1399005A2 Housing preform and electronic apparatus using the same |
| 03/17/2004 | EP1398834A2 Electronic device with voltage supply structure and method of producing it |
| 03/17/2004 | EP1398833A2 High performance passive cooling device with ducting |
| 03/17/2004 | EP1398832A2 Camera module for compact electronic equipments |
| 03/17/2004 | EP1398831A2 Air gaps formation |
| 03/17/2004 | EP1398828A2 Semiconductor package with a precured polymer encapsulating compound and method for manufacturing the same |
| 03/17/2004 | EP1398801A2 Inductor for radio frequency integrated circuit |
| 03/17/2004 | EP1398639A2 Test structures for on-chip real-time reliability testing |
| 03/17/2004 | EP1398511A1 Local cooling system |
| 03/17/2004 | EP1397836A2 Mmic with off-chip bias feed system |
| 03/17/2004 | EP1397835A2 Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure |
| 03/17/2004 | EP1397833A2 System and method to form a composite film stack utilizing sequential deposition techniques |
| 03/17/2004 | EP1397831A1 A method of packaging a semiconductor chip |
| 03/17/2004 | EP1397830A2 Copper vias in low-k technology |
| 03/17/2004 | EP1397325A1 A method of producing a metal-containing single-phase composition. |
| 03/17/2004 | EP1206825A4 Universal energy conditioning interposer with circuit architecture |
| 03/17/2004 | EP0885483A4 Push-pull power amplifier |
| 03/17/2004 | CN2606968Y Structure improved integrated circuit anti-interference band |
| 03/17/2004 | CN2606967Y Heat radiation layer of awaiting radiator |
| 03/17/2004 | CN2606966Y Stacking type chip packaging body |
| 03/17/2004 | CN2606965Y Integrated circuit connector |
| 03/17/2004 | CN2606964Y Insulation type high power electric semiconductor module |
| 03/17/2004 | CN1483303A Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 03/17/2004 | CN1483220A Welding and caulking material for silicon wafer and layered electronic package manufactured using the same |
| 03/17/2004 | CN1483208A Method and apparatus for making semiconductor device and the semiconductor device |
| 03/17/2004 | CN1482681A 半导体集成电路装置 The semiconductor integrated circuit device |