| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/06/2004 | US6717279 Semiconductor device with recessed portion in the molding resin |
| 04/06/2004 | US6717278 Semiconductor device having a resist edge positioned over througholes |
| 04/06/2004 | US6717277 Electrical assembly with vertical multiple layer structure |
| 04/06/2004 | US6717276 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly |
| 04/06/2004 | US6717275 Semiconductor module |
| 04/06/2004 | US6717274 Semiconductor device having a warp preventing sheet |
| 04/06/2004 | US6717272 Reinforced bond-pad substructure and method for fabricating the same |
| 04/06/2004 | US6717270 Integrated circuit die I/O cells |
| 04/06/2004 | US6717269 Integrated circuit device having sidewall spacers along conductors |
| 04/06/2004 | US6717268 Electromigration-reliability improvement of dual damascene interconnects |
| 04/06/2004 | US6717267 Conductive dummy interconnections and conductive dummy plugs |
| 04/06/2004 | US6717266 Use of an alloying element to form a stable oxide layer on the surface of metal features |
| 04/06/2004 | US6717264 High density integrated circuit package |
| 04/06/2004 | US6717263 Semiconductor device having contact opening smaller than test probe, and manufacturing process and inspecting method thereof |
| 04/06/2004 | US6717262 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times |
| 04/06/2004 | US6717261 Integrated semiconductor circuit |
| 04/06/2004 | US6717260 Clip-type lead frame for source mounted die |
| 04/06/2004 | US6717259 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
| 04/06/2004 | US6717257 Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
| 04/06/2004 | US6717256 Mounting structure for semiconductor device having entirely flat leads |
| 04/06/2004 | US6717255 Chip carrier for a high-frequency electronic package |
| 04/06/2004 | US6717254 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture |
| 04/06/2004 | US6717253 Assembly package with stacked dies and signal transmission plate |
| 04/06/2004 | US6717252 Semiconductor device |
| 04/06/2004 | US6717250 Stacked semiconductor apparatus and electronic device including stacked semiconductor apparatus |
| 04/06/2004 | US6717248 Semiconductor package and method for fabricating the same |
| 04/06/2004 | US6717247 Tool and method for welding to IC frames |
| 04/06/2004 | US6717246 Semiconductor package with integrated conical vapor chamber |
| 04/06/2004 | US6717244 Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips |
| 04/06/2004 | US6717243 Semiconductor device and the manufacturing method thereof |
| 04/06/2004 | US6717242 Semiconductor device and process for fabrication thereof |
| 04/06/2004 | US6717241 Magnetic shielding for integrated circuits |
| 04/06/2004 | US6717240 Fabrication method and wafer structure of semiconductor device using low-k film |
| 04/06/2004 | US6717238 Low-capacitance bonding pad for semiconductor device |
| 04/06/2004 | US6717232 Etched oxide layer forming interconnect metallization trench within the oxide layer, after etching via, second inductor trench, interconnect metallization trench and first inductor trench are filled with copper |
| 04/06/2004 | US6717225 Integrated thermal difference sensor for power dissipating device |
| 04/06/2004 | US6717219 High holding voltage ESD protection structure for BiCMOS technology |
| 04/06/2004 | US6717209 Semiconductor device having junction diode and fabricating method therefor |
| 04/06/2004 | US6717191 Aluminum-beryllium alloys for air bridges |
| 04/06/2004 | US6717071 Coaxial via hole and process of fabricating the same |
| 04/06/2004 | US6717069 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 04/06/2004 | US6717066 Electronic packages having multiple-zone interconnects and methods of manufacture |
| 04/06/2004 | US6717064 Substrate piece and flexible substrate |
| 04/06/2004 | US6717061 Stacking of multilayer modules |
| 04/06/2004 | US6717060 Circuit board consisting of at least two individual circuit board layers made of plastic |
| 04/06/2004 | US6716770 Vapor deposition using organosilicon compound and fluorohydrocarbon plasma; dielectric |
| 04/06/2004 | US6716754 Methods of forming patterns and molds for semiconductor constructions |
| 04/06/2004 | US6716749 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 04/06/2004 | US6716744 Ultra thin tungsten metal films used as adhesion promoter between barrier metals and copper |
| 04/06/2004 | US6716743 Method of manufacturing a semiconductor device |
| 04/06/2004 | US6716742 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics |
| 04/06/2004 | US6716738 Method of fabricating multilayered UBM for flip chip interconnections by electroplating |
| 04/06/2004 | US6716737 Method of forming a through-substrate interconnect |
| 04/06/2004 | US6716735 Method for forming metal lines of semiconductor device |
| 04/06/2004 | US6716731 Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrate |
| 04/06/2004 | US6716693 Method of forming a surface coating layer within an opening within a body by atomic layer deposition |
| 04/06/2004 | US6716679 Methods of forming fuse box guard rings for integrated circuit devices |
| 04/06/2004 | US6716678 Method for producing an antifuse and antifuse for the selective electrical connection of adjacent conductive regions |
| 04/06/2004 | US6716677 Microwave monolithic integrated circuit package |
| 04/06/2004 | US6716676 Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same |
| 04/06/2004 | US6716675 Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame |
| 04/06/2004 | US6716674 Method of forming a semiconductor package |
| 04/06/2004 | US6716670 Method of forming a three-dimensional stacked semiconductor package device |
| 04/06/2004 | US6716668 Method for forming semiconductor device |
| 04/06/2004 | US6716667 Semiconductor device manufacturing method, making negative pressure for fixing a chip on a substrate |
| 04/06/2004 | US6716666 Wafer scale molding of protective caps |
| 04/06/2004 | US6716660 Method for fabricating a wiring line assembly for a thin film transistor array panel substrate |
| 04/06/2004 | US6716653 Mask alignment structure for IC layers |
| 04/06/2004 | US6716530 Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulation layer using the resin compound, and copper-clad laminate using them |
| 04/06/2004 | US6716529 Tape automated bonding (tab); adhesive strength, moderate elastic modulus and coefficient of expansion; adhesive layer of a thermoplastic resin and a polyepoxide having skeleton containing one of dicyclopentadiene, terpene, or biphenyl |
| 04/06/2004 | US6716037 Flexible electric-contact structure for IC package |
| 04/06/2004 | US6715663 Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method |
| 04/06/2004 | US6715660 Recognition device, bonding device, and method of manufacturing a circuit device |
| 04/06/2004 | US6715659 Apparatus for clamping semiconductor devices using sliding finger supports |
| 04/06/2004 | US6715286 Radiation apparatus |
| 04/06/2004 | US6715204 Printed wiring board and method for producing the same |
| 04/06/2004 | US6715203 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 04/01/2004 | WO2004027867A1 Method of manufacturing a wafer assembly |
| 04/01/2004 | WO2004027866A2 Method for creating a link in an integrated metal substrate |
| 04/01/2004 | WO2004027865A2 Support structures for wirebond regions of contact pads over low modulus materials |
| 04/01/2004 | WO2004027864A1 Diode |
| 04/01/2004 | WO2004027863A2 Hybrid card |
| 04/01/2004 | WO2004027855A1 Measurement of lateral diffusion of diffused layers |
| 04/01/2004 | WO2004027824A2 Nitride and polysilicon interface with titanium layer |
| 04/01/2004 | WO2004027823A2 Semiconductor multi-package module having wire bond interconnection between stacked packages |
| 04/01/2004 | WO2004027801A2 Reduced splattering of unpassivated laser fuses |
| 04/01/2004 | WO2004027590A1 The clasp mean of heat elimination die groups |
| 04/01/2004 | WO2004027439A1 Measurement of lateral diffusion of diffused layers. |
| 04/01/2004 | WO2004026526A1 Bonding material and bonding method |
| 04/01/2004 | WO2004008497A3 Thermal interconnect and interface systems, methods of production and uses thereof |
| 04/01/2004 | WO2004005566A3 Method for making a composite product and in particular a heat sink |
| 04/01/2004 | WO2004003991A3 Electronic component with a housing packaging |
| 04/01/2004 | WO2003102510A3 Prevention of tampering in electronic devices |
| 04/01/2004 | WO2003096389A3 Metal object to be at least partially coated with a substance |
| 04/01/2004 | WO2003094202A3 Micro circuits with a sculpted ground plane |
| 04/01/2004 | WO2003092067A3 Integrated circuit layout modification |
| 04/01/2004 | WO2003087590A3 Method of self-assembly and self-assembled structures |
| 04/01/2004 | WO2003063241A3 Method and apparatus for high heat flux heat transfer |
| 04/01/2004 | WO2003034490A3 Semiconductor structure with one or more through-holes |
| 04/01/2004 | WO2002067326A9 Integrated circuit die having an electromagnetic interference shield |