| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/04/2004 | US6730571 Method to form a cross network of air gaps within IMD layer |
| 05/04/2004 | US6730563 Method of manufacturing semiconductor device |
| 05/04/2004 | US6730544 Stackable semiconductor package and method for manufacturing same |
| 05/04/2004 | US6730542 Polybenzoxazine based wafer-level underfill material |
| 05/04/2004 | US6730541 Wafer-scale assembly of chip-size packages |
| 05/04/2004 | US6730540 Clock distribution networks and conductive lines in semiconductor integrated circuits |
| 05/04/2004 | US6730539 Method of manufacturing semiconductor device package |
| 05/04/2004 | US6730536 Pre-drilled image sensor package fabrication method |
| 05/04/2004 | US6730533 Plastic packaging of LED arrays |
| 05/04/2004 | US6730532 Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process |
| 05/04/2004 | US6730529 Method for chip testing |
| 05/04/2004 | US6730528 Mask set for measuring an overlapping error and method of measuring an overlapping error using the same |
| 05/04/2004 | US6730526 Multi-chip module system and method of fabrication |
| 05/04/2004 | US6730402 Mixture of epoxy resin, phenolic resin curing agents and metal hydroxide |
| 05/04/2004 | US6730245 Slurry includes abrasive particles have a small particle size, narrow size distribution and a spherical morphology, and the particles are substantially unagglomerated, selected from silica, alumina, zirconia, ceria etc. and mixture |
| 05/04/2004 | US6729907 Plug-in connector for an electrical device |
| 05/04/2004 | US6729896 Electrical connector with distortion-resistant cover |
| 05/04/2004 | US6729389 Heat transfer apparatus with zigzag passage |
| 05/04/2004 | US6729385 Fin structure and the assembly thereof |
| 05/04/2004 | US6729384 Cooling fin assembly |
| 05/04/2004 | US6729383 Fluid-cooled heat sink with turbulence-enhancing support pins |
| 05/04/2004 | US6729025 Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 05/04/2004 | CA2305894C Electronic device structure capable of preventing malfunction caused by electromagnetic waves coming from the outside |
| 04/29/2004 | WO2004036745A1 Frequency-independent voltage divider |
| 04/29/2004 | WO2004036654A2 Integrated circuit package configuration incorporating shielded circuit element |
| 04/29/2004 | WO2004036649A1 Attack protected chip |
| 04/29/2004 | WO2004036648A2 Method of manufacturing a data carrier |
| 04/29/2004 | WO2004036647A1 Method for cutting lead terminal of package type electronic component |
| 04/29/2004 | WO2004036646A1 Support device for monolithically integrated circuits |
| 04/29/2004 | WO2004036645A2 Conformal heat spreader |
| 04/29/2004 | WO2004036644A1 Flat plate heat transferring apparatus and manufacturing method thereof |
| 04/29/2004 | WO2004036643A2 Device |
| 04/29/2004 | WO2004036620A2 Method for generating oxide layers on semiconductor substrates |
| 04/29/2004 | WO2004036311A2 Anti-reflective compositions comprising triazine compounds |
| 04/29/2004 | WO2004036136A1 Control of electrolysis gases in electroosmotic pump systems |
| 04/29/2004 | WO2004025734A9 Interconnection architecture and method of assessing interconnection architecture |
| 04/29/2004 | WO2004015773A3 Semiconductor wafer having electrically connected contact and testing surfaces |
| 04/29/2004 | WO2004015150A3 Discontinuous carbon fiber reinforced metal matrix composite |
| 04/29/2004 | WO2004007608A3 Self-healing polymer compositions |
| 04/29/2004 | WO2004003965A3 Mems capping method and apparatus |
| 04/29/2004 | WO2003090279A8 Semiconductor component comprising an integrated latticed capacitance structure |
| 04/29/2004 | WO2003083956A9 Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package |
| 04/29/2004 | WO2003068825A3 Multifunctional monomers and their use in making cross-linked polymers and porous films |
| 04/29/2004 | WO2003054959A3 Circuit arrangement comprising electronic components on a nonconducting supporting substrate |
| 04/29/2004 | WO2003034486A3 Thin metal package and manufacturing method thereof |
| 04/29/2004 | WO2002103792A3 Method of manufacturing a semiconductor device and semiconductor device |
| 04/29/2004 | US20040083438 Method, program, and apparatus for designing a semiconductor device |
| 04/29/2004 | US20040082196 Semiconductor device and method of manufacturing same |
| 04/29/2004 | US20040082189 Multi-layer circuit board and method of manufacturing the same |
| 04/29/2004 | US20040082188 Electronic assembly with high capacity thermal interface and methods of manufacture |
| 04/29/2004 | US20040082184 Polysilicon etching method |
| 04/29/2004 | US20040082174 Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad |
| 04/29/2004 | US20040082169 Deposition of barrier metal in damascene interconnects using metal carbonyl |
| 04/29/2004 | US20040082165 Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate |
| 04/29/2004 | US20040082161 Process of forming bonding columns |
| 04/29/2004 | US20040082160 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes |
| 04/29/2004 | US20040082159 Fabrication method for solder bump pattern of rear section wafer package |
| 04/29/2004 | US20040082156 Boron incorporated diffusion barrier material |
| 04/29/2004 | US20040082128 Method for manufacturing a memory device |
| 04/29/2004 | US20040082119 Molded wafer scale cap array |
| 04/29/2004 | US20040082115 Mold making method for wafer scale caps |
| 04/29/2004 | US20040082114 Fabrication method of window-type ball grid array semiconductor package |
| 04/29/2004 | US20040082110 Molded wafer scale cap |
| 04/29/2004 | US20040082109 Semiconductor package, and production process for manufacturing such semiconductor such semiconductor package |
| 04/29/2004 | US20040082108 Method of making an electronic package |
| 04/29/2004 | US20040082106 Method for manufacturing a wafer level chip scale package |
| 04/29/2004 | US20040082105 Wafer scale caps located by molding |
| 04/29/2004 | US20040082104 Chip with molded cap array |
| 04/29/2004 | US20040082103 Semiconductor package with marking film and manufacturing method thereof |
| 04/29/2004 | US20040082102 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof |
| 04/29/2004 | US20040082101 Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin |
| 04/29/2004 | US20040082100 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 04/29/2004 | US20040082096 Method for forming an image sensor having concave-shaped micro-lenses |
| 04/29/2004 | US20040082087 Device and method for detecting alignment of active areas and memory cell structures in dram devices |
| 04/29/2004 | US20040082085 Method for aligning and exposing a semiconductor wafer |
| 04/29/2004 | US20040081843 For electronic component, such as integrated circuit chips, that is stable at higher operating temperatures of 125 degrees C. or more. |
| 04/29/2004 | US20040081803 Thermal interface wafer and method of making and using the same |
| 04/29/2004 | US20040081410 Small form factor transceiver with externally modulated laser |
| 04/29/2004 | US20040080921 Printed circuit board assembly employing a press fit electrical connector |
| 04/29/2004 | US20040080917 Integrated microwave package and the process for making the same |
| 04/29/2004 | US20040080915 Thermal-conductive substrate package |
| 04/29/2004 | US20040080914 Electronic assemblies with high capacity heat sinks |
| 04/29/2004 | US20040080913 Method of cooling semiconductor die using microchannel thermosyphon |
| 04/29/2004 | US20040080912 Evaporator with air cooling backup |
| 04/29/2004 | US20040080911 Heat sink assembly with embedded fan |
| 04/29/2004 | US20040080910 Heat dissipating device |
| 04/29/2004 | US20040080909 Cooling apparatus having an electronic fan for cooling an electronic apparatus |
| 04/29/2004 | US20040080883 Compensated-well electrostatic discharge protection devices |
| 04/29/2004 | US20040080838 Cooling opto-electronic packages |
| 04/29/2004 | US20040080810 Power management for spatial power combiners |
| 04/29/2004 | US20040080688 Accuracy connecting terminals; covering with reflective film; multilayer device |
| 04/29/2004 | US20040080642 Camera module |
| 04/29/2004 | US20040080566 Inkjet device encapsulated at the wafer scale |
| 04/29/2004 | US20040080386 Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device |
| 04/29/2004 | US20040080378 High-frequency module and communication apparatus |
| 04/29/2004 | US20040080256 Composite oxide; fine particle size; generating aerosols, heating to remove liquid, coating surfaces |
| 04/29/2004 | US20040080056 Die connecting packages; flattening electroconductive sphere connecting to die contactors; tracers or wires running under die |
| 04/29/2004 | US20040080054 Writing determination pattern in dielectric substrate; connecting terminals covering apertures; electroplating of metals |
| 04/29/2004 | US20040080053 Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 04/29/2004 | US20040080052 Circuit substrate and fabrication method thereof |