| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/14/2004 | CN2612069Y 散热器 Heat sink |
| 04/14/2004 | CN2612068Y Heating spreader combination |
| 04/14/2004 | CN2612067Y Heat plate with joining structures |
| 04/14/2004 | CN2612066Y Heat spreader with fin combination |
| 04/14/2004 | CN2612065Y Heat dispersion device with main and assistant channels |
| 04/14/2004 | CN2612064Y Vertical winding structure |
| 04/14/2004 | CN2612063Y Image sensors with rough junction face |
| 04/14/2004 | CN2612062Y Image sensor which can prevent side light source interfrence from |
| 04/14/2004 | CN1489884A High frequency circuit block member, its manufacturing method, high refrequency module device and its manufaturing method |
| 04/14/2004 | CN1489788A Unmolded package for semiconductor device |
| 04/14/2004 | CN1489787A Electronic assembly having heat pipe that conducts heat from semicanductor substrate |
| 04/14/2004 | CN1489608A Solidifying agent composition for epoxy resin, epoxy resin composition and use |
| 04/14/2004 | CN1489432A Radiating structure for electronic circuit device capalbe of efficiently radiating heat for heating element |
| 04/14/2004 | CN1489430A Large-wire conductive plate for interconnection of circuit capable of superposing |
| 04/14/2004 | CN1489213A Integrated circuit capacitor |
| 04/14/2004 | CN1489210A Static discharge protection circuit and relative metal oxide semiconductor transistor structure |
| 04/14/2004 | CN1489209A 半导体装置 Semiconductor device |
| 04/14/2004 | CN1489208A 半导体装置 Semiconductor device |
| 04/14/2004 | CN1489207A Semiconductor package and semiconductor deivce |
| 04/14/2004 | CN1489206A 集成电路芯片组件 IC chip assembly |
| 04/14/2004 | CN1489205A Conductor frame and manufacturing method thereof |
| 04/14/2004 | CN1489204A Heat tube device and heat-tube heat exchanger |
| 04/14/2004 | CN1489203A Heat conducting tube for increaing heat conductivity using whirlwind |
| 04/14/2004 | CN1489202A Electronic device module |
| 04/14/2004 | CN1489201A 半导体器件 Semiconductor devices |
| 04/14/2004 | CN1489200A Multi chip assemble and multi chip closing method |
| 04/14/2004 | CN1489197A Method for producing semiconductor device and semiconductor device thereof |
| 04/14/2004 | CN1489193A Manufacturing method for semiconductor device and semiconductor thereof |
| 04/14/2004 | CN1489192A Method for manufacturing semiconductor device |
| 04/14/2004 | CN1489186A 半导体芯片及其制造方法 The method of manufacturing a semiconductor chip and |
| 04/14/2004 | CN1489020A Radiating device of chip radiation using low-melting-point metal or its alloy as flow working medium |
| 04/14/2004 | CN1488976A Wiring structure and electrooptical device manufacturing method, electrooptical device and electronic apparatus |
| 04/14/2004 | CN1146055C Electrode means, with or without functional elements and an electrode device including polymer material and an electrode device formed of said means |
| 04/14/2004 | CN1146046C Integrated circuit chip wiring structure with crossover capability and method of manufacturing same |
| 04/14/2004 | CN1146045C 半导体器件 Semiconductor devices |
| 04/14/2004 | CN1146044C Semiconductor device having lead terminals bent in J-shape |
| 04/14/2004 | CN1146043C Via structure |
| 04/14/2004 | CN1146041C Electronic power parts with cooler |
| 04/14/2004 | CN1146040C Substrate for semiconductor device, method of manufacturing the same, semiconductor device thereof |
| 04/14/2004 | CN1146031C In situ measuring method and device for processing semiconductor |
| 04/14/2004 | CN1146030C Semiconductor device and manufacturling method thereof, semiconductor module, circuit board and electrnic equipment |
| 04/14/2004 | CN1146029C Electronic component and mobile communication device comprising same |
| 04/14/2004 | CN1146021C Method of manufacturing semiconductor device with multilayer wiring |
| 04/14/2004 | CN1146017C Semiconductor device and method for manufacturing the same |
| 04/14/2004 | CN1145802C Microelectronic spring contact element and electronic element thereof |
| 04/13/2004 | US6721933 Input/output cell placement method and semiconductor device |
| 04/13/2004 | US6721185 Memory module having balanced data I/O contacts pads |
| 04/13/2004 | US6721153 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board |
| 04/13/2004 | US6720790 Method and apparatus for evaluating insulating film |
| 04/13/2004 | US6720783 IC socket and spring means of IC socket |
| 04/13/2004 | US6720720 Color selection electrode, method of producing color selection electrode and cathode ray tube. |
| 04/13/2004 | US6720667 Semiconductor device having align key for defining active region and method for manufacturing the same |
| 04/13/2004 | US6720666 BOC BGA package for die with I-shaped bond pad layout |
| 04/13/2004 | US6720663 Method for manufacturing an integrated memory circuit and an integrated memory circuit |
| 04/13/2004 | US6720662 Semiconductor device of chip-on-chip structure with a radiation noise shield |
| 04/13/2004 | US6720661 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 04/13/2004 | US6720659 Semiconductor device having an adhesion layer |
| 04/13/2004 | US6720658 Semiconductor device having a plurality of conductive layers |
| 04/13/2004 | US6720657 Semiconductor device and method of manufacturing the same |
| 04/13/2004 | US6720656 Semiconductor device with analysis prevention feature |
| 04/13/2004 | US6720652 Apparatus providing redundancy for fabricating highly reliable memory modules |
| 04/13/2004 | US6720651 Semiconductor plastic package and process for the production thereof |
| 04/13/2004 | US6720650 Semiconductor device having heat spreader attached thereto and method of manufacturing the same |
| 04/13/2004 | US6720649 Semiconductor package with heat dissipating structure |
| 04/13/2004 | US6720648 Electronic device |
| 04/13/2004 | US6720647 Semiconductor device and method of manufacturing the same |
| 04/13/2004 | US6720646 Power converter with improved lead frame arrangement including stand-up portion |
| 04/13/2004 | US6720645 Semiconductor device |
| 04/13/2004 | US6720644 Semiconductor device using interposer substrate and manufacturing method therefor |
| 04/13/2004 | US6720643 Stacked semiconductor module |
| 04/13/2004 | US6720642 Flip chip in leaded molded package and method of manufacture thereof |
| 04/13/2004 | US6720641 Failure analysis and fault isolation flip chip testing |
| 04/13/2004 | US6720640 Method for reclaiming delaminated wafer and reclaimed delaminated wafer |
| 04/13/2004 | US6720639 Integrated inductance structure |
| 04/13/2004 | US6720636 Semiconductor device with a staggered pad arrangement |
| 04/13/2004 | US6720635 Electronic component |
| 04/13/2004 | US6720625 Preventing electrostatic discharge (esd) damage |
| 04/13/2004 | US6720624 LVTSCR-like structure with internal emitter injection control |
| 04/13/2004 | US6720623 ESD protection device coupled between two high power lines |
| 04/13/2004 | US6720622 SCR-ESD structures with shallow trench isolation |
| 04/13/2004 | US6720612 Semiconductor device |
| 04/13/2004 | US6720609 Structure for reducing contact aspect ratios |
| 04/13/2004 | US6720591 Semiconductor integrated circuit device |
| 04/13/2004 | US6720574 Method of testing a semiconductor chip |
| 04/13/2004 | US6720502 Integrated circuit structure |
| 04/13/2004 | US6720493 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| 04/13/2004 | US6720270 Method for reducing size of semiconductor unit in packaging process |
| 04/13/2004 | US6720262 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
| 04/13/2004 | US6720255 Semiconductor device with silicon-carbon-oxygen dielectric having improved metal barrier adhesion and method of forming the device |
| 04/13/2004 | US6720253 Method of manufacturing semiconductor device having an aluminum wiring layer |
| 04/13/2004 | US6720249 Protective hardmask for producing interconnect structures |
| 04/13/2004 | US6720246 Flip chip assembly process for forming an underfill encapsulant |
| 04/13/2004 | US6720245 Method of fabrication and device for electromagnetic-shielding structures in a damascene-based interconnect scheme |
| 04/13/2004 | US6720244 Bump fabrication method |
| 04/13/2004 | US6720242 Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer |
| 04/13/2004 | US6720229 Integrated circuit inductor structure and non-destructive etch depth measurement |
| 04/13/2004 | US6720212 Method of eliminating back-end rerouting in ball grid array packaging |
| 04/13/2004 | US6720209 Method for fabricating a circuit device |
| 04/13/2004 | US6720208 Semiconductor device |
| 04/13/2004 | US6720207 Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |