| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/25/2004 | WO2003069671A3 Rf transition for an area array package |
| 03/25/2004 | WO2003065447A3 No-flow underfill encapsulant |
| 03/25/2004 | WO2003058712A3 Method for assigning power and ground pins in array packages to enhance next level routing |
| 03/25/2004 | WO2002025698A3 Cooling body, especially for cooling electronic components |
| 03/25/2004 | WO2001082335A3 Real-time evaluation of stress fields and properties in line features formed on substrates |
| 03/25/2004 | US20040060030 Power supply wiring method for semiconductor integrated circuit and semiconductor integrated circuit |
| 03/25/2004 | US20040059528 Semiconductor having reduced configuration pins and method thereof |
| 03/25/2004 | US20040058552 Method for etching organic insulating film and method for fabricating semiconductor device |
| 03/25/2004 | US20040058547 Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects |
| 03/25/2004 | US20040058538 Dual damamscene process |
| 03/25/2004 | US20040058525 Method of forming plug |
| 03/25/2004 | US20040058524 Method of manufacturing semiconductor device |
| 03/25/2004 | US20040058522 Integrated circuit devices formed through selective etching of an insulation layer to increase the self-aligned contact area adjacent a semiconductor region |
| 03/25/2004 | US20040058520 Support structures for wirebond regions of contact pads over low modulus materials |
| 03/25/2004 | US20040058479 Semiconductor device and a method of manufacturing the same |
| 03/25/2004 | US20040058478 Taped lead frames and methods of making and using the same in semiconductor packaging |
| 03/25/2004 | US20040058477 Integrated circuit package and manufacturing method therefor |
| 03/25/2004 | US20040058476 Wafer bonding hermetic encapsulation |
| 03/25/2004 | US20040058474 Semiconductor chip module and method of manufacture of same |
| 03/25/2004 | US20040058473 Substrate for an electric component and method for the production thereof |
| 03/25/2004 | US20040058472 Area array semiconductor package and 3-dimensional stack thereof |
| 03/25/2004 | US20040058471 Fabrication method for ball grid array semiconductor package |
| 03/25/2004 | US20040058470 Methods of forming a contact array in situ on a substrate and resulting substrate assemblies |
| 03/25/2004 | US20040058277 Mechanically robust interconnect for low-k dielectric material using post treatment |
| 03/25/2004 | US20040058199 Hexagonal boron nitride film with low dielectric constant, layer dielectric film and method of production thereof, and plasma CVD apparatus |
| 03/25/2004 | US20040058192 Can be applied to a wiring structure, a circuit |
| 03/25/2004 | US20040058160 Thermosetting resin composition, epoxy resin molding material and semiconductor device |
| 03/25/2004 | US20040057301 Integrated circuit having electrical connecting elements |
| 03/25/2004 | US20040057300 Structure of power supply path utilized in design of integrated circuit |
| 03/25/2004 | US20040057292 Test structure for measuring a junction resistance in a DRAM memory cell array |
| 03/25/2004 | US20040057222 Method of making a center bond flip chip semiconductor carrier |
| 03/25/2004 | US20040057221 Dynamic isolating mount for processor packages |
| 03/25/2004 | US20040057215 Electronic component, in particular regulator for generators in motor vehicles |
| 03/25/2004 | US20040057214 Thermally enhanced lid for multichip modules |
| 03/25/2004 | US20040057213 Method and apparatus for force transfer via bare die package |
| 03/25/2004 | US20040057212 Heatsink retention apparatus |
| 03/25/2004 | US20040057208 Power module |
| 03/25/2004 | US20040057207 Electronic apparatus including a cooling unit for cooling a heat generating component |
| 03/25/2004 | US20040057206 Radiating structural body of electronic part and radiating sheet used for the radiating structural body |
| 03/25/2004 | US20040057192 Cascade capacitor |
| 03/25/2004 | US20040057184 Circuit board with added impedance |
| 03/25/2004 | US20040057085 Monolithic micro scanning device |
| 03/25/2004 | US20040057052 Measurement of lateral diffusion of diffused layers |
| 03/25/2004 | US20040056367 Semiconductor device inlcluding optimized driver layout for integrated circuit with staggered bond pads |
| 03/25/2004 | US20040056366 A method of forming surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement |
| 03/25/2004 | US20040056365 Flip-chip image sensor packages and methods of fabrication |
| 03/25/2004 | US20040056364 Improving the packaging of chips in a thinner package, a die is attached to a leadframe, back side of the die is exposed |
| 03/25/2004 | US20040056363 Semiconductor device and a method of manufacturing the same |
| 03/25/2004 | US20040056362 Semiconductor device |
| 03/25/2004 | US20040056361 Multi-layered copper bond pad for an integrated circuit |
| 03/25/2004 | US20040056360 Memory device and method for forming a passivation layer thereon |
| 03/25/2004 | US20040056357 Circuit device and method of manufacturing the same |
| 03/25/2004 | US20040056356 Methods and apparatus for forming a film on a substrate |
| 03/25/2004 | US20040056355 Semiconductor device |
| 03/25/2004 | US20040056352 Semiconductor package and method for producing heat-radiating substrate for it |
| 03/25/2004 | US20040056351 Contact pads and a plurality of bump electrodes, a conductive line for interconnecting at least two of the contact pads; photoresist, masking, etching |
| 03/25/2004 | US20040056350 Electrical connection through nonmetal |
| 03/25/2004 | US20040056349 Circuit board |
| 03/25/2004 | US20040056348 Electronic apparatus |
| 03/25/2004 | US20040056347 Semiconductor chip module and method of manufacture of same |
| 03/25/2004 | US20040056346 Power module with improved transient thermal impedance |
| 03/25/2004 | US20040056344 Multi-chip circuit module and method for producing the same |
| 03/25/2004 | US20040056342 Stacked die module and techniques for forming a stacked die module |
| 03/25/2004 | US20040056341 Semiconductor device, semiconductor package member, and semiconductor device manufacturing method |
| 03/25/2004 | US20040056340 Semiconductor package and method of fabricating the same |
| 03/25/2004 | US20040056339 Semiconductor component with ESD protection |
| 03/25/2004 | US20040056338 Near chip size semiconductor package |
| 03/25/2004 | US20040056337 Semiconductor device |
| 03/25/2004 | US20040056336 Leads over chip semiconductor die assembly, forming a stress relief portion in multilayer lamination, by machining, etching, deforming, bonding with bond pads, increasing the space by the slots, flexibility |
| 03/25/2004 | US20040056335 Superconducting integrated circuit and method for fabrication thereof |
| 03/25/2004 | US20040056334 Method and apparatus for shielding an integrated circuit from radiation |
| 03/25/2004 | US20040056333 Electromagnetic traps in integrated circuit for minimizing cross-talk |
| 03/25/2004 | US20040056329 Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement |
| 03/25/2004 | US20040056325 Optically and electrically programmable silicided polysilicon fuse device |
| 03/25/2004 | US20040056323 Capacitance reduction by tunnel formation for use with a semiconductor device |
| 03/25/2004 | US20040056322 Reduced splattering of unpassivated laser fuses |
| 03/25/2004 | US20040056298 Hole grid array package and socket technology |
| 03/25/2004 | US20040056292 Electrode line structure having fine line width and method of forming the same |
| 03/25/2004 | US20040056280 Electrical and electronic apparatus having wires connected between different layers; electromigration resistance |
| 03/25/2004 | US20040056277 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages |
| 03/25/2004 | US20040056272 Silicon or gallium arsenide substrates having integrated circuits on the surfaces and thermoconductive underlayers containtg capacitors, coils or resistors; heat exchanging |
| 03/25/2004 | US20040056248 Test key for detecting electrical isolation between a word line and a deep trench capacitor in dram cells |
| 03/25/2004 | US20040056247 Bitline of semiconductor device having stud type capping layer and method for fabricating the same |
| 03/25/2004 | US20040056104 Electronic device and method of manufacturing the same |
| 03/25/2004 | US20040055785 Fat conductor |
| 03/25/2004 | US20040055783 Automotive electronic control unit |
| 03/25/2004 | US20040055770 EMI shield that adheres to and conforms with printed circuit board surfaces |
| 03/25/2004 | US20040055322 Field replaceable packard refrigeration module with vapor chamber heat sink for cooling electronic components |
| 03/25/2004 | US20040055155 System for providing an open-cavity low profile encapsulated semiconductor package |
| 03/25/2004 | DE19818452B4 Elektronische Schaltung mit einer in Gießharz eingebetteten Leiterplatte und Verfahren zu ihrer Herstellung An electronic circuit comprising an embedded in cast resin printed circuit board and process for its preparation |
| 03/25/2004 | DE19549563B4 Semiconductor chip electronic component with current input and output conductor |
| 03/25/2004 | DE10342028A1 Manufacture of integrated circuit involves doping portion of semiconductor substrate with nitrogen and charge carrier dopant source and forming thin dielectric on the doped portion of the substrate |
| 03/25/2004 | DE10314534A1 Manufacture of metal film for semiconductor device, comprises treating metal film with nitrogen plasma to form insulation film containing nitrogen |
| 03/25/2004 | DE10309261A1 Kondensator, gebildet in einer Mehrlagen-Verdrahtungsstruktur eines Halbleiterbauelements Capacitor formed in a multilayer wiring structure of a semiconductor device |
| 03/25/2004 | DE10303932A1 Electronic power module, comprises at least two semiconductor chips arranged in stack on substrate carrier, at least one chip being a silicon-carbide power semiconductor device |
| 03/25/2004 | DE10261457B3 Integrated circuit with transistor array of vertical FET selection transistors has array diagnosis test structure with two offset word, bit line combs alternately connecting different word, bit lines |
| 03/25/2004 | DE10249712B3 Circuit for monitoring power semiconducting components has each isolated contact surface/group connected via active and/or passive component(s) to star circuit(s) star point, external contact surface |
| 03/25/2004 | DE10246283B3 Production of an electronic component used in semiconductor sensors comprises preparing a semiconductor chip on a switching substrate, applying a sacrificial part on the sensor region of the chip and further processing |
| 03/25/2004 | DE10244266A1 Overcurrent and short-circuit protection method for power semiconductor device uses current probe comprising coil, connected to monitoring circuits which cause power semiconductor device to switch off when fault detected |
| 03/25/2004 | DE10242521A1 Diode used as a rectifier diode for rectifying a current fed to a vehicle generator has a head wire with a stepped wire connection with a region which forms a housing together with a sleeve, a base and a fixing region |