| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/01/2004 | US20040060920 Ceramic heater |
| 04/01/2004 | US20040060910 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
| 04/01/2004 | US20040060727 Glass terminal for high-speed optical communication |
| 04/01/2004 | US20040060724 Current-carrying electronic component and method of manufacturing same |
| 04/01/2004 | US20040060690 Combination tower and serpentine fin heat sink device |
| 04/01/2004 | US20040060689 Compact liquid cooled heat sink |
| 04/01/2004 | US20040060688 Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly |
| 04/01/2004 | US20040060645 Forming folded-stack packaged device using progressive folding tool |
| 04/01/2004 | US20040060617 Doping the liner with a passivating agent plasma (e.g., N2 or Cl2) to form a barrier prior to annealing to prevent diffusion of impurities such as silicon and fluorine |
| 04/01/2004 | US20040060313 Thermal management system for evaporative spray cooling |
| 04/01/2004 | US20040060309 Multi-load thermal regulating system with multiple serial evaporators |
| 04/01/2004 | US20040060174 Method for producing wiring substrate |
| 04/01/2004 | DE20317869U1 Cooling system for computer housing, comprises multi-layer heat sink body provided by profiled plate with cooling ribs and cooperating plate providing flow channels for external air |
| 04/01/2004 | DE10343217A1 Chipbinder Chip Binder |
| 04/01/2004 | DE10342312A1 Halbleiterwafertestsystem Semiconductor wafer testing system |
| 04/01/2004 | DE10336066A1 Wärmetransportvorrichtung mit Oszillationsströmungen im Gegenstrommodus Heat transport device with Oszillationsströmungen in countercurrent mode |
| 04/01/2004 | DE10333296A1 Vehicle-mounted electronic device e.g. heating-resistance type flow rate measuring device, has mounting portion provided at conductor wirings, whose shape is circular, elliptical or quadrangle |
| 04/01/2004 | DE10244446A1 Halbleiterchip oder Halbleiterchipstapel Semiconductor chip or semiconductor chip stack |
| 04/01/2004 | DE10243981A1 Elektronische Baueinheit, insbesondere Regler für Generatoren in Kraftfahrzeugen The electronic package, in particular regulator for generators in motor vehicles |
| 04/01/2004 | DE10243815A1 Semiconductor device with chip attached to heat-sink via solder layer, has collector terminal connected far from semiconductor chip so that it is not touched by solder layer |
| 04/01/2004 | DE10242325A1 Semiconductor used as a MOS switch has an insulating layer partially made from an elastic or plastically deformable insulating material |
| 04/01/2004 | DE10240897A1 Substrate with manufacturing process monitoring circuit, has measuring oscillator circuit for transmitting signal measured by electronic component for monitoring manufacture of chips on substrate |
| 04/01/2004 | DE10223203B4 Elektronisches Bauelement-Modul und Verfahren zu dessen Herstellung The electronic component module and method for its production |
| 03/31/2004 | EP1404169A2 An integrated circuit carrier socket |
| 03/31/2004 | EP1403926A2 Semiconductor device |
| 03/31/2004 | EP1403925A2 Dielectric material for electronic devices |
| 03/31/2004 | EP1403924A2 Fuse arrangement and semiconductor memory device |
| 03/31/2004 | EP1403923A1 Press pack power semiconductor module |
| 03/31/2004 | EP1403922A2 Combined member of aluminum-ceramics |
| 03/31/2004 | EP1403916A2 Production process for producing semiconductor devices, semiconductor devices produced thereby, and test system for carrying out yield-rate test in production of such semiconductor devices |
| 03/31/2004 | EP1403229A1 Aluminum/ceramic bonding substrate and method for producing same |
| 03/31/2004 | EP1403228A1 Ceramic component and production method therefor |
| 03/31/2004 | EP1402988A1 The use of a solder on surfaces coated with nickel by electroless plating |
| 03/31/2004 | EP1402763A2 Method and apparatus for non-destructive testing of leaded packages |
| 03/31/2004 | EP1402575A2 Vertically contacted stacked chips |
| 03/31/2004 | EP1402573A1 Method and structure for buried circuits and devices |
| 03/31/2004 | EP1402572A1 Method for producing miniature amplifier and signal processing unit |
| 03/31/2004 | EP1402568A2 Method and apparatus for controlling a plating process |
| 03/31/2004 | EP1401987A1 Thermoconductive composition |
| 03/31/2004 | EP1401981A2 Graphite-based thermal dissipation component |
| 03/31/2004 | EP1401641A1 Interface materials and methods of production and use thereof |
| 03/31/2004 | EP1314191B1 Composite structure for electronic microsystems and method for production of said composite structure |
| 03/31/2004 | EP1153985B1 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 03/31/2004 | CN2609189Y Surface mounted thick-film circuit |
| 03/31/2004 | CN2609187Y Liquid-vapour phase radiator |
| 03/31/2004 | CN2609186Y Radiator with heat-conducting pipe and copper sheet on base |
| 03/31/2004 | CN2609185Y Radiating fan structure of combined radiator |
| 03/31/2004 | CN2609184Y Radiating fin assembly structure |
| 03/31/2004 | CN2609183Y Double-efficiency radiating fin |
| 03/31/2004 | CN2609182Y Surface-mounted SMD base |
| 03/31/2004 | CN2609181Y Surface-mounted SMD base with external edge |
| 03/31/2004 | CN2609046Y Double-wing CPU radiator mechanism |
| 03/31/2004 | CN1486511A Apparatus and method for forming a battery in an integrated circuit |
| 03/31/2004 | CN1486510A Method for forming a flip chip on leadframe semiconductor package |
| 03/31/2004 | CN1486509A Method for forming a wafer level chip scale package, and package formed thereby |
| 03/31/2004 | CN1486508A High performance heat sink configurations for use in high density packaging applications |
| 03/31/2004 | CN1486507A Method and device for alignment |
| 03/31/2004 | CN1486506A Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip |
| 03/31/2004 | CN1486504A Chromium adhesion layer for copper vias in low-K technology |
| 03/31/2004 | CN1486079A Video camera module |
| 03/31/2004 | CN1485914A Window opening type multi-chip semiconductor package |
| 03/31/2004 | CN1485912A Structure and manufacturing method of upside-down mounting SOI chip capable of reducing static electricity discharge damage |
| 03/31/2004 | CN1485911A Static electricity protection method of analog signal input pin with common mode electrical level as its lowest electric potential |
| 03/31/2004 | CN1485910A Semiconductor devices |
| 03/31/2004 | CN1485908A Semiconductor device and manufacturing process thereof |
| 03/31/2004 | CN1485907A Structure and method without using silver glue and crystal grain metallic pad in process flow of conducting wire framework |
| 03/31/2004 | CN1485905A Heat transmission device and method for production thereof |
| 03/31/2004 | CN1485904A Electronic device having a heat dissipation member |
| 03/31/2004 | CN1485903A Adhesion manufacture method of heat sink and base plate and packaging members of heat sink |
| 03/31/2004 | CN1485902A Packaging structure and manufacturing method of flip chip |
| 03/31/2004 | CN1485893A Manufacturing method of packaging base plate and its structure |
| 03/31/2004 | CN1485865A Condenser and circuit board, method for producing the same |
| 03/31/2004 | CN1485370A Thermosetting resin composition, epoxy resin moulding material and semiconductor device |
| 03/31/2004 | CN1144299C Apparatus having electronic component located on the surface of package member with space therebetween |
| 03/31/2004 | CN1144298C Package structure with light emitting diode adhered on its surface and its manufacturing method |
| 03/31/2004 | CN1144290C Semiconductor device and method of manufacturing the same |
| 03/31/2004 | CN1144287C Integrated circuit assembly band and its producing method |
| 03/31/2004 | CN1144286C Semiconductor device and method for manufacturing same |
| 03/31/2004 | CN1144284C Semiconductor device and manufacture thereof |
| 03/31/2004 | CN1144279C Method for forming interconnection structure |
| 03/31/2004 | CN1144277C 载体和半导体器件 Carrier and semiconductor device |
| 03/31/2004 | CN1144276C Method for making resin packaging semiconductor device |
| 03/31/2004 | CN1144271C Method for manufacturing integrated circuit |
| 03/31/2004 | CN1144270C Method for manufacturing semiconductor device having multiple wiring layer |
| 03/31/2004 | CN1144266C Titanium silicide method using amorphous pre-injection of Ge or Sb and washing |
| 03/31/2004 | CN1144121C Method for producing radiator with high density radiation fins |
| 03/31/2004 | CN1144044C Method and apparatus for testing filtration efficiency of cloth material intended for use in clean room environment |
| 03/30/2004 | US6715133 Method for adding redundant vias on VLSI chips |
| 03/30/2004 | US6714625 Lithography device for semiconductor circuit pattern generation |
| 03/30/2004 | US6714431 Semiconductor package with a controlled impedance bus and method of forming same |
| 03/30/2004 | US6714422 High frequency module device and method for its preparation |
| 03/30/2004 | US6714421 Flip chip package substrate |
| 03/30/2004 | US6714420 Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
| 03/30/2004 | US6714416 Mechanisms and techniques for fastening a heat sink to a circuit board component |
| 03/30/2004 | US6714415 Split fin heat sink |
| 03/30/2004 | US6714414 Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces |
| 03/30/2004 | US6714413 Compact thermosiphon with enhanced condenser for electronics cooling |
| 03/30/2004 | US6714392 Electronic component and utilization of a guard structure contained therein |
| 03/30/2004 | US6714113 Inductor for integrated circuits |
| 03/30/2004 | US6714112 Silicon-based inductor with varying metal-to-metal conductor spacing |