| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/13/2004 | US6720205 Electronic device and method of manufacturing the same, and electronic instrument |
| 04/13/2004 | US6720204 Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding |
| 04/13/2004 | US6720083 Adhesive and semiconductor devices |
| 04/13/2004 | US6720031 Preparing substrate placing substrate into chemical vapor deposition chamber; heating; introducing water flow in a carrier gas; stopping water flow; starting flow of copper precursor |
| 04/13/2004 | US6719919 Composition of matter |
| 04/13/2004 | US6719550 System to supply semiconductor devices and lead frames relative to application means and attaching means |
| 04/13/2004 | US6719205 Carrier element for a semiconductor chip for incorporation into smart cards |
| 04/13/2004 | US6719040 Cooling apparatus boiling and condensing refrigerant with improved tunnel structure |
| 04/13/2004 | US6719039 Liquid cooled heat exchanger with enhanced flow |
| 04/13/2004 | US6719038 Heat removal system |
| 04/08/2004 | WO2004030428A1 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 04/08/2004 | WO2004030097A1 A conductive channel pseudo block process and circuit to inhibit reverse engineering |
| 04/08/2004 | WO2004030096A2 Crack resistant interconnect module |
| 04/08/2004 | WO2004030095A1 Method of machining terminal board |
| 04/08/2004 | WO2004030094A1 Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same |
| 04/08/2004 | WO2004030093A1 Press pack power semiconductor module |
| 04/08/2004 | WO2004030092A1 Semiconductor chip on which conductor tracks on a (1,0,0) crystal plane form an angle of at least ten degrees with the (0,1,0) and (0,0,1) crystal planes in order to increase the fracture resistance |
| 04/08/2004 | WO2004030089A1 Method of forming a copper interconnect with concentrated alloy atoms at copper-passivation interface |
| 04/08/2004 | WO2004030088A1 Method for forming metal-metal oxide etch stop/electromigration barrier for integrated circuit interconnects and device |
| 04/08/2004 | WO2004030075A1 Method for manufacturing semiconductor device |
| 04/08/2004 | WO2004030057A1 Glass-type planar substrate, use thereof, and method for the production thereof |
| 04/08/2004 | WO2004030040A2 Method and apparatus for shielding an integrated circuit from radiation |
| 04/08/2004 | WO2004030039A2 Apparatus and method of using thin film material as diffusion barrier for metallization |
| 04/08/2004 | WO2004030030A2 Taped lead frames and methods of making and using the same in semiconductor packaging |
| 04/08/2004 | WO2004028748A2 Clamping assembly for high-voltage solid state devices |
| 04/08/2004 | WO2004012485A3 Mounting surfaces for electronic devices |
| 04/08/2004 | WO2004012262A3 Method for accommodating small minimum die in wire bonded area array packages |
| 04/08/2004 | WO2004012226A3 Method for making an anisotropic conductive polymer film on a semiconductor wafer |
| 04/08/2004 | WO2003103042A3 Electronic component comprising external surface contacts and a method for producing the same |
| 04/08/2004 | WO2003100857A3 Active shield of an integrated circuit |
| 04/08/2004 | WO2003085738A3 Power module comprising two substrates and method for producing the same |
| 04/08/2004 | WO2003082732A3 Packaging microelectromechanical systems |
| 04/08/2004 | WO2003077314A3 Csp-type hyperfrequency circuit |
| 04/08/2004 | WO2003067647A3 Method and device for protecting electronic, optoelectronic and/or electromechanical microcomponents |
| 04/08/2004 | WO2003065450A3 Integrated circuits with backside contacts and methods for their fabrication |
| 04/08/2004 | WO2002101829A8 Method for forming a wafer level chip scale package, and package formed thereby |
| 04/08/2004 | WO2002097868A3 Integrated circuit having an energy-absorbing structure |
| 04/08/2004 | WO2002050907B1 Interconnection of active and passive components in substrate |
| 04/08/2004 | US20040068703 Method of manufacturing circuit device |
| 04/08/2004 | US20040068084 Azaoxa heterocyclic compound and method of preparing the same |
| 04/08/2004 | US20040067638 Electromigration-reliability improvement of dual damascene interconnects |
| 04/08/2004 | US20040067636 Method of manufacturing multilayer structured semiconductor device |
| 04/08/2004 | US20040067632 Semiconductor device and method of manufacturing the same |
| 04/08/2004 | US20040067628 Semiconductor device including an insulated gate field effect transistor and method of manufacting the same |
| 04/08/2004 | US20040067623 Method of forming a novel top-metal fuse structure |
| 04/08/2004 | US20040067617 Distributed power MOSFET |
| 04/08/2004 | US20040067616 Method of manufacturing semiconductor device |
| 04/08/2004 | US20040067605 Semiconductor device having additional functional element and method of manufacturing thereof |
| 04/08/2004 | US20040067603 Method for producing channels and cavities in semiconductor housings, and an electronic component having such channels and cavities |
| 04/08/2004 | US20040067600 Reduced gate leakage current in thin gate dielectric CMOS integrated circuits |
| 04/08/2004 | US20040067370 Average surface roughness of SiC wafer set to be equivalent to film thickness of film deposited on silcon wafer to be measured |
| 04/08/2004 | US20040067366 Epoxy resin compositions, solid state devices encapsulated therewith and method |
| 04/08/2004 | US20040067031 Optical module package |
| 04/08/2004 | US20040066808 Integrated arrays of modulators and lasers on electronics |
| 04/08/2004 | US20040066693 IC card and method of manufacturing the same |
| 04/08/2004 | US20040066679 Etch stop in damascene interconnect structure and method of making |
| 04/08/2004 | US20040066638 Multilayered hybrid electronic module |
| 04/08/2004 | US20040066635 Film carrier tape for mounting electronic part and screen mask for solder resist coating |
| 04/08/2004 | US20040066634 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 04/08/2004 | US20040066630 Integrated heat spreader package for heat transfer and for bond line thickness control and process of making |
| 04/08/2004 | US20040066629 Cooling device for semiconductor modules |
| 04/08/2004 | US20040066628 Rapidly self-heat-conductive heat-dissipating module |
| 04/08/2004 | US20040066627 Heat sink assembly with retaining device |
| 04/08/2004 | US20040066626 Heat sink clip with plurality of pressing portions |
| 04/08/2004 | US20040066625 Microstructure cooler and use thereof |
| 04/08/2004 | US20040066624 Heat dissipation device |
| 04/08/2004 | US20040066617 Circuit board device and its manufacturing method |
| 04/08/2004 | US20040066610 Pressure-welded semiconductor device |
| 04/08/2004 | US20040066249 Scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 04/08/2004 | US20040066206 Methods relating to wafer integrated plasma probe assembly arrays |
| 04/08/2004 | US20040066102 Apparatus and method for heat sink device |
| 04/08/2004 | US20040065964 Semiconductor package with thermal enhance film and manufacturing method thereof |
| 04/08/2004 | US20040065963 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
| 04/08/2004 | US20040065962 Integrated circuit chip module |
| 04/08/2004 | US20040065961 Semiconductor integrated circuit device |
| 04/08/2004 | US20040065960 Electronic package with filled blinds vias |
| 04/08/2004 | US20040065958 Semiconductor device and method of manufacturing same |
| 04/08/2004 | US20040065957 Semiconductor device having a low dielectric film and fabrication process thereof |
| 04/08/2004 | US20040065956 Novel copper metal structure for the reduction of intra-metal capacitance |
| 04/08/2004 | US20040065955 Semiconductor silicon substrate; overcoating with transistor; copper connector for coupling transistors; undercoating barrier of titanium aluminum oxynitride |
| 04/08/2004 | US20040065954 Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials |
| 04/08/2004 | US20040065953 Semiconductor device and process of manufacture |
| 04/08/2004 | US20040065952 Optical semiconductor device and method of manufacture |
| 04/08/2004 | US20040065951 Multi chip module |
| 04/08/2004 | US20040065950 Electronic component package |
| 04/08/2004 | US20040065949 [solder bump] |
| 04/08/2004 | US20040065948 Power gridding scheme |
| 04/08/2004 | US20040065947 Semiconductor module and plate-shaped lead |
| 04/08/2004 | US20040065946 [bridge connection type of chip packageand fabricating method thereof] |
| 04/08/2004 | US20040065945 Semiconductor package having polymer members configured to provide selected package characteristics |
| 04/08/2004 | US20040065944 Semiconductor device |
| 04/08/2004 | US20040065943 Semiconductor varactor diode with doped heterojunction |
| 04/08/2004 | US20040065941 Gate dielectric antifuse circuits and methods for operating same |
| 04/08/2004 | US20040065935 Power devices and methods for manufacturing the same |
| 04/08/2004 | US20040065934 Bidirectional shallow trench superjunction device with resurf region |
| 04/08/2004 | US20040065926 Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device |
| 04/08/2004 | US20040065925 Semiconductor constructions comprising three-dimensional thin film transistor devices and resistors; and processes of forming stacked resistor constructions |
| 04/08/2004 | US20040065924 Ldd structure of thin film transistor and process for producing same |
| 04/08/2004 | US20040065923 Bi-directional silicon controlled rectifier for electrostatic discharge protection |
| 04/08/2004 | US20040065915 Semiconductor device having a built-in contact-type sensor and manufacturing method of such a semiconductor device |