| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/01/2004 | WO2002061836A9 High voltage semiconductor device |
| 04/01/2004 | WO1998028794A8 Direct contact die attach |
| 04/01/2004 | US20040064772 Analysis module, integrated circuit, system and method for testing an integrated circuit |
| 04/01/2004 | US20040063895 Poly-o-hydroxyamide, polybenzoxazole, and electronic component including a dielectric having a barrier effect against copper diffusion, and processes for preparing poly-o-hydroxyamides, polybenzoxazoles, and electronic components |
| 04/01/2004 | US20040063343 Processor and heat sink actuation system |
| 04/01/2004 | US20040063340 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 04/01/2004 | US20040063337 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus |
| 04/01/2004 | US20040063332 COF semiconductor device and a manufacturing method for the same |
| 04/01/2004 | US20040063310 Interconnects with improved barrier layer adhesion |
| 04/01/2004 | US20040063307 Method to avoid copper contamination of a via or dual damascene structure |
| 04/01/2004 | US20040063306 Fabrication method of semiconductor device |
| 04/01/2004 | US20040063305 Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material |
| 04/01/2004 | US20040063295 One-mask process flow for simultaneously constructing a capacitor and a thin film resistor |
| 04/01/2004 | US20040063292 Method for manufacturing semiconductor device |
| 04/01/2004 | US20040063272 Semiconductor devices and methods of making the devices |
| 04/01/2004 | US20040063271 Synchronous semiconductor device and method of preventing coupling between data buses |
| 04/01/2004 | US20040063268 Manufacturing method of semiconductor device |
| 04/01/2004 | US20040063259 Method for manufacturing semiconductor device |
| 04/01/2004 | US20040063252 Method of making semiconductor device |
| 04/01/2004 | US20040063249 Thin film semiconductor package and method of fabrication |
| 04/01/2004 | US20040063247 Semiconductor device and method for manufacturing the same |
| 04/01/2004 | US20040063246 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |
| 04/01/2004 | US20040063245 Method of fabricating an electronic component |
| 04/01/2004 | US20040063244 Leadframe-to-plastic lock for IC package |
| 04/01/2004 | US20040063243 Method of manufacturing an electronic device |
| 04/01/2004 | US20040063242 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages |
| 04/01/2004 | US20040063240 Semiconductor die package including drain clip |
| 04/01/2004 | US20040063227 Specifying method for Cu contamination processes and detecting method for Cu contamination during reclamation of silicon wafers, and reclamation method of silicon wafers |
| 04/01/2004 | US20040063225 Measurement of lateral diffusion of diffused layers |
| 04/01/2004 | US20040063039 Method for inductor trimming of the high frequency integrated passive devices |
| 04/01/2004 | US20040062491 Optical data link |
| 04/01/2004 | US20040062094 Three-dimensional memory |
| 04/01/2004 | US20040062016 Medium having data storage and communication capabilites and method for forming same |
| 04/01/2004 | US20040062011 Semiconductor integrated circuit |
| 04/01/2004 | US20040062009 Combined member of aluminum-ceramics |
| 04/01/2004 | US20040062008 Heat sink clip with interchangeable operating body |
| 04/01/2004 | US20040062007 Heat sink and retaining clip assembly |
| 04/01/2004 | US20040062006 Laminated bus bar for use with a power conversion configuration |
| 04/01/2004 | US20040062005 Compact liquid converter assembly |
| 04/01/2004 | US20040062004 Bus bar assembly for use with a compact power conversion assembly |
| 04/01/2004 | US20040061857 Periodic patterns and technique to control misalignment between two layers |
| 04/01/2004 | US20040061799 Image pickup device and portable terminal equipped therewith |
| 04/01/2004 | US20040061613 Electronic device and method of manufacture the same |
| 04/01/2004 | US20040061492 Package with environmental control material carrier |
| 04/01/2004 | US20040061244 Semiconductor device |
| 04/01/2004 | US20040061243 Window-type semiconductor package and fabrication method thereof |
| 04/01/2004 | US20040061242 Semiconductor device power interconnect striping |
| 04/01/2004 | US20040061241 Semiconductor device power interconnect striping |
| 04/01/2004 | US20040061240 Semiconductor device and fabrication process thereof |
| 04/01/2004 | US20040061239 Window-type ball grid array semiconductor package |
| 04/01/2004 | US20040061238 Semiconductor device and method of manufacturing the same |
| 04/01/2004 | US20040061236 Semiconductor device provided with a dielectric film including porous structure and manufacturing method thereof |
| 04/01/2004 | US20040061235 Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors |
| 04/01/2004 | US20040061233 Semiconductor device including interconnects formed by damascene process and manufacturing method thereof |
| 04/01/2004 | US20040061231 Interconnect structure for an integrated circuit and method of fabrication |
| 04/01/2004 | US20040061230 Method of forming an air gap using etch back of inter layer dielectric (ILD) with self-alignment to metal pattern |
| 04/01/2004 | US20040061229 Ultra high-speed chip semiconductor integrated circuit interconnect structure and fabrication method using free-space dielectrics |
| 04/01/2004 | US20040061226 Semiconductor device and contact-forming method therefor |
| 04/01/2004 | US20040061225 Semiconductor integrated circuit device and method of producing the same |
| 04/01/2004 | US20040061224 Spherical semiconductor device and method for fabricating the same |
| 04/01/2004 | US20040061223 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 04/01/2004 | US20040061222 Window-type ball grid array semiconductor package |
| 04/01/2004 | US20040061220 Semiconductor device and manufacturing method thereof |
| 04/01/2004 | US20040061219 Semiconductor device |
| 04/01/2004 | US20040061218 Integrated circuit heat dissipation system |
| 04/01/2004 | US20040061217 Thin and heat radiant semiconductor package and method for manufacturing |
| 04/01/2004 | US20040061216 Integrated circuit carrier socket |
| 04/01/2004 | US20040061215 Semiconductor package having multi-signal bus bars |
| 04/01/2004 | US20040061214 Packaged RF power transistor having RF bypassing/output matching network |
| 04/01/2004 | US20040061213 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
| 04/01/2004 | US20040061212 Semiconductor multi-package module having wire bond interconnect between stacked packages |
| 04/01/2004 | US20040061211 Semiconductor package |
| 04/01/2004 | US20040061209 Strengthened window-type semiconductor package |
| 04/01/2004 | US20040061208 Semiconductor package assembly and method for electrically isolating modules |
| 04/01/2004 | US20040061206 Discrete package having insulated ceramic heat sink |
| 04/01/2004 | US20040061205 Moisture resistant integrated circuit leadframe package |
| 04/01/2004 | US20040061204 Integrated circuit leadframe with ground plane |
| 04/01/2004 | US20040061203 Semiconductor device |
| 04/01/2004 | US20040061202 Leadframe for die stacking applications and related die stacking concepts |
| 04/01/2004 | US20040061201 Low-dielectric constant structure with a multilayer stack of thin films with pores |
| 04/01/2004 | US20040061200 Semiconductor wafer and manufacturing method thereof |
| 04/01/2004 | US20040061197 Method and apparatus to fabricate an on-chip decoupling capacitor |
| 04/01/2004 | US20040061189 Semiconductor device and method of forming the same |
| 04/01/2004 | US20040061186 Conductive channel pseudo block process and circuit to inhibit reverse engineering |
| 04/01/2004 | US20040061184 Nickel silicide - silicon nitride adhesion through surface passivation |
| 04/01/2004 | US20040061183 Multiple chip guard rings for integrated circuit and chip guard ring interconnect |
| 04/01/2004 | US20040061177 Capacitor structure and fabrication method therefor in a dual damascene process |
| 04/01/2004 | US20040061163 Semiconductor equipment |
| 04/01/2004 | US20040061162 Titanium nitride; bit line stack and a storage node contact hole which are aligned at bit line spacers |
| 04/01/2004 | US20040061160 Semiconductor device including storage capacitor |
| 04/01/2004 | US20040061145 Method for forming a bit line for a semiconductor device |
| 04/01/2004 | US20040061140 Semiconductor integrated circuit having reduced cross-talk noise |
| 04/01/2004 | US20040061138 Power semiconductor device with high radiating efficiency |
| 04/01/2004 | US20040061133 Semiconductor device including bipolar junction transistor, and production method therefor |
| 04/01/2004 | US20040061127 Includes via formed by dispensing adhesive layer in pattern that enables release of trapped vapor after attachment of heat spreader |
| 04/01/2004 | US20040061112 Test structure for determining a short circuit between trench capacitors in a memory cell array |
| 04/01/2004 | US20040061111 Capacitors of memory cell array being arranged in matrix form each having trench with interior capacitor electrode isolated by dielectric layer; trench capacitors connected and lengthened to overlap in transverse direction |
| 04/01/2004 | US20040061110 Test structure for determining a doping region of an electrode connection between a trench capacitor and a selection transistor in a memory cell array |
| 04/01/2004 | US20040061105 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| 04/01/2004 | US20040060970 Under bump metallurgy for Lead-Tin bump over copper pad |