| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/2004 | US20040070077 Semiconductor device and method of manufacturing the same |
| 04/15/2004 | US20040070076 Semiconductor chip package for image sensor and method of the same |
| 04/15/2004 | US20040070075 Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device |
| 04/15/2004 | US20040070074 Hybrid integrated circuit device |
| 04/15/2004 | US20040070073 Underfill gap enhancement |
| 04/15/2004 | US20040070072 Semiconductor device having radiation structure |
| 04/15/2004 | US20040070071 Diamond composite heat spreader and associated methods |
| 04/15/2004 | US20040070070 Carbonaceous composite heat spreader and associated methods |
| 04/15/2004 | US20040070069 Lid and heat spreader design for a semiconductor package |
| 04/15/2004 | US20040070068 Semiconductor package insulation film and manufacturing method thereof |
| 04/15/2004 | US20040070067 Semiconductor device |
| 04/15/2004 | US20040070066 Power semiconductor device |
| 04/15/2004 | US20040070065 Controlled impedance for wire bonding interconnects |
| 04/15/2004 | US20040070064 Semiconductor device and fabrication method of the same |
| 04/15/2004 | US20040070062 Semiconductor device and laminated leadframe package |
| 04/15/2004 | US20040070061 Semiconductor device assemblies including interposers with dams protruding therefrom |
| 04/15/2004 | US20040070060 Semiconductor device having radiation structure |
| 04/15/2004 | US20040070059 Semiconductor device having sealing structure for wide gap type semiconductor chip |
| 04/15/2004 | US20040070058 Integrated circuit package design |
| 04/15/2004 | US20040070057 COF tape carrier, semiconductor element, COF semiconductor device, and method for manufacturing of COF semiconductor device |
| 04/15/2004 | US20040070056 Having a shape adapted to reduce the number of leads connected to power and ground terminals |
| 04/15/2004 | US20040070055 Ground plane for exposed package |
| 04/15/2004 | US20040070054 IC chip and semiconductor device |
| 04/15/2004 | US20040070053 Semiconductor device, semiconductor device module, manufacturing method of semiconductor device, and manufacturing method of semiconductor device module |
| 04/15/2004 | US20040070052 Integrated circuit configuration comprising a sheet-like substrate |
| 04/15/2004 | US20040070049 Fuse structure and method to form the same |
| 04/15/2004 | US20040070042 Method of wire bonding over active area of a semiconductor circuit |
| 04/15/2004 | US20040070018 Semiconductor memory circuitry |
| 04/15/2004 | US20040070005 Compact high voltage ESD protection diode |
| 04/15/2004 | US20040069993 Light emitting device and manufacturing method thereof |
| 04/15/2004 | US20040069989 With vertical transistors; also detecting word lines in a wafer with a scribe line region and a memory region |
| 04/15/2004 | US20040069988 Bonding pad with separate bonding and probing areas |
| 04/15/2004 | US20040069984 Terahertz interconnect system and applications |
| 04/15/2004 | US20040069744 Method for homogenizing the thickness of a coating on a patterned layer |
| 04/15/2004 | US20040069528 Process for producing ceramic circuit boards |
| 04/15/2004 | US20040069479 Heat radiating structure formed from quickly connectable U-sectioned fins |
| 04/15/2004 | US20040069462 Heat transfer element, cooling device and electronic device having the element |
| 04/15/2004 | US20040069461 Heat pipe unit and heat pipe type heat exchanger |
| 04/15/2004 | US20040069460 Thin sheet type heat pipe |
| 04/15/2004 | US20040069459 Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device |
| 04/15/2004 | US20040069453 Assembled structure having an enlarged heat transfer area for heat radiation therefrom |
| 04/15/2004 | US20040069452 Thermal interface wafer and method of making and using the same |
| 04/15/2004 | US20040069451 Apparatus for heat transfer and critical heat flux enhancement |
| 04/15/2004 | US20040069112 Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape |
| 04/15/2004 | US20040069060 Lead frame for automotive electronics |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | US20040068868 Method of mounting camera module on wiring board |
| 04/15/2004 | US20040068864 Web fabrication of devices |
| 04/15/2004 | DE4426843B4 Fluorpolymer-Verbundmaterial für ein elektrisches Substrat mit niedrigem Wärmekoeffizient der Dielektrizitätskonstante Fluoropolymer composite material for an electrical substrate with a low thermal coefficient of dielectric constant |
| 04/15/2004 | DE202004002464U1 Heat sink has series of cooling fins that are angled so as to promote air flow from fan over the surfaces |
| 04/15/2004 | DE202004002339U1 Kühlvorrichtung für integrierte Schaltkreise A cooling apparatus for integrated circuits |
| 04/15/2004 | DE202004001729U1 Cooling system for use with electronic modules has vertical plate stack for heat conduction cooled by radial flow fan |
| 04/15/2004 | DE19940759B4 Schaltungsanordnung und Verfahren zu deren Herstellung Circuit arrangement and method for their preparation |
| 04/15/2004 | DE19836753B4 Integrierter Halbleiterchip mit Zuleitungen zu einem oder mehreren externen Anschlüssen Integrated semiconductor chip with supply lines to one or more external terminals |
| 04/15/2004 | DE10346002A1 Etching resist layer, e.g. to make capacitor, forms intermediate layer and opening, coats resist over them and patterns resist in shape of opening for etching |
| 04/15/2004 | DE10343556A1 Medium mit Datenspeicher und Nachrichtenübertragungsfähigkeiten und Verfahren zur Ausbildung eines derartigen Mediums Medium with data storage and communication capabilities and a method for forming such a medium |
| 04/15/2004 | DE10339263A1 Blech geringer Ausdehnung, Herstellungsverfahren dafür und Halbleitervorrichtung mit diesem Blech Low expansion sheet, manufacturing method thereof and the semiconductor device with this sheet |
| 04/15/2004 | DE10334836A1 Halbleiterwafer und ein entsprechendes Herstellungsverfahren Semiconductor wafer, and a corresponding production method |
| 04/15/2004 | DE10322745A1 Leistungshalbleiter-Bauelement mit hoher Abstrahlungseffizienz Power semiconductor device having high radiation efficiency |
| 04/15/2004 | DE10296545T5 Verfahren zur Herstellung von Bauteilen mit MOS-Gatesteuerung mit verringerter Maskenzahl Process for the production of components with MOS gated with a reduced number of masks |
| 04/15/2004 | DE10296339T5 Fliegende Strahlpfadfehlerkorrektur für eine Speicherverbindungsbearbeitung Flying beam path error correction for a memory link processing |
| 04/15/2004 | DE10295972T5 Nicht in einer Form hergestellte Packung für eine Halbleiteranordnung Not manufactured in a mold package for a semiconductor device |
| 04/15/2004 | DE10248373A1 Trench capacitors short circuit determining test structure, has two rows of trench capacitors, each capacitor connected by tunnel and bridge structure to form interconnected capacitor rows within regular trench capacitor matrix |
| 04/15/2004 | DE10246577A1 Circuit board with metal housing, e.g. for motor vehicle control circuit, has spring member for making contact between circuit board or power semiconductor device and metal housing for heat removal |
| 04/15/2004 | DE10245867A1 Power semiconductor component, e.g. diode or metal oxide semiconductor field effect transistor, includes insulating layer with holes over terminals, onto which electrodes are deposited, making contact with terminals |
| 04/15/2004 | DE10245451A1 Electronic component with semiconductor chip having flexible chip contacts uses elastomeric embedding mass containing electroconductive components to make connections |
| 04/15/2004 | DE10245266A1 Heat sink with metallic body, used for cooling electronic components, has recess on one side containing ceramic impregnated with metal |
| 04/15/2004 | DE10244791A1 Electronic power component cooling device, has heat-sink provided with metal-filled channels for conducting signals of component to external environment |
| 04/15/2004 | DE10242054B3 Teststruktur Test structure |
| 04/15/2004 | DE10240848A1 Block-form non-ferrous cooling body has individual plates with grooves at head and foot regions |
| 04/15/2004 | DE10233736B3 Wärmetauschervorrichtung Heat exchange apparatus |
| 04/15/2004 | DE10192788T5 Verfahren und Vorrichtung zur Kantenverbindung zwischen Elementen einer integrierten Schaltung Method and device for edge connection between elements of an integrated circuit |
| 04/15/2004 | DE10065339B4 Kapazitiver Sensor als Schutzvorrichtung gegen Angriffe auf einen Sicherheitschip Capacitive sensor as a protective device against attacks on a security chip |
| 04/15/2004 | DE10006942B4 Verfahren zur Herstellung eines Systemträgers und Systemträger Process for the preparation of a leadframe and system carrier |
| 04/15/2004 | CA2493408A1 Micro-structure cooling device and use thereof |
| 04/14/2004 | EP1408725A1 Process for producing ceramic circuit boards |
| 04/14/2004 | EP1408556A2 Image pickup device and portable terminal equipped therewith |
| 04/14/2004 | EP1408548A2 Electronic component with a lead frame |
| 04/14/2004 | EP1408547A2 Semiconductor device and manufacturing method thereof |
| 04/14/2004 | EP1408546A1 Semiconductor device and production method therefor |
| 04/14/2004 | EP1408544A1 Film thichness measuring monitor wafer |
| 04/14/2004 | EP1408543A2 Formation of solder balls having resin member as reinforcement |
| 04/14/2004 | EP1408365A2 Circuit board and method of manufacturing the same |
| 04/14/2004 | EP1408338A2 Method for making a probe card with multiple contact tips for testing integrated circuit |
| 04/14/2004 | EP1408337A2 Probe card assembly |
| 04/14/2004 | EP1408087A1 Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 04/14/2004 | EP1408067A1 Colorless and transparent polyimidesilicone resin having thermosetting functional groups |
| 04/14/2004 | EP1407842A2 Mold and method for manufacturing metal-ceramic composite member |
| 04/14/2004 | EP1407641A2 Structure and method for fabrication of a leadless multi-die carrier |
| 04/14/2004 | EP1407491A2 Mixed analog and digital integrated circuits |
| 04/14/2004 | EP1407490A2 Single package containing multiple integrated circuit devices |
| 04/14/2004 | EP1407488A2 A method of selectively alloying interconnect regions by depostion process |
| 04/14/2004 | EP1407477A2 Improved connection assembly for integrated circuit sensors |
| 04/14/2004 | EP1407393A1 Topological global routing for automated ic package interconnect |
| 04/14/2004 | EP1406977A1 Selective deposition of circuit-protective polymers |
| 04/14/2004 | EP0878025B1 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate |
| 04/14/2004 | EP0853321B1 Multilayer ceramic part using a conductor paste |
| 04/14/2004 | EP0756759B1 Charge-coupled imaging device |
| 04/14/2004 | CN2612071Y Package structure for chip |
| 04/14/2004 | CN2612070Y Liquid cooling radiator |