Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/11/2014US8648461 Semiconductor device
02/11/2014US8648460 Thermal interface material with epoxidized nutshell oil
02/11/2014US8648459 Nitride based semiconductor package and method of manufacturing the same and bonding substrate
02/11/2014US8648458 Leadframe circuit and method therefor
02/11/2014US8648457 Wiring pattern for touch integrated circuit
02/11/2014US8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
02/11/2014US8648455 Semiconductor device and method of manufacturing the same
02/11/2014US8648454 Wafer-scale package structures with integrated antennas
02/11/2014US8648453 Semiconductor device and method for manufacturing the same
02/11/2014US8648452 Resin molded semiconductor device and manufacturing method thereof
02/11/2014US8648451 Semiconductor package, test socket and related methods
02/11/2014US8648450 Semiconductor device including leadframe with a combination of leads and lands
02/11/2014US8648449 Electrical connectivity for circuit applications
02/11/2014US8648448 Semiconductor device and method of shielding semiconductor die from inter-device interference
02/11/2014US8648446 Method for protecting a gate structure during contact formation
02/11/2014US8648438 Structure and method to form passive devices in ETSOI process flow
02/11/2014US8648423 Semiconductor devices including buried-channel-array transistors
02/11/2014US8648421 Electrostatic discharge (ESD) device and semiconductor structure
02/11/2014US8648420 Semiconductor device
02/11/2014US8648419 ESD protection device and method
02/11/2014US8648395 Integrated CMOS porous sensor
02/11/2014US8648359 Light emitting devices and methods
02/11/2014US8648341 Methods and apparatus for testing pads on wafers
02/11/2014US8648340 Semiconductor device for driving electric motor
02/11/2014US8648339 Semiconductor device including first semiconductor chip including first pads connected to first terminals, and second semiconductor chip including second pads connected to second terminals
02/11/2014US8648258 Mechanical cable entry port
02/11/2014US8647981 Methods of forming patterns, and methods of forming integrated circuitry
02/11/2014US8647979 Buffer layer to enhance photo and/or laser sintering
02/11/2014US8647977 Methods of forming interconnects
02/11/2014US8647974 Method of fabricating a semiconductor chip with supportive terminal pad
02/11/2014US8647955 Methods for forming electrostatic discharge protection clamps with increased current capabilities
02/11/2014US8647940 Semiconductor memory device including multi-layer gate structure
02/11/2014US8647920 Method for forming 3D-interconnect structures with airgaps
02/11/2014US8647892 Inline process control structures
02/11/2014CA2713153C Integrated circuit with mosfet fuse element
02/11/2014CA2581938C Integrated circuit and method for manufacturing
02/06/2014WO2014022780A1 Bva interposer
02/06/2014WO2014022675A1 Multiple die face-down stacking for two or more die
02/06/2014WO2014022527A1 Mems apparatus disposed on assembly lid
02/06/2014WO2014022485A1 Reconstituted wafer-level microelectronic package
02/06/2014WO2014022418A1 Incorporation of passives and fine pitch through via for package on package
02/06/2014WO2014022298A1 Passives via bar
02/06/2014WO2014022099A1 Complex passive design with special via implementation
02/06/2014WO2014021777A1 Semiconductor device and method for forming the same
02/06/2014WO2014021419A1 Curable resin composition
02/06/2014WO2014021187A1 Electronic component, method for producing same, and sealing material paste used in same
02/06/2014WO2014021079A1 Electronic component, and electronic component module
02/06/2014WO2014021077A1 Multilayer substrate and power module using multilayer substrate
02/06/2014WO2014021046A1 Electronic apparatus and heat conductive sheet
02/06/2014WO2014020975A1 Layered substrate
02/06/2014WO2014020808A1 Cooling structure and power converter
02/06/2014WO2014020807A1 Cooling structure and power converter
02/06/2014WO2014020806A1 Cooling structure and power converter
02/06/2014WO2014020787A1 Electronic component module and mounting body therefor
02/06/2014WO2014020783A1 Semiconductor device provided with radiating structure
02/06/2014WO2014020748A1 Heat dissipation plate
02/06/2014WO2014020704A1 Electric power semiconductor device
02/06/2014WO2014020470A1 Strengthened led package and method therefor
02/06/2014WO2014020034A1 Wiring device for wiring an electronic apparatus
02/06/2014WO2014019745A1 Power semiconductor clamping stack
02/06/2014WO2014019188A1 Polycarbosilane and curable compositions for led encapsulants comprising same
02/06/2014US20140038425 Methods of eliminating pattern collapse on photoresist patterns
02/06/2014US20140038405 Packaging Structures and Methods with a Metal Pillar
02/06/2014US20140038390 Through silicon via guard ring
02/06/2014US20140038363 Tsop with impedance control
02/06/2014US20140038362 Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
02/06/2014US20140038355 Flip-Chip Assembly Process for Connecting Two Components to Each Other
02/06/2014US20140037052 X-ray photoemission microscope for integrated devices
02/06/2014US20140036399 Device for protecting an integrated circuit against overvoltages
02/06/2014US20140035935 Passives via bar
02/06/2014US20140035892 Incorporation of passives and fine pitch through via for package on package
02/06/2014US20140035605 Shunt Resistor Integrated in a Connection Lug of a Semiconductor Module and Method for Determining a Current Flowing Through a Load Connection of a Semiconductor Module
02/06/2014US20140035171 Semiconductor device and display device having alignment mark
02/06/2014US20140035170 Semiconductor device and programming method
02/06/2014US20140035169 Top corner rounding of damascene wire for insulator crack suppression
02/06/2014US20140035168 Bonding pad for thermocompression bonding, process for producing a bonding pad and component
02/06/2014US20140035167 Method for producing a bonding pad for thermocompression bonding, and bonding pad
02/06/2014US20140035165 Pierced Substrate on Chip Module Structure
02/06/2014US20140035164 Semiconductor Device and Method of Fabricating the Same
02/06/2014US20140035163 Semiconductor Package with Interface Substrate Having Interposer
02/06/2014US20140035162 Interface Substrate with Interposer
02/06/2014US20140035161 Semiconductor device and method of manufacturing the same
02/06/2014US20140035160 Two-track cross-connect in double-patterned structure using rectangular via
02/06/2014US20140035159 Multilevel interconnect structures and methods of fabricating same
02/06/2014US20140035158 Integrated Semiconductor Device and Wafer Level Method of Fabricating the Same
02/06/2014US20140035157 Semiconductor package, manufacturing method thereof, and semiconductor package manufacturing mold
02/06/2014US20140035156 Method of fabricating a semiconductor package
02/06/2014US20140035155 Device with integrated power supply
02/06/2014US20140035154 Chip package and a method for manufacturing a chip package
02/06/2014US20140035153 Reconstituted wafer-level package dram
02/06/2014US20140035152 Methods for Cell Phasing and Placement in Dynamic Array Architecture and Implementation of the Same
02/06/2014US20140035151 Integrated circuits and methods for fabricating integrated circuits using double patterning processes
02/06/2014US20140035150 Metal cored solder decal structure and process
02/06/2014US20140035149 Method of patterning a semiconductor device having improved spacing and shape control and a semiconductor device
02/06/2014US20140035148 Bump on Pad (BOP) Bonding structure
02/06/2014US20140035147 Semiconductor device and method for fabricating the same
02/06/2014US20140035146 Metal wiring of semiconductor device and method for manufacturing the same
02/06/2014US20140035145 Semiconductor device
02/06/2014US20140035144 Semiconductor Devices Having Through Electrodes and Methods of Fabricating the Same
02/06/2014US20140035143 Method of reducing contact resistance of a metal
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