| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/30/2004 | US6714037 Methodology for an assessment of the degree of barrier permeability at via bottom during electromigration using dissimilar barrier thickness |
| 03/30/2004 | US6714033 Probe for direct wafer potential measurements |
| 03/30/2004 | US6714031 Semiconductor device for wafer examination |
| 03/30/2004 | US6714030 For measuring electrical characteristics during semiconductor manufacture processes such as probing inspection and burn-in inspection |
| 03/30/2004 | US6713937 Minitab rectifier for alternators |
| 03/30/2004 | US6713886 Semiconductor device |
| 03/30/2004 | US6713884 Method of forming an alignment mark structure using standard process steps for forming vertical gate transistors |
| 03/30/2004 | US6713883 Mask set for compensating a misalignment between patterns |
| 03/30/2004 | US6713879 Semiconductor substract with substantially matched lines |
| 03/30/2004 | US6713878 Electronic element with a shielding |
| 03/30/2004 | US6713874 Semiconductor devices with dual nature capping/arc layers on organic-doped silica glass inter-layer dielectrics |
| 03/30/2004 | US6713872 Multilayered semiconductor device |
| 03/30/2004 | US6713871 A simple current loop is created that improves the power delivery for the system |
| 03/30/2004 | US6713870 Wafer level chip-scale package |
| 03/30/2004 | US6713869 Wiring pattern of semiconductor device |
| 03/30/2004 | US6713868 Semiconductor device having leadless package structure |
| 03/30/2004 | US6713867 Package for microwave components |
| 03/30/2004 | US6713866 Cooling of optoelectronic elements |
| 03/30/2004 | US6713865 Semiconductor device having semiconductor element housed in packed with heat sink |
| 03/30/2004 | US6713864 Semiconductor package for enhancing heat dissipation |
| 03/30/2004 | US6713863 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion |
| 03/30/2004 | US6713859 Direct build-up layer on an encapsulated die package having a moisture barrier structure |
| 03/30/2004 | US6713858 Flip-chip package with optimized encapsulant adhesion and method |
| 03/30/2004 | US6713857 Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package |
| 03/30/2004 | US6713855 Dual die memory |
| 03/30/2004 | US6713853 Electronic package with offset reference plane cutout |
| 03/30/2004 | US6713852 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
| 03/30/2004 | US6713851 Lead over chip semiconductor device including a heat sink for heat dissipation |
| 03/30/2004 | US6713850 Tape carrier package structure with dummy pads and dummy leads for package reinforcement |
| 03/30/2004 | US6713849 Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin |
| 03/30/2004 | US6713844 Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means |
| 03/30/2004 | US6713843 Scribe lines for increasing wafer utilizable area |
| 03/30/2004 | US6713842 Mask for and method of forming a character on a substrate |
| 03/30/2004 | US6713839 Antifuse structure with low resistance |
| 03/30/2004 | US6713838 Inductive fuse for semiconductor device |
| 03/30/2004 | US6713837 Semiconductor device with fuse |
| 03/30/2004 | US6713836 Packaging structure integrating passive devices |
| 03/30/2004 | US6713823 Conductive routings in integrated circuits |
| 03/30/2004 | US6713822 Semiconductor device |
| 03/30/2004 | US6713820 Semiconductor device |
| 03/30/2004 | US6713817 Semiconductor integrated circuit system |
| 03/30/2004 | US6713808 Semiconductor capacitor with diffusion prevention layer |
| 03/30/2004 | US6713793 Field effect transistor structure with bent gate |
| 03/30/2004 | US6713755 Semiconductor device including a light-receiving element and an optical transfer device |
| 03/30/2004 | US6713686 Apparatus and method for repairing electronic packages |
| 03/30/2004 | US6713685 Non-circular micro-via |
| 03/30/2004 | US6713684 Hole grid array package and socket technology |
| 03/30/2004 | US6713677 Housing assembly for an electronic device and method of packaging an electronic device |
| 03/30/2004 | US6713676 System and method for converting a DC input voltage to a DC output voltage |
| 03/30/2004 | US6713589 Phenyl, naphthly or fluorene cyclopentyl epoxy resins |
| 03/30/2004 | US6713587 Such as cationic tetrabromobisphenol a-diethylene glycol-diethanolamine resin and curing agent; flame resistance protective layer; circuit board fabrication |
| 03/30/2004 | US6713581 Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it |
| 03/30/2004 | US6713571 Epoxy resin, a hardener and a hardening accelerator are melt mixed together followed by regulating viscosity at a given temperature |
| 03/30/2004 | US6713409 Semiconductor manufacturing using modular substrates |
| 03/30/2004 | US6713390 Barrier layer deposition using HDP-CVD |
| 03/30/2004 | US6713384 Contact integration method |
| 03/30/2004 | US6713383 Semiconductor device manufacturing method |
| 03/30/2004 | US6713381 Method of forming semiconductor device including interconnect barrier layers |
| 03/30/2004 | US6713375 Method of making an electronic product including package-based inductor coupled to integrated circuit |
| 03/30/2004 | US6713374 Interconnect assemblies and methods |
| 03/30/2004 | US6713372 Method for manufacturing synchronous DRAM device |
| 03/30/2004 | US6713369 Antifuse incorporating tantalum nitride barrier layer |
| 03/30/2004 | US6713357 Method to reduce parasitic capacitance of MOS transistors |
| 03/30/2004 | US6713344 Semiconductor device and method for manufacturing the same |
| 03/30/2004 | US6713337 Method for manufacturing a semiconductor device having self-aligned contacts |
| 03/30/2004 | US6713327 Stress controlled dielectric integrated circuit fabrication |
| 03/30/2004 | US6713322 Lead frame for semiconductor package |
| 03/30/2004 | US6713321 Super low profile package with high efficiency of heat dissipation |
| 03/30/2004 | US6713319 Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stress |
| 03/30/2004 | US6713317 Semiconductor device and laminated leadframe package |
| 03/30/2004 | US6713311 Method for screening semiconductor devices for contact coplanarity |
| 03/30/2004 | US6713177 Insulating and functionalizing fine metal-containing particles with conformal ultra-thin films |
| 03/30/2004 | US6713176 Processing and manufacturing methods enabled using non-stoichiometric nanomaterials |
| 03/30/2004 | US6712621 Thermally enhanced interposer and method |
| 03/30/2004 | US6712284 High frequency semiconductor device |
| 03/30/2004 | US6712258 Integrated quantum cold point coolers |
| 03/30/2004 | US6712130 CPU cooling structure |
| 03/30/2004 | US6712129 Heat dissipation device comprised of multiple heat sinks |
| 03/30/2004 | US6712128 Cylindrical fin tower heat sink and heat exchanger |
| 03/30/2004 | US6712127 Heatsink and heatsink device using the heatsink |
| 03/30/2004 | US6711904 Active thermal management of semiconductor devices |
| 03/30/2004 | US6711815 Fabricating method of semiconductor devices |
| 03/30/2004 | US6711813 Planarizing outer surface; isostatic pressingl; lamination; etching |
| 03/30/2004 | US6711812 Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages |
| 03/30/2004 | CA2207114C Semisolid thermal interface with low flow resistance |
| 03/25/2004 | WO2004025838A1 Coding of information in integrated circuits |
| 03/25/2004 | WO2004025737A1 Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system |
| 03/25/2004 | WO2004025734A1 Interconnection architecture and method of assessing interconnection architecture |
| 03/25/2004 | WO2004025729A2 Integrated circuit comprising intermediate materials and corresponding components |
| 03/25/2004 | WO2004025728A2 Improvements in or relating to cooling of electronic components |
| 03/25/2004 | WO2004025727A1 Method for sealing a microcavity and package comprising at least one microcavity |
| 03/25/2004 | WO2004025726A2 Method for selectively covering a micro machined surface |
| 03/25/2004 | WO2004025695A2 Semiconductor device with wire bond inductor and method |
| 03/25/2004 | WO2004025315A1 Method and system for integrated circuit information transfer |
| 03/25/2004 | WO2003092350A3 Material and method for improved heat dissipation and mechanical hardness for magnetic recording transducers and other electronic devices |
| 03/25/2004 | WO2003088354A3 Method for producing a copy protection for an electronic circuit and corresponding component |
| 03/25/2004 | WO2003083908A3 Packaging system for semiconductor devices |
| 03/25/2004 | WO2003081725B1 A miniaturized contact spring |
| 03/25/2004 | WO2003079410A3 Supporting control gate connection on a package using additional bumps |
| 03/25/2004 | WO2003073475B1 Heat sink for semiconductor die employing phase change cooling |