| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/08/2004 | US20040065907 Narrow wire; reducing contactor defects ; using automatic layout tools |
| 04/08/2004 | US20040065905 Semiconductor package and method for manufacturing the same |
| 04/08/2004 | US20040065899 Semiconductor device |
| 04/08/2004 | US20040065892 Methods and devices related to electrode pads for p-type group III nitride compound semiconductors |
| 04/08/2004 | US20040065879 Process via mismatch detecting device |
| 04/08/2004 | US20040065720 Apparatus and method to prevent oxidation of electronic devices |
| 04/08/2004 | US20040065719 Bondhead lead clamp apparatus and method |
| 04/08/2004 | US20040065647 Die bonder |
| 04/08/2004 | US20040065554 Multilayer three-dimensional structure; barrier layer prevent damage due to copper diffusion |
| 04/08/2004 | US20040065473 Warpage preventing substrate |
| 04/08/2004 | US20040065462 High frequency module |
| 04/08/2004 | US20040065432 High performance thermal stack for electrical components |
| 04/08/2004 | US20040065410 Method and apparatus for dispensing interface materials |
| 04/08/2004 | US20040064941 Sockets for "springed" semiconductor device |
| 04/08/2004 | US20040064924 Easily removed heatsink clip |
| 04/08/2004 | DE19640256B4 Anschlußrahmen, Verfahren zur Edelmetallplattierung des Anschlußrahmens und Halbleitereinrichtung mit Anschlußrahmen Lead frame, process for noble metal plating of the lead frame and semiconductor device lead frame |
| 04/08/2004 | DE19625240B4 Halbleitervorrichtung Semiconductor device |
| 04/08/2004 | DE10340069A1 Surface mountable opto-electronic device e.g. LED for backlighting, has body with surface having recesses to mount device, where electrical contacts are provided on surface including portions formed on inner surface of recesses |
| 04/08/2004 | DE10338087A1 Production of an electronic switching arrangement for vehicles, comprises applying a switching structure to a base, connecting wires to the base, electrically connecting the wires with the switching structure, and further processing |
| 04/08/2004 | DE10312009B3 Semiconductor circuit especially a field effect transistor with an integrated circuit especially for motor vehicles, has two temperature sensors with different switching temperatures |
| 04/08/2004 | DE10250919A1 Arrangement with integrated circuits with blocking capacitors and circuit boards has blocking capacitor(s) physically arranged between connection pins of housing and electrically connected to them |
| 04/08/2004 | DE10245534A1 Teststruktur zum Bestimmen eines Bereiches einer Deep-Trench-Ausdiffusion in einem Speicherzellenfeld Test structure for determining a region of a deep trench outdiffusion in a memory cell array |
| 04/08/2004 | DE10245533A1 Teststruktur zum Bestimmen eines Dotierbereiches eines Elektrodenanschlusses zwischen einem Grabenkondensator und einem Auswahltransistor in einem Speicherzellenfeld Test structure for determining a doping region of the electrode terminal between a grave capacitor and a select transistor in a memory cell array |
| 04/08/2004 | DE10245152A1 Integrierte Testschaltungsanordnung und Testverfahren Integrated test circuitry and test methods |
| 04/08/2004 | DE10244805A1 Open-pored heat sink cast, sintered or foamed from a heat-conductive material for a heat exchanger maintains contact with an object to be cooled |
| 04/08/2004 | DE10239866B3 Production of a semiconductor component used in circuit boards comprises forming electrical contact surfaces together within a smaller contacting region as the whole surface of the front side of the chip and further processing |
| 04/08/2004 | DE10102000B4 Integrierte Schaltung mit Erkennungsschaltung und Verfahren zum Überprüfen einer Anschlusssituation eines Bondpads Integrated circuit detection circuit and method for checking a connection situation of a bond pad |
| 04/07/2004 | EP1406306A2 Semiconductor device including bipolar junction transistor, and production method therefor |
| 04/07/2004 | EP1406303A1 Power module and air conditioner |
| 04/07/2004 | EP1406301A2 Adaptation of an integrated circuit to specific requirements |
| 04/07/2004 | EP1406300A1 Lead frame and its manufacturing method |
| 04/07/2004 | EP1406299A1 Plastic molded semiconductor device and method of manufacturing the same |
| 04/07/2004 | EP1406298A1 Semiconductor module and plate-shaped lead |
| 04/07/2004 | EP1406297A2 Microstructure cooling device and use thereof |
| 04/07/2004 | EP1406188A2 Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, charge pump circuit, layout designing apparatus, and layout designing program |
| 04/07/2004 | EP1406148A2 Highly flexible cooling air guide |
| 04/07/2004 | EP1406147A1 Computer heat dissipating structure |
| 04/07/2004 | EP1405343A2 Multichip module fabricated on a semiconductor or dieletric wafer and method for manufacturing same |
| 04/07/2004 | EP1405342A2 Semiconductor device interconnect |
| 04/07/2004 | EP1405339A1 Locally increasing sidewall density by ion implantation |
| 04/07/2004 | EP1405337A2 Structural reinforcement of highly porous low k dielectric films by ild posts |
| 04/07/2004 | EP1405336A2 Substrate processing method |
| 04/07/2004 | EP1405320A1 Conductive structure with improved alternating current characteristics |
| 04/07/2004 | EP1405258A1 Lead frame antenna |
| 04/07/2004 | EP1405186A1 Device for and method of storing identification data in an integrated circuit |
| 04/07/2004 | EP1404888A1 Metal-ceramic composite material |
| 04/07/2004 | EP1404883A2 Thermal interface material and heat sink configuration |
| 04/07/2004 | EP1249025B1 Coil and coil system to be integrated in a microelectronic circuit, and a microelectronic circuit |
| 04/07/2004 | CN2610555Y Three-phase integrated rectifier |
| 04/07/2004 | CN2610495Y Open-circuit device for integrated circuit safety unit |
| 04/07/2004 | CN2610494Y Water cooling conductive copper line |
| 04/07/2004 | CN2610493Y Cooling device |
| 04/07/2004 | CN2610492Y Airflow type cooling device |
| 04/07/2004 | CN2610491Y Circulation cooling device |
| 04/07/2004 | CN2610389Y Improved structure of computer heat sink |
| 04/07/2004 | CN1488182A Mounting of optical device on heat sink. |
| 04/07/2004 | CN1488171A Semiconductor component comprising ESD protection |
| 04/07/2004 | CN1488170A Planarizers for spin etch planarization of electronic components and methods of use thereof |
| 04/07/2004 | CN1488169A Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer |
| 04/07/2004 | CN1488168A Self-aligned conductive line for cross-point magnetic memory integrated circuits |
| 04/07/2004 | CN1488167A Viscous protective overlayers for planarization of integrated circuits |
| 04/07/2004 | CN1487963A Epoxy resin composition for semiconductor encapsulation |
| 04/07/2004 | CN1487782A Semiconductor device and semiconductor assemblies |
| 04/07/2004 | CN1487629A Terminal with ruthenium layer and component with the same terminal |
| 04/07/2004 | CN1487596A Semiconductor device and producing method thereof |
| 04/07/2004 | CN1487586A Semiconductor apparatus and processing system utilizing the same semiconductor apparatus |
| 04/07/2004 | CN1487585A Semiconductor device and producing method thereof |
| 04/07/2004 | CN1487584A Great power device and its heat sink pressure-mounting method |
| 04/07/2004 | CN1487583A Semiconductor package and producing method thereof and semiconductor device |
| 04/07/2004 | CN1487582A Semiconductor packaging element and method for packaging semiconductor |
| 04/07/2004 | CN1487581A 半导体器件 Semiconductor devices |
| 04/07/2004 | CN1487580A Semiconductor device and producing method thereof |
| 04/07/2004 | CN1487579A Microelectronic technology and structure |
| 04/07/2004 | CN1487575A Electronic parts bonding method and electronic parts bonding apparatus |
| 04/07/2004 | CN1487387A Electronic instrument installed with liquid-cooling cooling apparatus for cooling heating parts |
| 04/07/2004 | CN1487362A Impression mask photoetching |
| 04/07/2004 | CN1145409C Heat sink |
| 04/07/2004 | CN1145216C High density electric connector |
| 04/07/2004 | CN1145211C Polycrystal chip semiconductor package structure |
| 04/07/2004 | CN1145207C Method for producing semiconductor integrated circuit card and semiconductor integrated circuit card |
| 04/07/2004 | CN1145206C Film carrier tape, semiconductor assembly, semiconductor device and producing method thereof, mounting base plate |
| 04/07/2004 | CN1145205C Array type multi-chip device and its producing method |
| 04/07/2004 | CN1144837C Hydrotalcite compound, and preparation process thereof, and use as additive and filler |
| 04/07/2004 | CN1144831C Electronic circuit device comprising epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 04/07/2004 | CN1144670C Copper foil for TAB band carrier and TAB carrier band using copper foil, and TAB band carrier |
| 04/06/2004 | US6718163 Methods of operating microelectronic devices, and methods of providing microelectronic devices |
| 04/06/2004 | US6717822 Lead-frame method and circuit module assembly including edge stiffener |
| 04/06/2004 | US6717819 Solderable flexible adhesive interposer as for an electronic package, and method for making same |
| 04/06/2004 | US6717815 Heat dissipation module and its fixed member |
| 04/06/2004 | US6717814 Heat dissipation assembly |
| 04/06/2004 | US6717813 Heat dissipation unit with direct contact heat pipe |
| 04/06/2004 | US6717812 Apparatus and method for fluid-based cooling of heat-generating devices |
| 04/06/2004 | US6717811 Heat dissipating apparatus for interface cards |
| 04/06/2004 | US6717806 Component alignment and retention mechanism |
| 04/06/2004 | US6717799 Low profile EMI shield with heat spreading plate |
| 04/06/2004 | US6717793 Surface mount type condenser |
| 04/06/2004 | US6717631 Array substrate for use in LCD device |
| 04/06/2004 | US6717530 Multiple temperature threshold sensing having a single sense element |
| 04/06/2004 | US6717503 Coil and coil system for integration into a micro-electronic circuit and microelectronic circuit |
| 04/06/2004 | US6717492 Planar dielectric integrated circuit with line conversion conductor patterns |