| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/29/2004 | US20040080049 Adhesion metal layer overcoating electrode pad of semiconductor; heat diffusion barrier; accuracy ; prevent wetting, spreading of solder |
| 04/29/2004 | US20040080046 Semiconductor package having multi-layer leadframe and method of fabrication |
| 04/29/2004 | US20040080045 Semiconductor device and chip-stack semiconductor device |
| 04/29/2004 | US20040080044 Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 04/29/2004 | US20040080043 Semiconductor device with reinforced under-support structure and method of fabricating the same |
| 04/29/2004 | US20040080042 Heat transfer of solid state devices |
| 04/29/2004 | US20040080041 Semiconductor device with improved heatsink structure |
| 04/29/2004 | US20040080040 Semiconductor device and chip-stack semiconductor device |
| 04/29/2004 | US20040080039 Coplanar line, and a module using the coplanar line |
| 04/29/2004 | US20040080037 Image sensor device |
| 04/29/2004 | US20040080036 System in package structure |
| 04/29/2004 | US20040080034 Area array semiconductor device and electronic circuit board utilizing the same |
| 04/29/2004 | US20040080033 Flip chip assembly and method for producing the same |
| 04/29/2004 | US20040080031 Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same |
| 04/29/2004 | US20040080030 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
| 04/29/2004 | US20040080028 Semiconductor device with semiconductor chip mounted in package |
| 04/29/2004 | US20040080027 Thick solder mask for confining encapsulant material over selected location of a substrate and assemblies including the solder mask |
| 04/29/2004 | US20040080026 Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
| 04/29/2004 | US20040080025 Die pads with wire bonding on edges; exterior terminals supported by adhesive tape |
| 04/29/2004 | US20040080024 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps |
| 04/29/2004 | US20040080022 Semiconductor device |
| 04/29/2004 | US20040080013 Chip-stack semiconductor device and manufacturing method of the same |
| 04/29/2004 | US20040080012 Nonvolatile memory device having asymmetric source/drain region and fabricating method thereof |
| 04/29/2004 | US20040080006 Image sensor having concave-shaped micro-lenses |
| 04/29/2004 | US20040080002 Boron incorporated diffusion barrier material |
| 04/29/2004 | US20040079970 NAND flash memory |
| 04/29/2004 | US20040079966 Chip structure and process for forming the same |
| 04/29/2004 | US20040079862 Two part mold for wafer scale caps |
| 04/29/2004 | US20040079520 Edge-mounted heat dissipation device having top-and-bottom fan structure |
| 04/29/2004 | US20040079519 Mechanical highly compliant thermal interface pad |
| 04/29/2004 | US20040079194 Variations in melting points of metals; controlled heating, cooling, solidification; electroconductive adhesive, soldering paste |
| 04/29/2004 | US20040079193 Overcoating metal particles with high electroconductive paste; high density integrated circuits |
| 04/29/2004 | US20040079101 Multi-load thermal regulating system having electronic valve control |
| 04/29/2004 | US20040079100 Field replaceable packaged refrigeration module with capillary pumped loop for cooling electronic components |
| 04/29/2004 | US20040078957 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 04/29/2004 | DE10247610A1 Elektronisches Bauelement mit einem Systemträger Electronic component with a carrier system |
| 04/29/2004 | DE10240176A1 Ein dielektrischer Schichtstapel mit kleiner Dielektrizitätskonstante einschliesslich einer Ätzindikatorschicht zur Anwendung in der dualen Damaszenertechnik A dielectric layer stack having a low dielectric constant including a Ätzindikatorschicht for use in the dual damascene technique |
| 04/29/2004 | DE10059773B4 Halbleitervorrichtung Semiconductor device |
| 04/28/2004 | WO2004037880A1 Solid silane coupling agent composition, process for producing the same, and resin composition containing the same |
| 04/28/2004 | EP1414281A1 Circuit module |
| 04/28/2004 | EP1414279A2 High-frequency module and communication apparatus |
| 04/28/2004 | EP1414118A1 Contact for spiral contactor and spiral contactor |
| 04/28/2004 | EP1414071A2 Method for forming an image sensor having concave-shaped micro-lenses |
| 04/28/2004 | EP1414070A2 Image sensor having concave-shaped micro-lenses |
| 04/28/2004 | EP1414066A1 Circuit and method for monitoring semiconductor power elements |
| 04/28/2004 | EP1414065A2 Configuration of power devices enabeling the mechatronic integration of power devices |
| 04/28/2004 | EP1414064A1 Semiconductor device and package for housing semiconductor chip made of a metal-diamond composite |
| 04/28/2004 | EP1414063A2 Thermal interface pad utilizing low melting metal with retention matrix |
| 04/28/2004 | EP1414050A1 Method for producing nanocomposite magnet using atomizing method |
| 04/28/2004 | EP1413944A2 Electronic apparatus with liquid cooling of a heat-generating component |
| 04/28/2004 | EP1413924A1 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 04/28/2004 | EP1412983A2 Electronic device and relative fabrication method |
| 04/28/2004 | EP1412982A2 Emi shielding for electronic packages |
| 04/28/2004 | EP1412981A1 Optically and electrically programmable silicided polysilicon fuse device |
| 04/28/2004 | EP1412980A1 Electronic assembly including a die having an integrated circuit and a layer of diamond and methods of producing the same |
| 04/28/2004 | EP1412979A2 Heatsink assembly and method of manufacturing the same |
| 04/28/2004 | EP1412978A2 Electronic component with a plastic housing and method for production thereof |
| 04/28/2004 | EP1412976A2 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices |
| 04/28/2004 | EP1412975A1 Testing vias and contacts in integrated circuit fabrication |
| 04/28/2004 | EP1412974A2 Method for hermetically encapsulating a component |
| 04/28/2004 | EP1412550A2 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |
| 04/28/2004 | EP1412283A2 Devices having substrates with openings passing through the substrates and conductors in the openings, and methods of manufacture |
| 04/28/2004 | EP1412175A1 Insulating and functionalizing fine metal-containing particles with comformal ultra-thin films |
| 04/28/2004 | EP0809860B1 Process for producing a LAYERED STRUCTURE WITH A SILICIDE LAYER |
| 04/28/2004 | EP0741910B1 Cavity-containing structure and method for making same |
| 04/28/2004 | CN2613886Y Structure improved radiation fin |
| 04/28/2004 | CN2613885Y Heat sink |
| 04/28/2004 | CN2613884Y Radiator with riveted structure |
| 04/28/2004 | CN2613811Y Heat sink block |
| 04/28/2004 | CN1493180A Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery |
| 04/28/2004 | CN1493093A Coupling device using buried capacitors in multiple layered substrate |
| 04/28/2004 | CN1493088A IC package pressure release apparatus and method |
| 04/28/2004 | CN1493087A Method for eliminating reaction between photoresist and organosilicate glass (OSG) |
| 04/28/2004 | CN1493059A Memory card and its manufacturing method |
| 04/28/2004 | CN1492799A Injection molded heat dissipation device |
| 04/28/2004 | CN1492505A Static discharge protective circuit |
| 04/28/2004 | CN1492504A Electronic device and its producing method |
| 04/28/2004 | CN1492503A Semiconductor package and its producing method |
| 04/28/2004 | CN1492502A Radiator combination |
| 04/28/2004 | CN1492501A Combination method of radiator |
| 04/28/2004 | CN1492500A Radiator and its producing method |
| 04/28/2004 | CN1492499A Radiator and its producing method |
| 04/28/2004 | CN1492498A 半导体器件 Semiconductor devices |
| 04/28/2004 | CN1492483A Method for producing self assembling microstructure |
| 04/28/2004 | CN1492298A Heat pipe type radiator and its producing method |
| 04/28/2004 | CN1491761A Method for preparing Kovar alloy electronic package box |
| 04/28/2004 | CN1147932C Semiconductor memory |
| 04/28/2004 | CN1147931C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/28/2004 | CN1147930C Semi-conductor package structure and mfg. method thereof |
| 04/28/2004 | CN1147929C Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same |
| 04/28/2004 | CN1147928C Method for forming semiconductor device having sub-chip-scale package structure |
| 04/28/2004 | CN1147621C Figure forming method |
| 04/28/2004 | CN1147555C Double side coated pressure sensitive adhesive sheet and its application |
| 04/27/2004 | US6728943 Semiconductor circuit extraction apparatus and method |
| 04/27/2004 | US6728904 Electronic circuit package |
| 04/27/2004 | US6728126 Programming methods for an amorphous carbon metal-to-metal antifuse |
| 04/27/2004 | US6728113 Method and apparatus for non-conductively interconnecting integrated circuits |
| 04/27/2004 | US6728107 Mounting assembly for heat sink |
| 04/27/2004 | US6728106 Heat dissipation structure of integrated circuit (IC) |
| 04/27/2004 | US6728103 Heat sink with a cutout |