| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/23/2004 | US6710438 Enhanced chip scale package for wire bond dies |
| 03/23/2004 | US6710437 Semiconductor device having a chip-size package |
| 03/23/2004 | US6710436 Method and apparatus for electrostatically aligning integrated circuits |
| 03/23/2004 | US6710434 Window-type semiconductor package and fabrication method thereof |
| 03/23/2004 | US6710433 Leadless chip carrier with embedded inductor |
| 03/23/2004 | US6710432 Integrated circuit package with low inductance ground path and improved thermal capability |
| 03/23/2004 | US6710431 Semiconductor device and lead frame used therefor |
| 03/23/2004 | US6710430 Resin-encapsulated semiconductor device and method for manufacturing the same |
| 03/23/2004 | US6710429 Semiconductor device and process for production thereof |
| 03/23/2004 | US6710428 Porous silicon oxycarbide integrated circuit insulator |
| 03/23/2004 | US6710426 Semiconductor device and transceiver apparatus |
| 03/23/2004 | US6710421 Semiconductor devices and methods for manufacturing the same |
| 03/23/2004 | US6710415 Semiconductor integrated circuit having anti-fuse, method of fabricating, and method of writing data in the same |
| 03/23/2004 | US6710384 Capacitive element and wiring structure comprising tungsten, molybdenum, tantalum, copper and/or silicide or nitride layers; oxygen barriers |
| 03/23/2004 | US6710376 Opto-coupler based on integrated forward biased silicon diode LED |
| 03/23/2004 | US6710372 Thin film transistor array panel for liquid crystal display |
| 03/23/2004 | US6710364 Semiconductor wafer edge marking |
| 03/23/2004 | US6710286 Chip scale marker and making method |
| 03/23/2004 | US6710284 Laser marking techniques for bare semiconductor die |
| 03/23/2004 | US6710265 Multi-strand substrate for ball-grid array assemblies and method |
| 03/23/2004 | US6710264 Method and apparatus for supporting a circuit component having solder column interconnects using external support |
| 03/23/2004 | US6710263 Semiconductor devices |
| 03/23/2004 | US6710258 Circuitized substrate for high-frequency applications |
| 03/23/2004 | US6710246 Apparatus and method of manufacturing a stackable package for a semiconductor device |
| 03/23/2004 | US6710238 Shock and strain resistance; formability; laminar bodies contain bismuth(-aluminum), polyamide and silver-iron; rolling or uniaxially pressing |
| 03/23/2004 | US6709987 Method and apparatus for forming improved metal interconnects |
| 03/23/2004 | US6709980 Using stabilizers in electroless solutions to inhibit plating of fuses |
| 03/23/2004 | US6709978 Method for forming integrated circuits using high aspect ratio vias through a semiconductor wafer |
| 03/23/2004 | US6709977 Integrated circuit having oversized components and method of manafacture thereof |
| 03/23/2004 | US6709971 Interconnect structures in a semiconductor device and processes of formation |
| 03/23/2004 | US6709968 Microelectronic device with package with conductive elements and associated method of manufacture |
| 03/23/2004 | US6709967 Laser wire bonding for wire embedded dielectrics to integrated circuits |
| 03/23/2004 | US6709966 Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device |
| 03/23/2004 | US6709965 Aluminum-copper bond pad design and method of fabrication |
| 03/23/2004 | US6709964 Semiconductor device and manufacturing method using a stress-relieving film attached to solder joints |
| 03/23/2004 | US6709963 Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps |
| 03/23/2004 | US6709918 Method for making a metal-insulator-metal (MIM) capacitor and metal resistor for a copper back-end-of-line (BEOL) technology |
| 03/23/2004 | US6709899 Methods of making microelectronic assemblies having conductive elastomeric posts |
| 03/23/2004 | US6709898 Die-in-heat spreader microelectronic package |
| 03/23/2004 | US6709897 Method of forming IC package having upward-facing chip cavity |
| 03/23/2004 | US6709895 Packaged microelectronic elements with enhanced thermal conduction |
| 03/23/2004 | US6709893 Interconnections for a semiconductor device and method for forming same |
| 03/23/2004 | US6709892 Electronic device fabrication method comprising twofold cutting of conductor member |
| 03/23/2004 | US6709891 Open-cavity semiconductor die package |
| 03/23/2004 | US6709890 Method of manufacturing semiconductor integrated circuit device |
| 03/23/2004 | US6709889 Smart card module and method of assembling the same |
| 03/23/2004 | US6709874 Method of manufacturing a metal cap layer for preventing damascene conductive lines from oxidation |
| 03/23/2004 | US6709753 Adherence, heat resistance and humidity resistance, flexibility and impact resistance |
| 03/23/2004 | US6709749 Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate |
| 03/23/2004 | US6709741 FPC adhesive of epoxy resin, onium hexafluoroantimonate, nitrile rubber and filler |
| 03/23/2004 | US6709606 Anisotropic conductive film and production method thereof |
| 03/23/2004 | US6709555 Plating method, interconnection forming method, and apparatus for carrying out those methods |
| 03/23/2004 | US6709285 Electric connecting elements for piezoelectric plates |
| 03/23/2004 | US6708873 Apparatus and method for filling high aspect ratio via holes in electronic substrates |
| 03/23/2004 | US6708754 Flexible heat pipe |
| 03/23/2004 | US6708515 Passive spray coolant pump |
| 03/23/2004 | US6708501 Cooling of electronics by electrically conducting fluids |
| 03/23/2004 | US6708405 Masking insulating layer on semiconductor substrate, forming contact hole by isotropic, then anisotropic etching, removing mask, filling hole with conductor, etching back, forming adhesion promoting layer, filling with second conductor |
| 03/23/2004 | US6708403 Angled flying lead wire bonding process |
| 03/23/2004 | US6708398 Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package |
| 03/18/2004 | WO2004023857A1 Heat spreader with surface cavity |
| 03/18/2004 | WO2004023597A1 Strip line device, member to be mounted on printed wiring board, circuit board, semiconductor package, and its fabricating method |
| 03/18/2004 | WO2004023552A1 Multichp semiconductor device, test method, and system board |
| 03/18/2004 | WO2004023551A1 Mram mtj stack to conductive line alignment method |
| 03/18/2004 | WO2004023546A1 Methods of making microelectronic packages including folded substrates |
| 03/18/2004 | WO2004023542A1 Semiconductor device and its manufacturing method |
| 03/18/2004 | WO2004023528A2 A thinned semiconductor wafer and die and corresponding method |
| 03/18/2004 | WO2004022803A1 Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part |
| 03/18/2004 | WO2004022714A2 Organic species that facilitate charge transfer to or from nanostructures |
| 03/18/2004 | WO2004022477A1 Microchip with thermal stress relief means |
| 03/18/2004 | WO2004022330A1 Thermal interface materials |
| 03/18/2004 | WO2003100846A3 Glass material for use at high frequencies |
| 03/18/2004 | WO2003075340A3 Method for obtaining metal to metal contact between a metal surface and a bonding pad. |
| 03/18/2004 | WO2003072846A9 A method of depositing a barrier layer |
| 03/18/2004 | WO2003065775A3 Heat-sink with large fins-to-air contact area |
| 03/18/2004 | WO2003061029A3 Organic compositions |
| 03/18/2004 | WO2003046986A3 Semiconductor device, and means for checking the authenticity |
| 03/18/2004 | WO2003034495A3 Method for packing electronic modules and multiple chip packaging |
| 03/18/2004 | WO2003030252B1 Process for producing interconnects |
| 03/18/2004 | WO2003010797A3 Test structures for electrical linewidth measurement and processes for their formation |
| 03/18/2004 | WO2003007363A8 Method and apparatus for removing a carrier part from a carrier with a single operation, and a product removed from a carrier |
| 03/18/2004 | US20040054980 Embossed mask lithography |
| 03/18/2004 | US20040054119 Curing agent for epoxy resins and epoxy resin composition |
| 03/18/2004 | US20040054061 Waterproof, heat resistance, shockproof; undercoating for semiconductor, flip chips |
| 03/18/2004 | US20040054029 Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work |
| 03/18/2004 | US20040053946 Cancer treatment method |
| 03/18/2004 | US20040053501 Self aligned vias in dual damascene interconnect, buried mask approach |
| 03/18/2004 | US20040053497 Large line conductive pads for interconnection of stackable circuitry |
| 03/18/2004 | US20040053495 Method of forming barrier layers |
| 03/18/2004 | US20040053489 Multilayer wiring substrate, and method of producing same |
| 03/18/2004 | US20040053488 Ball electrode forming method |
| 03/18/2004 | US20040053487 Metal fuse for semiconductor devices |
| 03/18/2004 | US20040053483 Methods of forming electronic structures including conductive shunt layers and related structures |
| 03/18/2004 | US20040053482 Manufacturing method of semiconductor device |
| 03/18/2004 | US20040053463 Method of manufacturing semiconductor device |
| 03/18/2004 | US20040053447 Leadframe having fine pitch bond fingers formed using laser cutting method |
| 03/18/2004 | US20040053446 Semiconductor device and manufacturing method of the same |
| 03/18/2004 | US20040053445 Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip |
| 03/18/2004 | US20040053444 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board |
| 03/18/2004 | US20040053443 Molded flip chip package |