| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/21/2004 | CN1491440A Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 04/21/2004 | CN1491439A Multi-chip circuit module and method for producing the same |
| 04/21/2004 | CN1491438A Radiating structural body of electronic part and radiating sheet used for radiating structural body |
| 04/21/2004 | CN1491437A Heat radiating member |
| 04/21/2004 | CN1491433A Lead-free solder structure and method for high fatigue life |
| 04/21/2004 | CN1491432A Bonded structure using reacted borosilicate mixture |
| 04/21/2004 | CN1491398A On-the-fly beam path error correction for memory link processing |
| 04/21/2004 | CN1491245A Liquid epoxy resin emulsions, method for production and use thereof |
| 04/21/2004 | CN1491077A Film bearing band for arranging electronic parts and printing screen mask for coating welding retardant |
| 04/21/2004 | CN1491076A Method for preparing wiring placode |
| 04/21/2004 | CN1491072A 多层布线板 The multilayer wiring board |
| 04/21/2004 | CN1490875A Semiconductor device and producing method thereof |
| 04/21/2004 | CN1490874A Laminated semiconductor devices |
| 04/21/2004 | CN1490873A Electrostatic charging protective circuit |
| 04/21/2004 | CN1490872A Interconnection, interconnection forming method, thin-film transistor and displaying device |
| 04/21/2004 | CN1490871A Semiconductor with column cap layer and manufacture thereof |
| 04/21/2004 | CN1490870A Lead frame and producing method thereof, semiconductor device therefrom |
| 04/21/2004 | CN1490867A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/21/2004 | CN1490864A Butt plate stand for producing hollow sealed electronic products and sealing process therewith |
| 04/21/2004 | CN1490857A Structure of micro distance crystal covered carrier-board and manufacture thereof |
| 04/21/2004 | CN1490697A Electronic device with radiating part on back of display board |
| 04/21/2004 | CN1490696A Electronic device of coolant circulating pipeline with cooled heating component |
| 04/21/2004 | CN1490695A Electronic device with liquid coolant circulating circuit and electric signal cable |
| 04/21/2004 | CN1490646A Mounting device and structure for semiconductor component, electro-optical device and producing method thereof |
| 04/21/2004 | CN1490635A Optical component and producing method thereof, lenticule substrate and producing method thereof, displaying device, camera component |
| 04/21/2004 | CN1490632A Magnetic sensor producing method and lead wire frame |
| 04/21/2004 | CN1147212C Attached structure for control element of radiation noise |
| 04/21/2004 | CN1147004C Method for manufacturing thin-film transistor |
| 04/21/2004 | CN1146992C Semiconductor device equipped with antifuse elements and method for manufacturing FPGA |
| 04/21/2004 | CN1146991C Semiconductor package incorporating heat dispersion plate inside resin molding and fabrication method for the same |
| 04/21/2004 | CN1146990C High-frequency integrated circuit device and mfr. method thereof |
| 04/21/2004 | CN1146989C 电子元件 Electronic component |
| 04/21/2004 | CN1146988C Package for semiconductor powder device and method for assembling the same |
| 04/21/2004 | CN1146987C Semiconductor device packaged in plastic package and metal mold employable for production thereof |
| 04/21/2004 | CN1146986C Semiconductor chip package and its packing method |
| 04/21/2004 | CN1146985C Semiconductor device and wiring tape for semiconductor device |
| 04/21/2004 | CN1146984C Chip supporting substrate for semiconductor package, semiconductor, device and manufacture thereof |
| 04/21/2004 | CN1146978C Antidifusion laminated structure and its making method |
| 04/21/2004 | CN1146977C Structure for installing dawnward pieces and pattern for preventing dawnward piece bonding zone from flucuation |
| 04/21/2004 | CN1146976C Semiconductor devcie and method for manufacturing the same |
| 04/21/2004 | CN1146975C Forming method for moulded hollow plastic shell |
| 04/21/2004 | CN1146962C Insulating film for semiconductor device and semiconductor device |
| 04/20/2004 | US6725443 Integrated circuit template cell system and method |
| 04/20/2004 | US6725440 Semiconductor integrated circuit device comprising a plurality of semiconductor devices formed on a substrate |
| 04/20/2004 | US6725185 Apparatus for modeling IC substrate noise |
| 04/20/2004 | US6724638 Printed wiring board and method of producing the same |
| 04/20/2004 | US6724632 Heat sink assembly with adjustable clip |
| 04/20/2004 | US6724631 Power converter package with enhanced thermal management |
| 04/20/2004 | US6724630 Stacked device assembly |
| 04/20/2004 | US6724629 Leaf spring load plate with retained linear cam slide |
| 04/20/2004 | US6724628 Blindmate heat sink assembly |
| 04/20/2004 | US6724599 Power semiconductor device |
| 04/20/2004 | US6724290 Microcoil |
| 04/20/2004 | US6724214 Test structures for on-chip real-time reliability testing |
| 04/20/2004 | US6724183 Method and apparatus for detecting bearing failure |
| 04/20/2004 | US6724096 Die corner alignment structure |
| 04/20/2004 | US6724095 Apparatus for aligning an integrated circuit package with an interface |
| 04/20/2004 | US6724093 Semiconductor devices and their manufacture |
| 04/20/2004 | US6724092 Semiconductor device having a wiring pattern and method for manufacturing the same |
| 04/20/2004 | US6724091 Flip-chip system and method of making same |
| 04/20/2004 | US6724090 Multi-chip package and method for manufacturing the same |
| 04/20/2004 | US6724089 Dual damascene interconnect |
| 04/20/2004 | US6724088 Quantum conductive barrier for contact to shallow diffusion region |
| 04/20/2004 | US6724087 Laminated conductive lines and methods of forming the same |
| 04/20/2004 | US6724086 Hydrogenated oxidized silicon carbon material |
| 04/20/2004 | US6724085 Semiconductor device with reduced resistance plug wire for interconnection |
| 04/20/2004 | US6724084 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device |
| 04/20/2004 | US6724083 Method of producing semiconductor packages by cutting via holes into half when separating substrate |
| 04/20/2004 | US6724081 Electronic assembly |
| 04/20/2004 | US6724080 Heat sink with elevated heat spreader lid |
| 04/20/2004 | US6724079 Wire bond-less electronic component for use with an external circuit and method of manufacture |
| 04/20/2004 | US6724078 Electronics packaging; dissipate heat generated in a high speed integrated circuit |
| 04/20/2004 | US6724077 Semiconductor package having multi-signal bus bars |
| 04/20/2004 | US6724076 Package for a semiconductor chip |
| 04/20/2004 | US6724075 Semiconductor chip package and manufacturing method thereof |
| 04/20/2004 | US6724074 Stack semiconductor chip package and lead frame |
| 04/20/2004 | US6724073 Plastic lead frames for semiconductor devices and packages including same |
| 04/20/2004 | US6724072 Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same |
| 04/20/2004 | US6724071 Molded plastic package with heat sink and enhanced electrical performance |
| 04/20/2004 | US6724070 Fine pitch lead frame |
| 04/20/2004 | US6724069 Spin-on cap layer, and semiconductor device containing same |
| 04/20/2004 | US6724067 Low stress thermal and electrical interconnects for heterojunction bipolar transistors |
| 04/20/2004 | US6724054 Self-aligned contact formation using double SiN spacers |
| 04/20/2004 | US6724050 ESD improvement by a vertical bipolar transistor with low breakdown voltage and high beta |
| 04/20/2004 | US6724030 System and method for back-side contact for trench semiconductor device characterization |
| 04/20/2004 | US6723927 High-reliability interposer for low cost and high reliability applications |
| 04/20/2004 | US6723917 Protective shield for against damaging circuit board and for safeguarding chip |
| 04/20/2004 | US6723801 Polyphenol resin, process for its production, epoxy resin composition and its use |
| 04/20/2004 | US6723647 Method for manufacturing semiconductor device |
| 04/20/2004 | US6723646 Method for controlling and monitoring a chemical mechanical polishing process |
| 04/20/2004 | US6723645 Method of forming a metal wiring in a semiconductor device |
| 04/20/2004 | US6723641 Method of manufacturing semiconductor device and method of determining film formation time, chamber, chemical vapor deposition apparatus and boat thereof, etching apparatus, and film formation process system |
| 04/20/2004 | US6723635 Protection low-k ILD during damascene processing with thin liner |
| 04/20/2004 | US6723632 Interconnect exhibiting reduced parasitic capacitance variation |
| 04/20/2004 | US6723631 Fabrication method of semiconductor integrated circuit device |
| 04/20/2004 | US6723630 Solder ball fabrication process |
| 04/20/2004 | US6723628 Method for forming bonding pad structures in semiconductor devices |
| 04/20/2004 | US6723627 Method for manufacturing semiconductor devices |
| 04/20/2004 | US6723626 Method of manufacturing semiconductor device |
| 04/20/2004 | US6723620 Power semiconductor die attach process using conductive adhesive film |