| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/27/2004 | US6728102 Electronic apparatus including a cooling unit for cooling a heat generating component |
| 04/27/2004 | US6728086 Power-rail electrostatic discharge protection circuit with a dual trigger design |
| 04/27/2004 | US6727777 Apparatus and method for angled coaxial to planar structure broadband transition |
| 04/27/2004 | US6727722 Process of testing a semiconductor wafer of IC dies |
| 04/27/2004 | US6727718 Electronic component package, printed circuit board, and method of inspecting the printed circuit board |
| 04/27/2004 | US6727597 Integrated circuit device having C4 and wire bond connections |
| 04/27/2004 | US6727596 Semiconductor integrated circuit |
| 04/27/2004 | US6727595 Semiconductor device, method of making the same, circuit board, and flexible substrate |
| 04/27/2004 | US6727594 Polybenzoxazine based wafer-level underfill material |
| 04/27/2004 | US6727593 Semiconductor device with improved bonding |
| 04/27/2004 | US6727592 Copper interconnect with improved barrier layer |
| 04/27/2004 | US6727590 Semiconductor device with internal bonding pad |
| 04/27/2004 | US6727588 Diffusion preventing barrier layer in integrated circuit inter-metal layer dielectrics |
| 04/27/2004 | US6727587 Connection device and method for producing the same |
| 04/27/2004 | US6727586 Semiconductor component |
| 04/27/2004 | US6727585 Power device with a plastic molded package and direct bonded substrate |
| 04/27/2004 | US6727584 Semiconductor module |
| 04/27/2004 | US6727583 Semiconductor device |
| 04/27/2004 | US6727582 Semiconductor device |
| 04/27/2004 | US6727581 Semiconductor module |
| 04/27/2004 | US6727580 Microelectronic spring contact elements |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6727577 Tape carrier package |
| 04/27/2004 | US6727576 Transfer wafer level packaging |
| 04/27/2004 | US6727575 Semiconductor device |
| 04/27/2004 | US6727574 Sealed plurality of chips stacked on surface of die pad with exposed surface; high speed, accuracy |
| 04/27/2004 | US6727572 Semiconductor device including high frequency circuit with inductor |
| 04/27/2004 | US6727559 Compound semiconductor device |
| 04/27/2004 | US6727556 Semiconductor device and a method of manufacturing thereof |
| 04/27/2004 | US6727552 Semiconductor device and method of manufacturing the same |
| 04/27/2004 | US6727515 Insulation film forming material, insulation film, method for forming the insulation film, and semiconductor device |
| 04/27/2004 | US6727458 Energy-efficient, laser-based method and system for processing target material |
| 04/27/2004 | US6727436 Interconnect bus crossover for MEMS |
| 04/27/2004 | US6727431 Optical module, circuit board and electronic device |
| 04/27/2004 | US6727422 Thermoelectricity; integrated circuits, electronics |
| 04/27/2004 | US6727195 Method and system for decreasing the spaces between wordlines |
| 04/27/2004 | US6727193 Apparatus and methods for enhancing thermal performance of integrated circuit packages |
| 04/27/2004 | US6727188 Etchant and method for fabricating a substrate for an electronic device using the same wherein the substrate includes a copper or copper alloy film |
| 04/27/2004 | US6727182 Process for the production of semiconductor device |
| 04/27/2004 | US6727176 Method of forming reliable Cu interconnects |
| 04/27/2004 | US6727170 Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof |
| 04/27/2004 | US6727169 Method of making conformal lining layers for damascene metallization |
| 04/27/2004 | US6727154 Methods for fabricating inductor for integrated circuit or integrated circuit package |
| 04/27/2004 | US6727139 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry |
| 04/27/2004 | US6727138 Process for fabricating an electronic component incorporating an inductive microcomponent |
| 04/27/2004 | US6727120 Wiring method in layout design of semiconductor integrated circuit, semiconductor integrated circuit and functional macro |
| 04/27/2004 | US6727119 Method of encapsulating a semiconductor device attached to a wiring substrate using sealing resin |
| 04/27/2004 | US6727118 Power distribution design method for stacked flip-chip packages |
| 04/27/2004 | US6727117 Semiconductor substrate having copper/diamond composite material and method of making same |
| 04/27/2004 | US6727116 Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods |
| 04/27/2004 | US6727115 Back-side through-hole interconnection of a die to a substrate |
| 04/27/2004 | US6727114 Semiconductor device and a method of manufacturing the same |
| 04/27/2004 | US6727042 Photosensitive resin composition |
| 04/27/2004 | US6727026 Semiconductor integrated circuit patterns |
| 04/27/2004 | US6726996 Useful as a dielectric capping layer for interconnect structures that include wiring regions that are surrounded by organic interlevel dielectrics, or porous dielectrics (including organic and inorganic) |
| 04/27/2004 | US6726954 Method and system for forming copper thin film |
| 04/27/2004 | US6726533 Automatic, masking |
| 04/27/2004 | US6726488 High-frequency wiring board |
| 04/27/2004 | US6726376 Optical fiber |
| 04/27/2004 | US6725909 Heat-dissipating device and method for fabricating the same |
| 04/27/2004 | US6725908 Cooling apparatus boiling and condensing refrigerant with effective performance in a tilted position |
| 04/27/2004 | US6725906 Heat dissipation device |
| 04/27/2004 | US6725682 Computer cooling apparatus |
| 04/22/2004 | WO2004034529A1 Light emitting element |
| 04/22/2004 | WO2004034472A1 Semiconductor chip package for image sensor and method of making the same |
| 04/22/2004 | WO2004034467A2 Sublithographic nanoscale memory architecture |
| 04/22/2004 | WO2004034466A2 Heat spreader |
| 04/22/2004 | WO2004034465A1 Semiconductor comprising an insulating layer and method for the production thereof |
| 04/22/2004 | WO2004034446A1 Exposure device, alignment method, and semiconductor device manufacturing method |
| 04/22/2004 | WO2004034432A2 Power mosfet |
| 04/22/2004 | WO2004034428A2 Semiconductor device package |
| 04/22/2004 | WO2004034427A2 Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials |
| 04/22/2004 | WO2004034422A2 Wafer coating and singulation method |
| 04/22/2004 | WO2004034240A2 A scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 04/22/2004 | WO2004034114A1 Package for optical module with compact ceramic inserts |
| 04/22/2004 | WO2003092174A3 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 04/22/2004 | WO2003085703A3 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof |
| 04/22/2004 | WO2003071596A3 Electronic component with an adhesive layer and method for the production thereof |
| 04/22/2004 | WO2003046983A8 Connection package for high-speed integrated circuit |
| 04/22/2004 | WO2003017365B1 Thermal transfer devices using heat pipes |
| 04/22/2004 | WO2002059398A3 Plating apparatus and method |
| 04/22/2004 | US20040077170 Method for burying resist and method for manufacturing semiconductor device |
| 04/22/2004 | US20040077161 Method of depositing a material layer |
| 04/22/2004 | US20040077141 Capacitor and fabrication method thereof |
| 04/22/2004 | US20040077139 Wafer scale fiber optic termination |
| 04/22/2004 | US20040077129 Semiconductor chip package with interconnect structure |
| 04/22/2004 | US20040077128 Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer |
| 04/22/2004 | US20040077127 Method for sealing a semiconductor device and apparatus embodying the method |
| 04/22/2004 | US20040077126 Method for sealing a semiconductor device and apparatus embodying the method |
| 04/22/2004 | US20040077124 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method |
| 04/22/2004 | US20040077117 Feedthrough design and method for a hermetically sealed microdevice |
| 04/22/2004 | US20040077109 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods |
| 04/22/2004 | US20040076797 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
| 04/22/2004 | US20040076408 Method and apparatus for removeably coupling a heat rejection device with a heat producing device |
| 04/22/2004 | US20040076056 Device and method for detecting alignment of deep trench capacitors and word lines in DRAM devices |
| 04/22/2004 | US20040075990 Packaging integrated circuits with adhesive posts |
| 04/22/2004 | US20040075987 Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices |
| 04/22/2004 | US20040075986 Electronic device |
| 04/22/2004 | US20040075985 Power component assembly for mechatronic integration of power components |
| 04/22/2004 | US20040075982 Heat sink frame with improved electromagnetic interference (EMI) suppression characteristics |