| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/20/2004 | US6723614 Semiconductor device comprising layered positional detection marks and manufacturing method thereof |
| 04/20/2004 | US6723600 Method for making a metal-insulator-metal capacitor using plate-through mask techniques |
| 04/20/2004 | US6723585 Leadless package |
| 04/20/2004 | US6723584 Methods of making microelectronic assemblies including compliant interfaces |
| 04/20/2004 | US6723583 Method of manufacturing a semiconductor device using a mold |
| 04/20/2004 | US6723582 Method of making a semiconductor package having exposed metal strap |
| 04/20/2004 | US6723577 Method of forming an optical fiber interconnect through a semiconductor wafer |
| 04/20/2004 | US6723494 Conductor pattern and electronic component having the same |
| 04/20/2004 | US6723452 Cured epoxy resin provides solder crack resistance on use of lead-free solder and improved flame retardance |
| 04/20/2004 | US6723420 Thick film paste systems for circuits on diamond substrates |
| 04/20/2004 | US6723379 Coating using the jet of gas so as to form a continuous built-up metallic frame incorporating the initial continuous metallic coating as its base and having an overall thickness that is a predetermined thickness |
| 04/20/2004 | US6723281 Silver alloyed with palladium and at least one of aluminum, copper, tantalum, chromium, titanium and cobalt; stability; processability; lower electrical resistivity |
| 04/20/2004 | US6722954 Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer |
| 04/20/2004 | US6722930 I-channel surface-mount connector |
| 04/20/2004 | US6722910 Electrical connector |
| 04/20/2004 | US6722908 Retention mechanism for an electrical assembly |
| 04/20/2004 | US6722423 Heat sink |
| 04/20/2004 | US6722419 Computer cooler |
| 04/20/2004 | US6722418 Heat sink assembly with guiding vanes |
| 04/20/2004 | US6722030 Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves |
| 04/20/2004 | CA2170132C Heat insulating board and method for heat insulation by using the same |
| 04/15/2004 | WO2004032582A1 Circuit materials, circuits, multi-layer circuits and methods of manufacture thereof |
| 04/15/2004 | WO2004032236A2 Method and apparatus to fabricate an on-chip decoupling capacitor |
| 04/15/2004 | WO2004032234A2 Semiconductor device power interconnect striping |
| 04/15/2004 | WO2004032233A1 Semiconductor device and method of manufacturing thereof |
| 04/15/2004 | WO2004032232A1 Semiconductor die package including drain clip |
| 04/15/2004 | WO2004032231A2 Micro-structure cooling device and use thereof |
| 04/15/2004 | WO2004032229A1 Method for fabricating high frequency module |
| 04/15/2004 | WO2004032223A1 Semiconductor device |
| 04/15/2004 | WO2004032222A1 Selective connection in ic packaging |
| 04/15/2004 | WO2004032206A1 Forming folded-stack packaged device using progressive folding tool |
| 04/15/2004 | WO2004032205A2 Current-carrying electronic component and method of manufacturing same |
| 04/15/2004 | WO2004032198A2 Method for maintaining solder thickness in flipchip attach packaging processes |
| 04/15/2004 | WO2004032188A2 Packaged rf power transistor having rf bypassing/output matching network |
| 04/15/2004 | WO2004032186A2 Thermal enhanced package for block mold assembly |
| 04/15/2004 | WO2004032182A2 Method for making a wire nanostructure in a semiconductor film |
| 04/15/2004 | WO2004031787A1 Integrated test circuit arrangement and test method |
| 04/15/2004 | WO2004031257A1 Epoxy resin composition for sealing optical semiconductor |
| 04/15/2004 | WO2004015441A3 Radio frequency identificaton device and method |
| 04/15/2004 | WO2004006290A3 Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors |
| 04/15/2004 | WO2004004003A8 Multilayer substrate metallization for ic interconnection |
| 04/15/2004 | WO2004001814A3 Method of forming a raised contact for a substrate |
| 04/15/2004 | WO2003100825A3 Multiple thickness semiconductor interconnect and method therefor |
| 04/15/2004 | WO2003095702A3 Method for curing low dielectric constant film by electron beam |
| 04/15/2004 | WO2003070809A3 Organosiloxanes and their use in dielectric films of semiconductors |
| 04/15/2004 | WO2003060960A3 High density area array solder microjoining interconnect structure and fabrication method |
| 04/15/2004 | WO2003043074A3 Semiconductor component and method for contacting said semiconductor component |
| 04/15/2004 | WO2003021674A3 Microelectronic circuit package having die fixed within a package core |
| 04/15/2004 | WO2002092878A3 Electroless plating method and device, and substrate processing method and apparatus |
| 04/15/2004 | US20040072982 Applying to semiconductors |
| 04/15/2004 | US20040072968 Mixture of epoxy resins, curing agents, filler and phosphazene compound |
| 04/15/2004 | US20040072534 Ventilating slide rail mount |
| 04/15/2004 | US20040072456 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 04/15/2004 | US20040072447 Method and device for minimizing multi-layer microscopic and macroscopic alignment errors |
| 04/15/2004 | US20040072444 Etchant for wire, method of manufacturing wire using etchant, thin film transistor array panel including wire and manufacturing method thereof |
| 04/15/2004 | US20040072438 Method for defining alignment marks in a semiconductor wafer |
| 04/15/2004 | US20040072434 Device manufacturing apparatus |
| 04/15/2004 | US20040072429 Method for manufacturing a semiconductor device |
| 04/15/2004 | US20040072421 Laterally interconnecting structures |
| 04/15/2004 | US20040072420 Anti-reflective compositions comprising triazine compounds |
| 04/15/2004 | US20040072418 Semiconductor device and manufacturing method thereof |
| 04/15/2004 | US20040072415 Semiconductor device and method of manufacturing the same |
| 04/15/2004 | US20040072414 Buffer metal layer |
| 04/15/2004 | US20040072413 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 04/15/2004 | US20040072398 Mask-alignment detection circuit in X and Y directions |
| 04/15/2004 | US20040072396 Semiconductor electronic device and method of manufacturing thereof |
| 04/15/2004 | US20040072390 Method for providing and utilizing rerouting resources |
| 04/15/2004 | US20040072389 Chip carrier, semiconductor package and fabricating method thereof |
| 04/15/2004 | US20040072387 Method of fabricating and mounting flip chips |
| 04/15/2004 | US20040072385 Chip alignment and placement apparatus for integrated circuit, mems, photonic or other devices |
| 04/15/2004 | US20040072377 Multi chip module assembly |
| 04/15/2004 | US20040071991 Forming a row of aligned windows in a planar surface; depositing an electromigration-inhibiting/electrically conductive material over the planar surface and through the windows to fill; removing portions |
| 04/15/2004 | US20040071878 Surface preparation using plasma for ALD Films |
| 04/15/2004 | US20040071870 Fiber adhesive material |
| 04/15/2004 | US20040071805 Transfer holding of integrated circuit packages |
| 04/15/2004 | US20040071412 Optical connector, optical element holding structure, and structure of a mount section of an optical connector |
| 04/15/2004 | US20040071406 Optical connector, optical element holding structure, and structure of a mount section of an optical connector |
| 04/15/2004 | US20040070951 Semiconductor package assembly and method for electrically isolating modules |
| 04/15/2004 | US20040070950 Voltage conversion module |
| 04/15/2004 | US20040070949 Electronic device having a heat dissipation member |
| 04/15/2004 | US20040070948 Cavity-down ball grid array semiconductor package with heat spreader |
| 04/15/2004 | US20040070946 Power module and production method thereof |
| 04/15/2004 | US20040070945 Heat dissipation structures and method of making |
| 04/15/2004 | US20040070943 Composite fins for heat sinks |
| 04/15/2004 | US20040070942 Electronic apparatus |
| 04/15/2004 | US20040070941 Compact thermosiphon with enhanced condenser for electronics cooling |
| 04/15/2004 | US20040070940 Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component |
| 04/15/2004 | US20040070935 Electronic apparatus having a liquid-coolant circulation path and an electric-signal cable |
| 04/15/2004 | US20040070934 Electronic apparatus having a heat-radiating portion at the back of the display panel |
| 04/15/2004 | US20040070933 Cooling system for electronics with improved thermal interface |
| 04/15/2004 | US20040070927 Cooling arrangement for an integrated circuit |
| 04/15/2004 | US20040070915 Ceramic electronic component and production method therefor |
| 04/15/2004 | US20040070811 Transmission line, optical module using the same and manufacturing method of optical module |
| 04/15/2004 | US20040070312 Integrated circuit and process for fabricating the same |
| 04/15/2004 | US20040070087 Semiconductor package with enhanced chip groundability and method of fabricating the same |
| 04/15/2004 | US20040070086 Fabrication of wire bond pads over underlying active devices, passive devices and /or dielectric layers in integrated circuits |
| 04/15/2004 | US20040070085 Method for producing a semiconductor device and corresponding semiconductor device |
| 04/15/2004 | US20040070080 Low cost, high performance flip chip package structure |
| 04/15/2004 | US20040070079 Bump pad design for flip chip bumping |
| 04/15/2004 | US20040070078 Multiple copper vias for integrated circuit metallization and methods of fabricating same |