| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/22/2004 | US20040075825 Real-time evaluation of stress fields and properties in line features formed on substrates |
| 04/22/2004 | US20040075802 Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element |
| 04/22/2004 | US20040075761 Solid-state imaging device and method of manufacturing the same |
| 04/22/2004 | US20040075604 Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof |
| 04/22/2004 | US20040075515 Semiconductor device, and method and apparatus for manufacturing semiconductor device |
| 04/22/2004 | US20040075458 Analyzing semiconductor wafers by bombarding with radiation beams, then scanning for charge differences resulting from defects and accumulating particles emitted |
| 04/22/2004 | US20040075181 Thermal transport apparatus and method for manufacturing the same |
| 04/22/2004 | US20040075179 Structural design of alignment mark |
| 04/22/2004 | US20040075178 Layouts for joining dies to substrates,comprising segments having bonding projections and surfaces; high density connection of chips |
| 04/22/2004 | US20040075177 Wiring board, method of manufacturing the same, semiconductor device, circuit board, and electronic equipment |
| 04/22/2004 | US20040075176 Packaged semiconductor device |
| 04/22/2004 | US20040075175 Reduction of electromagnetic interference in integrated circuit packages |
| 04/22/2004 | US20040075174 Semiconductor device and method of manufacturing the same utilizing permittivity of an insulating layer to provide a desired cross conductive layer capacitance property |
| 04/22/2004 | US20040075172 Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module |
| 04/22/2004 | US20040075171 Decoupling capacitor closely coupled with integrated circuit |
| 04/22/2004 | US20040075170 High frequency integrated circuits |
| 04/22/2004 | US20040075169 Electrical and electronic apparatus having P-type transistors and diodes, supported on terminal frames, so that the drain and cathode have a common potential |
| 04/22/2004 | US20040075168 Semiconductor device bonded on circuit board via coil spring |
| 04/22/2004 | US20040075166 Semiconductor device with heat-dissipating capability |
| 04/22/2004 | US20040075165 Dual power supply method and apparatus |
| 04/22/2004 | US20040075164 Module device of stacked semiconductor packages and method for fabricating the same |
| 04/22/2004 | US20040075163 Electrical and electronic apparatus having chips supported on sheets, terminals connected by wires and seals; printed circuits |
| 04/22/2004 | US20040075162 Laser diode and heatsink quick connect/disconnect assembly |
| 04/22/2004 | US20040075161 Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates |
| 04/22/2004 | US20040075159 Nanoscopic tunnel |
| 04/22/2004 | US20040075157 Semiconductor integrated circuit device |
| 04/22/2004 | US20040075148 Semiconductor device |
| 04/22/2004 | US20040075146 SCR-ESD structures with shallow trench isolation |
| 04/22/2004 | US20040075145 Electrostatic discharge protection in a semiconductor device |
| 04/22/2004 | US20040075136 Electrostatic discharge protection circuit |
| 04/22/2004 | US20040075131 Integrated circuit capacitor structure |
| 04/22/2004 | US20040075127 Thin-film capacitor device, mounting module for the same, and method for fabricating the same |
| 04/22/2004 | US20040075113 Semiconductor equipment |
| 04/22/2004 | US20040075099 Position detecting method and apparatus |
| 04/22/2004 | US20040074951 Aluminum/ceramic bonding substrate and method for producing same |
| 04/22/2004 | US20040074661 Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly |
| 04/22/2004 | US20040074660 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 04/22/2004 | US20040074633 Heat dissipating apparatus and method for producing same |
| 04/22/2004 | US20040074630 Conformal heat spreader |
| 04/22/2004 | US20040074353 Method and apparatus for removing a carrier part from a carrier, and a product removed from a carrier |
| 04/22/2004 | US20040074323 Process condition sensing wafer and data analysis system |
| 04/22/2004 | US20040074088 Method for manufacturing multilayer circuit board for semiconductor device |
| 04/22/2004 | US20040074086 Method for forming conductor wire on a substrate board |
| 04/22/2004 | DE10347912A1 Verbesserter Leiterrahmen für elektronische Schaltungen im Automobilbereich Improved ladder framework for electronic circuits in the automotive sector |
| 04/22/2004 | DE10344273A1 Verbesserter Kontakt für Speicherzellen Improved contact for memory cells |
| 04/22/2004 | DE10341560A1 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 04/22/2004 | DE10327926A1 Schaltungsintegriertes Mikromodul Integrated circuit Micromodule |
| 04/22/2004 | DE10325812A1 Halbleitervorrichtung Semiconductor device |
| 04/22/2004 | DE10312238A1 Leistungshalbleitereinrichtung Power semiconductor device |
| 04/22/2004 | DE10296935T5 Barrierenverstärkungsprozess für Kupferdurchkontaktierungen(oder Zwischenverbindungen) Barriers amplification process for Kupferdurchkontaktierungen (or intermediates) |
| 04/22/2004 | DE10296468T5 Bearbeitung einer Speicherverbindungsleitung mit einer Gruppe von mindestens zwei Laserimpulsen Processing a memory connection line with a group of at least two laser pulses |
| 04/22/2004 | DE10247486A1 Test structure and process to give process exactness in the production of aligned structures on substrates forms test patterns with displaceable sections |
| 04/22/2004 | DE10247485A1 Chip with attack protection, e.g. for chip card, has device for monitoring protective layer structure to detect external attacks, inhibit/interrupt data extraction, feed or handling if attack occurs |
| 04/22/2004 | DE10247315A1 TO-casing for high frequency optoelectronic converter, includes stamped base bonded to multi-layer ceramic substrate passing lead-out conductors |
| 04/22/2004 | DE10247075A1 Mounting device for monolithic integrated circuits for use in motor vehicles which are subject to wide fluctuations in operating temperature have platform raised above substrate for connection area for bondable contacts |
| 04/22/2004 | DE10247035A1 Memory module for mobile radio application, has dissipation frame arranged between memory device and board, where dissipation frame includes heat-conducting paste between board and memory device |
| 04/22/2004 | DE10246990A1 Mikrostrukturkühler und dessen Verwendung Microstructure cooler and its use |
| 04/22/2004 | DE10196942T5 Halbleiter-Leistungsmodul Semiconductor power module |
| 04/22/2004 | DE10196917T5 Hochleistungsrippenaufbau für eine luftgekühlte Wärmeableitungsvorrichtung High performance rib construction for an air-cooled heat dissipation device |
| 04/22/2004 | DE10196368T5 Kontaktstruktur und Verfahren zu dessen Herstellung und eine Prüfkontaktanordnung, die diese verwendet Contact structure and method for its preparation and a test contact, which uses this |
| 04/22/2004 | CA2445890A1 Package for housing semiconductor chip, and semiconductor device |
| 04/21/2004 | EP1411756A2 Radio frequency apparatus |
| 04/21/2004 | EP1411755A2 Electronic apparatus having a liquid-coolant circulation path and an electric-signal cable |
| 04/21/2004 | EP1411602A1 Optical semiconductor module and method of producing the same |
| 04/21/2004 | EP1411583A1 Radar apparatus |
| 04/21/2004 | EP1411553A1 Electronic circuit component |
| 04/21/2004 | EP1411549A1 Semiconductor power module with electrically conducting carbon nanotubes |
| 04/21/2004 | EP1411546A2 Improving nickel silicide - silicon nitride adhesion through surface passivation |
| 04/21/2004 | EP1411417A2 Electronic apparatus having a heat-radiating portion at the back of the display panel |
| 04/21/2004 | EP1411376A1 Optical component and method of manufacturing it |
| 04/21/2004 | EP1411081A1 Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates |
| 04/21/2004 | EP1411025A2 Metal wiring method for an undercut |
| 04/21/2004 | EP1410701A1 Method of manufacturing an integrated circuit carrier |
| 04/21/2004 | EP1410700A1 Integrated circuit carrier with recesses |
| 04/21/2004 | EP1410440A2 Layered dielectric nanoporous material and methods of producing same |
| 04/21/2004 | EP1410439A2 Semiconductive device and method of formation |
| 04/21/2004 | EP1410438A2 Cooling apparatus for electronic devices |
| 04/21/2004 | EP1410437A2 Cvd diamond enhanced microprocessor cooling system |
| 04/21/2004 | EP1410434A1 Method and apparatus for removing a carrier part from a carrier with a single operation, and a product removed from a carrier |
| 04/21/2004 | EP1410433A2 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
| 04/21/2004 | EP1410425A1 Topside active optical device apparatus and method |
| 04/21/2004 | EP1410403A1 Low temperature method and compositions for producing electrical conductors |
| 04/21/2004 | EP1410397A2 Nanotube films and articles |
| 04/21/2004 | EP1410083A1 Tooling fixture for packaged optical micro-mechanical devices |
| 04/21/2004 | EP1409941A1 Apparatus and method for controlling the temperature of an integrated circuit device |
| 04/21/2004 | EP1409156A2 Methods of nanotube films and articles |
| 04/21/2004 | EP1408863A1 Hermetic feedthrough for an implantable device |
| 04/21/2004 | EP1270668B1 Epoxy resin composition and electronic part |
| 04/21/2004 | EP1124882A4 PREPARATION OF CROSS-LINKED 2-DIMENSIONAL POLYMERS WITH SIDEDNESS FROM $g(a),$g(b)-LACTONES |
| 04/21/2004 | CN2613054Y Base plate structure of LED wafer |
| 04/21/2004 | CN2613050Y Simplified image sensor die set |
| 04/21/2004 | CN2613049Y Simplified image sensor die set |
| 04/21/2004 | CN2613047Y Stacking packaging assembly for integrated circuit |
| 04/21/2004 | CN2613046Y 芯片封装结构 Chip package structure |
| 04/21/2004 | CN2612984Y Computer radiator |
| 04/21/2004 | CN2612983Y Multivariate temperature controller for computer CPU |
| 04/21/2004 | CN1491467A Processing memory link with set of at least two laser pulses |
| 04/21/2004 | CN1491464A Semiconductor device having signal contacts and high current power contacts |
| 04/21/2004 | CN1491448A Circuit board device and its manufacturing mehtod |
| 04/21/2004 | CN1491442A Contact portion of semiconductor device and thin film transistor array panel for display device including the contact portion |