Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/12/2014CN103579162A Lead frame assembly, lead frame, and cutting method
02/12/2014CN103579161A 芯片封装结构 Chip package structure
02/12/2014CN103579160A Semiconductor substrate and method of fabricating the same
02/12/2014CN103579159A Package assembly and methods for forming the same
02/12/2014CN103579158A Eutectic bonding silicon metalized metal piece and metallization process thereof
02/12/2014CN103579157A 表面安装芯片 Surface mount chip
02/12/2014CN103579156A Bonding pad for thermocompression bonding, process for producing a bonding pad and component
02/12/2014CN103579155A Method for producing a bonding pad for thermocompression bonding, and bonding pad
02/12/2014CN103579154A Electric device package comprising a laminate and method of making an electric device package comprising a laminate
02/12/2014CN103579153A Chip card module
02/12/2014CN103579152A Bump on pad (bop) bonding structure
02/12/2014CN103579151A Fine pitch package-on-package structure
02/12/2014CN103579150A Solder bump for ball grid array
02/12/2014CN103579149A Semiconductor structure and manufacturing process thereof
02/12/2014CN103579148A Light-emitting diode structure and method for manufacturing the same
02/12/2014CN103579147A Equipotential electrode for converter valve
02/12/2014CN103579146A 半导体装置 Semiconductor device
02/12/2014CN103579145A Through-silicon via interposer, method for manufacturing through-silicon via interposer, packaging substrate and method for manufacturing packaging substrate
02/12/2014CN103579144A Module flow balancing water channel used for direct current converter valve
02/12/2014CN103579143A Flat type power device packaging structure based on internal cooling heat dissipation
02/12/2014CN103579142A Semiconductor module arrangement and method for producing and operating semiconductor module arrangement
02/12/2014CN103579141A Composite heat dissipation structure and application thereof
02/12/2014CN103579140A Heat radiation component and method for manufacturing heat radiation component
02/12/2014CN103579139A Method for limiting the variation in temperature of electrical component
02/12/2014CN103579138A 半导体单元 Semiconductor unit
02/12/2014CN103579137A Reliable surface mount integrated power module
02/12/2014CN103579136A Diffusion barrier for surface-mount modules
02/12/2014CN103579135A Semiconductor package, manufacturing method thereof, and semiconductor package manufacturing mold
02/12/2014CN103579134A Semiconductor package and method of fabricating the same
02/12/2014CN103579133A Resin sheet for sealing electronic component, resin-sealed type semiconductor device and method for producing resin-sealed type semiconductor device
02/12/2014CN103579132A Semiconductor device and manufacturing method of same
02/12/2014CN103579131A Curvature-free substrate used for power IGBT module encapsulation
02/12/2014CN103579130A Semiconductor device and method for manufacturing semiconductor device
02/12/2014CN103579129A Semiconductor component support and semiconductor device
02/12/2014CN103579128A Chip packaging substrate, chip packaging structure and manufacturing method of chip packaging structure
02/12/2014CN103579127A Silicon wafer bonding method
02/12/2014CN103579099A Semiconductor device having multi-bump electrical interconnections and method for fabricating the same
02/12/2014CN103579098A Method for reducing wettability of interconnect material at corner interface and device incorporating same
02/12/2014CN103579097A Method for forming interconnect structure and interconnect structure
02/12/2014CN103579096A Semiconductor devices and methods of manufacture thereof
02/12/2014CN103579093A Method for forming interlayer connectors in a three-dimensional stacked ic device
02/12/2014CN103579092A Semiconductor device and method for fabricating the same
02/12/2014CN103579091A Cross-coupling based design using diffusion contact structures
02/12/2014CN103579089A 半导体结构及其形成方法 And a method for forming a semiconductor structure
02/12/2014CN103579081A Fan-out type semiconductor device with chip dimension substrate and preparation method
02/12/2014CN103579039A Method for controlling electrical property of passive device and integrated component
02/12/2014CN103579030A Novel chip encapsulation method and chip encapsulation structure
02/12/2014CN103579029A Package structure and the method of making same
02/12/2014CN103579027A Repairing anomalous stiff pillar bumps
02/12/2014CN103579026A Field emission devices and method of making same
02/12/2014CN103579025A Making method of ubtegrated circuit flip chip assembly and the assembly prepared by the method
02/12/2014CN103579022A Structure and method of fabricating a semiconductor package
02/12/2014CN103579016A Large current silicone carbide SBD / JBS power chip structure and manufacturing method thereof
02/12/2014CN103579015A Semiconductor package and method for forming the same
02/12/2014CN103579014A Method of manufacturing electronic device, electronic device, electronic apparatus, and mobile object
02/12/2014CN103579011A Package carrier and manufacturing method thereof
02/12/2014CN103579009A Package substrate, manufacturing method of the package substrate, chip packaging structure and manufacturing method of the chip packaging body
02/12/2014CN103579008A Pad structure and preparation method thereof
02/12/2014CN103578968A Structure of comprehensive type silicon epitaxy process photoetching alignment mark and manufacturing method
02/12/2014CN103578963A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/12/2014CN103578924A Semiconductor structure for antenna switchover circuit and technique thereof
02/12/2014CN103578703A Chip device, multi-layered chip device and method of producing same
02/12/2014CN103578667A Series water-cooled radiator based on damping resistors
02/12/2014CN103575140A Compact type aluminum heat exchanger with welding pipe for power electronic equipment and battery cooling
02/12/2014CN102620590B Micro-channel heat sink and performance testing device thereof
02/12/2014CN102468278B Multi-chip stacking and packaging structure
02/12/2014CN102347300B Chip package and fabricating method thereof
02/12/2014CN102347277B Semiconductor device structure and manufacturing method thereof
02/12/2014CN102325724B Powder, method for producing same, and resin composition containing same
02/12/2014CN102222643B Method for filling redundant metal in manufacturing process of integrated circuit and semiconductor device
02/12/2014CN102176428B Strengthened base plate and manufacturing method thereof
02/12/2014CN102171817B Power semiconductor device adaptive cooling assembly
02/12/2014CN102131366B Heat dissipating device and system
02/12/2014CN102097920B Absorption circuit for high-power power electronic power device
02/12/2014CN102044549B Solid state image capture device and method for manufacturing same
02/12/2014CN101965635B Method for integrating selective ruthenium deposition into manufacturing of semiconductior device
02/12/2014CN101964313B Packaging structure and packaging method
02/12/2014CN101710587B 有机发光显示器 The organic light emitting display
02/12/2014CN101615605B 半导体集成电路 The semiconductor integrated circuit
02/12/2014CN101577277B 半导体装置 Semiconductor device
02/12/2014CN101452925B 半导体器件 Semiconductor devices
02/11/2014US8649841 Analyte monitoring device and methods of use
02/11/2014US8648479 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same
02/11/2014US8648478 Flexible heat sink having ventilation ports and semiconductor package including the same
02/11/2014US8648477 Semiconductor chip, film substrate, and related semiconductor chip package
02/11/2014US8648476 Dicing tape-integrated wafer back surface protective film
02/11/2014US8648475 Low noise flip-chip packages and flip chips thereof
02/11/2014US8648474 Lead frame land grid array
02/11/2014US8648473 Chip arrangement and a method for forming a chip arrangement
02/11/2014US8648472 Semiconductor device
02/11/2014US8648471 Nonvolatile semiconductor memory device including a via-hole with a narrowing cross-section and method of manufacturing the same
02/11/2014US8648470 Semiconductor device and method of forming FO-WLCSP with multiple encapsulants
02/11/2014US8648469 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
02/11/2014US8648468 Hermetic wafer level packaging
02/11/2014US8648467 Semiconductor memory device and method of manufacturing the same
02/11/2014US8648466 Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad
02/11/2014US8648465 Semiconductor interconnect structure having enhanced performance and reliability
02/11/2014US8648464 Semiconductor device and manufacturing method thereof
02/11/2014US8648463 Assembly of multi-chip modules with proximity connectors using reflowable features
02/11/2014US8648462 Semiconductor power module
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