| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/25/2004 | DE10241589A1 Process for solder-stop structuring protrusions on wafers such as three dimensional contact structures for improving integration comprises depositing a resist on the three dimensional structure, and further processing |
| 03/25/2004 | DE10125636B4 Kühler für elektrische und/oder elektronische Bauteile Cooler for electrical and / or electronic components |
| 03/25/2004 | CA2498669A1 Method for selectively covering a micro machined surface |
| 03/24/2004 | EP1401250A1 Electrodes with a mesh structure |
| 03/24/2004 | EP1401020A1 Semiconductor device and manufacturing method thereof |
| 03/24/2004 | EP1401019A2 Electronic device, especially regulator for generators in engine driven vehicles |
| 03/24/2004 | EP1401018A2 Unpassivated laser fuse with blast barrier to reduce splattering |
| 03/24/2004 | EP1401017A2 Package structure for printed circuit board |
| 03/24/2004 | EP1401016A2 Self aligned vias in dual damascene interconnect, buried mask approach |
| 03/24/2004 | EP1400860A2 Lithographic marker structure, lithographic projection apparatus comprising such a lithographic marker structure and method for substrate alignment using such a lithographic marker structure |
| 03/24/2004 | EP1400848A1 Circuitry with embossed portions |
| 03/24/2004 | EP1400613A2 Tin plating method |
| 03/24/2004 | EP1400567A1 Thermosetting resin composition, epoxy resin molding material and semiconductor device |
| 03/24/2004 | EP1400553A2 Polyalkylene polysulphides |
| 03/24/2004 | EP1400500A1 Apparatus, mold, and method for manufacturing metal-ceramic composite member |
| 03/24/2004 | EP1399966A2 Power pads for application of high current per bond pad in silicon technology |
| 03/24/2004 | EP1399958A1 Process for forming fusible links |
| 03/24/2004 | EP1399952A1 Opto-electronic device integration |
| 03/24/2004 | EP1399951A2 Interchangeable microdeposition head apparatus and method |
| 03/24/2004 | EP1399950A2 Formation of printed circuit board structures using piezo microdeposition |
| 03/24/2004 | EP1399782A2 Method of measuring critical dimension and overlay in single step |
| 03/24/2004 | EP1399612A1 Thermal management material, devices and methods therefor |
| 03/24/2004 | EP1399269A1 Waveform generator for microdeposition control system |
| 03/24/2004 | EP1399268A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
| 03/24/2004 | EP1399267A1 Microdeposition apparatus |
| 03/24/2004 | EP1244534B1 Energy-efficient, laser-based method and system for processing target material |
| 03/24/2004 | EP0894339B1 Silicon carbide cmos and method of fabrication |
| 03/24/2004 | EP0852067B1 Low rc interconnection |
| 03/24/2004 | CN2607666Y 结构改进的散热片 Structural improvements fins |
| 03/24/2004 | CN2607665Y Radiating fin structure for radiator |
| 03/24/2004 | CN2607619Y Inserting structure of radiating fins |
| 03/24/2004 | CN2607618Y Computer CPU radiator without using electricity |
| 03/24/2004 | CN1484936A An electronic device |
| 03/24/2004 | CN1484934A Via-in-pad with off-center geometry and method of manufacture |
| 03/24/2004 | CN1484857A Cu-pad/bonded/cu-wire with self-passivating cu-alloys |
| 03/24/2004 | CN1484856A Interconnect structures and a method of electroless introduction of interconnect structures |
| 03/24/2004 | CN1484512A Finger print detection device |
| 03/24/2004 | CN1484482A Multi-layer wire distributed substrate and mfg method |
| 03/24/2004 | CN1484310A Semiconductor having formed capacitor in multi-layer wire distributing structure |
| 03/24/2004 | CN1484306A Package substrate with electrostatic discharge protection |
| 03/24/2004 | CN1484305A Method for inproving electrostatic protection by design of ITO wire distribution |
| 03/24/2004 | CN1484304A Semiconductor device and mfg method thereof |
| 03/24/2004 | CN1484303A Semiconductor device and mfg method thereof |
| 03/24/2004 | CN1484302A High radiation miniature package for semiconductor chip |
| 03/24/2004 | CN1484254A Electronic apparatus |
| 03/24/2004 | CN1484210A LED display module with high radiation property and base plate thereof |
| 03/24/2004 | CN1484122A Electronic apparatus |
| 03/24/2004 | CN1483988A Counter-strecam mode oscillating-flow heat transport apparatus |
| 03/24/2004 | CN1143395C Semiconductor device and its associated ICs |
| 03/24/2004 | CN1143386C Semiconductor device shielded by an array of electrically conducting pins and manufacture thereof |
| 03/24/2004 | CN1143385C Semi-conductor element of non-resistance characteristic material for realizing electrostatic discharge protection |
| 03/24/2004 | CN1143384C 半导体器件 Semiconductor devices |
| 03/24/2004 | CN1143383C Chip module especially for implantation in chip card body |
| 03/24/2004 | CN1143382C Insulated substrate, its making method and modular semiconductor device having the same thereof |
| 03/24/2004 | CN1143378C Semiconductor fuse forming method and IC having same |
| 03/24/2004 | CN1143375C Semiconductor device, method of manufacture, circuit board and electronic device |
| 03/24/2004 | CN1143374C Semiconductor device, method of manufacture thereof, circuit board and electronic device |
| 03/24/2004 | CN1143373C Semiconductor device, method of manufacture thereof circuit board and electronic device |
| 03/24/2004 | CN1143372C Method for mfg. semiconductor device |
| 03/24/2004 | CN1143371C Resin-encapsulated semiconductor device and method for manufacturing the same |
| 03/24/2004 | CN1143368C Improved gapfill of semiconductor structure using doped silicate glasses |
| 03/24/2004 | CN1143321C Decision method for semiconductor integrated circuit whether on not qualified and semiconductor integrated circuit |
| 03/24/2004 | CN1143170C Tape carrier package and display device using the same |
| 03/24/2004 | CN1143154C Optomodule |
| 03/24/2004 | CN1142843C Pb-free solder-connected structure and electronic device |
| 03/23/2004 | US6711727 Method and arrangement for layout and manufacture of gridless nonManhattan semiconductor integrated circuits |
| 03/23/2004 | US6711721 Method for adding redundant vias on VLSI chips |
| 03/23/2004 | US6711029 Low temperature co-fired ceramic with improved shrinkage control |
| 03/23/2004 | US6711019 Mounting fitting of heat sink and method of removing the same |
| 03/23/2004 | US6711018 Heat-dissipating module |
| 03/23/2004 | US6711016 Side exhaust heat dissipation module |
| 03/23/2004 | US6711015 Device for cooling CPU chip |
| 03/23/2004 | US6711013 Active heat sink utilizing hot plug fans |
| 03/23/2004 | US6710990 Low voltage breakdown element for ESD trigger device |
| 03/23/2004 | US6710745 High-frequency communication apparatus and method of manufacturing the same |
| 03/23/2004 | US6710639 Emitter turn-off thyristors and their drive circuits |
| 03/23/2004 | US6710610 Socket for testing of semiconductor device, and semiconductor device and method of manufacturing the semiconductor device |
| 03/23/2004 | US6710466 Method of fabricating integrated circuit having self-aligned metal contact structure |
| 03/23/2004 | US6710464 Resin mold semiconductor device |
| 03/23/2004 | US6710463 Electrically isolated power semiconductor package |
| 03/23/2004 | US6710462 Method of pressure curing for reducing voids in a die attach bondline and applications thereof |
| 03/23/2004 | US6710461 Solder bumps formed on conductor plugs; damage prevention |
| 03/23/2004 | US6710460 Semiconductor devices and methods for manufacturing the same |
| 03/23/2004 | US6710459 Flip-chip die for joining with a flip-chip substrate |
| 03/23/2004 | US6710458 Tape for chip on film and semiconductor therewith |
| 03/23/2004 | US6710457 Integrated circuit carrier |
| 03/23/2004 | US6710456 Composite interposer for BGA packages |
| 03/23/2004 | US6710453 Integrated circuit containing redundant core and peripheral contacts |
| 03/23/2004 | US6710452 Coherent diffusion barriers for integrated circuit interconnects |
| 03/23/2004 | US6710451 Interconnect structure and method for forming the same |
| 03/23/2004 | US6710450 Interconnect structure with precise conductor resistance and method to form same |
| 03/23/2004 | US6710449 Interconnection structure and method for designing the same |
| 03/23/2004 | US6710448 Bonding pad structure |
| 03/23/2004 | US6710447 Integrated circuit chip with high-aspect ratio vias |
| 03/23/2004 | US6710446 Semiconductor device comprising stress relaxation layers and method for manufacturing the same |
| 03/23/2004 | US6710443 Integrated circuit providing thermally conductive structures substantially horizontally coupled to one another within one or more heat dissipation layers to dissipate heat from a heat generating structure |
| 03/23/2004 | US6710442 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
| 03/23/2004 | US6710441 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor |
| 03/23/2004 | US6710440 Low resistance contact for an integrated circuit |
| 03/23/2004 | US6710439 Three-dimensional power semiconductor module and method of manufacturing the same |